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1.发明授权公开(公告)号：US06391993B1
公开(公告)日：2002-05-21
申请号：US09446492
申请日：2000-02-01
申请人： Shabbir Attarwala , Gina M. Mazzella , Hsien-Kun Chu , Dzu D. Luong , Lester D. Bennington , Mark M. Konarski , Eerik Maandi , Richard D. Rich , Natalie R. Li , Frederick F. Newberth, III , Susan L. Levandoski
发明人： Shabbir Attarwala , Gina M. Mazzella , Hsien-Kun Chu , Dzu D. Luong , Lester D. Bennington , Mark M. Konarski , Eerik Maandi , Richard D. Rich , Natalie R. Li , Frederick F. Newberth, III , Susan L. Levandoski
IPC分类号： C08F2606
CPC分类号： C09J4/00 , C08F290/148 , C08G77/20 , C09J4/06 , C08F222/1006
摘要： The present invention provides anaerobic adhesive compositions, reaction products of which demonstrate controlled-strength at ambient temperature conditions and enhanced resistance to thermal degradation at elevated temperature conditions. The compositions are (meth)acrylate- and/or polyorganosiloxane-based and may include one or more of a variety of other components, such as certain coreactants, a maleimide component, a diluent component reactive at elevated temperature conditions, mono- or poly-hydroxyalkane components, and other components.
摘要翻译： 本发明提供厌氧粘合剂组合物，其反应产物在环境温度条件下表现出控制强度，并且在升高的温度条件下具有增强的耐热降解性。 组合物是（甲基）丙烯酸酯和/或聚有机硅氧烷，并且可以包括多种其它组分中的一种或多种，例如某些共反应物，马来酰亚胺组分，在高温条件下反应的稀释剂组分，单 - 或多 - 羟基烷烃组分和其他组分。
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2.发明授权Ultrafast heat/room temperature adhesive composition for bonding applications 有权用于粘结应用的超快热/室温粘合剂组合物公开(公告)号：US08921490B2
公开(公告)日：2014-12-30
申请号：US12495139
申请日：2009-06-30
IPC分类号： C08L53/02 , C09J153/02 , C08K5/50 , C09J4/06 , C08K5/00 , C08F220/06 , C08F220/14 , C08F220/18 , C08F222/10
CPC分类号： C09J4/06 , C08F220/06 , C08F220/14 , C08F220/18 , C08F2222/1013 , C08F2222/1026 , C08K5/0041 , C08K5/005 , C08K5/50 , C09J153/02 , C08F285/00
摘要： The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
摘要翻译： 本发明涉及能够安全且充分地粘结电气元件部件的可固化组合物。 特别地，本发明涉及能够在室温下和高温下快速固化的两部分无卤素可固化组合物。
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3.发明申请ULTRAFAST HEAT/ROOM TEMPERATURE ADHESIVE COMPOSITION FOR BONDING APPLICATIONS 有权ULTRAFAST HEAT / ROOM温度粘合剂用于粘结应用公开(公告)号：US20100331462A1
公开(公告)日：2010-12-30
申请号：US12495139
申请日：2009-06-30
IPC分类号： C08K5/5333 , C08L53/02 , C08K5/13 , C08K5/50
CPC分类号： C09J4/06 , C08F220/06 , C08F220/14 , C08F220/18 , C08F2222/1013 , C08F2222/1026 , C08K5/0041 , C08K5/005 , C08K5/50 , C09J153/02 , C08F285/00
摘要： The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
摘要翻译： 本发明涉及能够安全且充分地粘结电气元件部件的可固化组合物。 特别地，本发明涉及能够在室温下和高温下快速固化的两部分无卤素可固化组合物。
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公开(公告)号：US20140220243A1
公开(公告)日：2014-08-07
申请号：US14170829
申请日：2014-02-03
申请人： Susan L. Levandoski , Timothy P. Walsh , Sam Bail
发明人： Susan L. Levandoski , Timothy P. Walsh , Sam Bail
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C08K3/04 , C08L2203/20 , C09J11/04 , C09J133/08
摘要： The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to electrically conductive, curable compositions, which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
摘要翻译： 本发明涉及能够安全且充分地粘结电气元件部件的可固化组合物。 特别地，本发明涉及导电的可固化组合物，其能够在室温下以及在升高的温度下快速固化。
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公开(公告)号：US09493682B2
公开(公告)日：2016-11-15
申请号：US14170829
申请日：2014-02-03
申请人： Susan L. Levandoski , Timothy P. Walsh , Sam Bail
发明人： Susan L. Levandoski , Timothy P. Walsh , Sam Bail
IPC分类号： C09J9/02 , C09J133/08 , C09J11/04 , C08K3/04
CPC分类号： C09J9/02 , C08K3/04 , C08L2203/20 , C09J11/04 , C09J133/08
摘要： The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to electrically conductive, curable compositions, which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
摘要翻译： 本发明涉及能够安全且充分地粘结电气元件部件的可固化组合物。 特别地，本发明涉及导电的可固化组合物，其能够在室温下以及在升高的温度下快速固化。
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