METHOD FOR FORMING WIRING AND ELECTRODE USING METAL NANO PASTE
    1.
    发明申请
    METHOD FOR FORMING WIRING AND ELECTRODE USING METAL NANO PASTE 审中-公开
    使用金属NANO PASTE形成接线和电极的方法

    公开(公告)号:US20120171366A1

    公开(公告)日:2012-07-05

    申请号:US13338867

    申请日:2011-12-28

    IPC分类号: B05D5/12 B05D3/02

    摘要: Disclosed herein is a method for forming a metal wiring and an electrode using a metal nano paste, including a sintering process, wherein the sintering includes: placing a substrate on which a metal nano paste is printed in a furnace and raising a temperature of the furnace to 220 to 240° C. under a nitrogen atmosphere; heating the substrate under a mixed atmosphere of carboxylic acid and air while the temperature of the furnace is maintained at the temperature range;dropping the temperature of the furnace to 100 to 150° C. under the mixed atmosphere of carboxylic acid and air; and dropping the temperature of the furnace to room temperature under a nitrogen atmosphere. According to the present invention, a metal film having high density and a minimized amount of residual metal particles can be formed despite a low-temperature sintering process, like a case where a high-temperature sintering process is employed.

    摘要翻译: 本文公开了一种使用包括烧结工艺的金属纳米糊形成金属布线和电极的方法,其中烧结包括:将其上印有金属纳米糊的基底放置在炉中并升高炉的温度 至220-240℃; 在羧酸和空气的混合气氛下加热基材,同时炉的温度保持在温度范围; 在羧酸和空气的混合气氛下,将炉子的温度降至100至150℃; 并在氮气氛下将炉温降至室温。 根据本发明,即使采用高温烧结工艺,也可以形成具有高密度和最小量的残留金属颗粒的金属膜,尽管采用低温烧结工艺。

    CONDUCTIVE PASTE COMPOSITION FOR LOW TEMPERATURE FIRING
    3.
    发明申请
    CONDUCTIVE PASTE COMPOSITION FOR LOW TEMPERATURE FIRING 审中-公开
    低温燃烧用导电胶组合物

    公开(公告)号:US20130069014A1

    公开(公告)日:2013-03-21

    申请号:US13333801

    申请日:2011-12-21

    IPC分类号: H01B1/22 B82Y99/00

    CPC分类号: H01B1/22 B82Y30/00

    摘要: Disclosed is a conductive paste composition for low temperature firing, including conductive copper powder composed of flake powder, spherical powder and nano powder, a melamine-based binder, and an organic solvent, thus enabling the formation of a conductive wire having a high aspect ratio with high printability, and inexpensive formation of a metal wire, and exhibiting superior electrical properties and adhesive force even when conducting low temperature firing at 200° C. or less, so that the conductive paste composition can be usefully applied as a conductive material for forming electrodes of a variety of products such as solar cells, touch panels, printed circuit boards (PCBs), radio-frequency identification (RFID), plasma display panels (PDPs) and so on.

    摘要翻译: 公开了一种用于低温烧制的导电糊组合物,包括由片状粉末,球形粉末和纳米粉末组成的导电铜粉末,三聚氰胺基粘合剂和有机溶剂,从而能够形成具有高纵横比的导线 具有高可印刷性,并且廉价地形成金属线,并且即使在200℃或更低温度下进行低温烧制,也表现出优异的电性能和粘合力,使得导电糊组合物可有效地用作形成用导电材料 各种产品的电极,如太阳能电池,触摸屏,印刷电路板(PCB),射频识别(RFID),等离子体显示面板(PDP)等。

    POWER SUPPLY
    7.
    发明申请
    POWER SUPPLY 有权
    电源

    公开(公告)号:US20130271020A1

    公开(公告)日:2013-10-17

    申请号:US13976610

    申请日:2011-10-11

    申请人: Sung Eun Kim

    发明人: Sung Eun Kim

    IPC分类号: H05B37/02

    CPC分类号: H05B37/02 H05B33/0815

    摘要: A power supply is provided. The power supply includes a plurality of light emission units, a power source, a plurality of boards, a plurality of board resistors, and a feedback control unit. The light emission units are connected in parallel, and include a plurality of LEDs. The power source supplies a DC voltage to the light emission units. The boards have at least one light emission mounted thereon. The board resistors are disposed in each of the boards, and electrically connected to each other. The feedback control unit varies a current supplied from the power source, according to sum of the board resistors which are changed according to the number of connected boards.

    摘要翻译: 提供电源。 电源包括多个发光单元,电源,多个板,多个板电阻和反馈控制单元。 发光单元并联连接,并且包括多个LED。 电源为发光单元提供直流电压。 板上安装有至少一个发光体。 板电阻器设置在每个板中,并彼此电连接。 反馈控制单元根据根据连接的板的数量而改变的板电阻器的总和,改变从电源提供的电流。

    Carrier and manufacturing apparatus having the same
    10.
    发明授权
    Carrier and manufacturing apparatus having the same 有权
    具有相同的载体和制造装置

    公开(公告)号:US08267253B2

    公开(公告)日:2012-09-18

    申请号:US11476362

    申请日:2006-06-27

    IPC分类号: B65D85/00

    CPC分类号: C23C14/50 C23C14/56

    摘要: A carrier having a plurality of support bars for safely transferring a substrate is provided. The carrier includes a frame having a through-hole formed at a center, the center through-hole including a first inner surface and a second inner surface that faces the first inner surface within in the through-hole; and a plurality of support bars joined to the first inner surface and the second inner surface.

    摘要翻译: 提供了具有用于安全地转移基板的多个支撑杆的载体。 载体包括具有形成在中心的通孔的框架,所述中心通孔包括在所述通孔内面向所述第一内表面的第一内表面和第二内表面; 以及连接到第一内表面和第二内表面的多个支撑杆。