公开(公告)号：US09997384B2

公开(公告)日：2018-06-12

申请号：US13309283

申请日：2011-12-01

申请人： Shao-Yen Ku ,  Ming-Jung Chen ,  Tzu Yang Chung ,  Chi-Yun Tseng ,  Rui-Ping Chuang

发明人： Shao-Yen Ku ,  Ming-Jung Chen ,  Tzu Yang Chung ,  Chi-Yun Tseng ,  Rui-Ping Chuang

IPC分类号： H01L21/67

CPC分类号： H01L21/67201

摘要： An apparatus comprises a process chamber, and a loadlock connected to the process chamber. The loadlock is configured to have a wafer holder disposed therein. The wafer holder is configured to store a plurality of wafers, and is configured to transport the plurality of wafers away from the loadlock.

公开(公告)号：US20130142594A1

公开(公告)日：2013-06-06

申请号：US13309283

申请日：2011-12-01

申请人： Shao-Yen Ku ,  Ming-Jung Chen ,  Tsu-Yang Chung ,  Chi-Yun Tseng ,  Jui-Ping Chuang

发明人： Shao-Yen Ku ,  Ming-Jung Chen ,  Tsu-Yang Chung ,  Chi-Yun Tseng ,  Jui-Ping Chuang

IPC分类号： H01L21/677

CPC分类号： H01L21/67201

摘要： An apparatus comprises a process chamber, and a loadlock connected to the process chamber. The loadlock is configured to have a wafer holder disposed therein. The wafer holder is configured to store a plurality of wafers, and is configured to transport the plurality of wafers away from the loadlock.

摘要翻译： 一种装置包括处理室和连接到处理室的负载锁。 负载锁被配置为具有设置在其中的晶片保持架。 晶片保持器被配置为存储多个晶片，并且被配置为将多个晶片远离装载锁传送。

公开(公告)号：US20130109140A1

公开(公告)日：2013-05-02

申请号：US13414898

申请日：2012-03-08

申请人： Chun-Li Chou ,  Shao-Yen Ku ,  Chi-Yun Tseng ,  Yu-Yen Hsu ,  Tsai-Pao Su ,  Hobin Chen ,  Sheng-Chi Shih

发明人： Chun-Li Chou ,  Shao-Yen Ku ,  Chi-Yun Tseng ,  Yu-Yen Hsu ,  Tsai-Pao Su ,  Hobin Chen ,  Sheng-Chi Shih

IPC分类号： H01L21/336

CPC分类号： H01L21/823412 ,  H01L21/02057 ,  H01L21/30608 ,  H01L21/67017 ,  H01L21/6708 ,  H01L21/823425 ,  H01L29/165 ,  H01L29/66575 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7848

摘要： A system and method for etching a substrate is provided. An embodiment comprises utilizing an inert carrier gas in order to introduce a liquid etchant to a substrate. The inert carrier gas may prevent undesirable chemical reactions from taking place during the etching process, thereby helping to reduce the number of defects that occur to the substrate and other structures during the etching process.

摘要翻译： 提供了蚀刻基板的系统和方法。 一个实施方案包括使用惰性载气以将液体蚀刻剂引入基底。 惰性载气可以防止在蚀刻过程期间发生不期望的化学反应，从而有助于减少在蚀刻过程期间对基底和其它结构发生的缺陷的数量。

公开(公告)号：US09263337B2

公开(公告)日：2016-02-16

申请号：US13414898

申请日：2012-03-08

申请人： Chun-Li Chou ,  Shao-Yen Ku ,  Chi-Yun Tseng ,  Yu-Yen Hsu ,  Tsai-Pao Su ,  Hobin Chen ,  Sheng-Chi Shih

发明人： Chun-Li Chou ,  Shao-Yen Ku ,  Chi-Yun Tseng ,  Yu-Yen Hsu ,  Tsai-Pao Su ,  Hobin Chen ,  Sheng-Chi Shih

IPC分类号： H01L21/8238 ,  H01L21/8234 ,  H01L29/78 ,  H01L29/66 ,  H01L29/165 ,  H01L21/02 ,  H01L21/306 ,  H01L21/67

CPC分类号： H01L21/823412 ,  H01L21/02057 ,  H01L21/30608 ,  H01L21/67017 ,  H01L21/6708 ,  H01L21/823425 ,  H01L29/165 ,  H01L29/66575 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7848

摘要： A system and method for etching a substrate is provided. An embodiment comprises utilizing an inert carrier gas in order to introduce a liquid etchant to a substrate. The inert carrier gas may prevent undesirable chemical reactions from taking place during the etching process, thereby helping to reduce the number of defects that occur to the substrate and other structures during the etching process.

摘要翻译： 提供了蚀刻基板的系统和方法。 一个实施方案包括使用惰性载气以将液体蚀刻剂引入基底。 惰性载气可以防止在蚀刻过程期间发生不期望的化学反应，从而有助于减少在蚀刻过程期间对基底和其它结构发生的缺陷的数量。

公开(公告)号：US06206441B1

公开(公告)日：2001-03-27

申请号：US09366226

申请日：1999-08-03

申请人： Ming-Chien Wen ,  Chuan-Yuan Lu ,  Chi-Yun Tseng ,  Su-Yi Doung

发明人： Ming-Chien Wen ,  Chuan-Yuan Lu ,  Chi-Yun Tseng ,  Su-Yi Doung

IPC分类号： B25J1506

CPC分类号： H01L21/67259 ,  Y10S294/907 ,  Y10S414/141

摘要： An apparatus for transferring wafers by a robot blade and a method for using the apparatus are disclosed. In the apparatus, a robot blade that is equipped with distance sensors mounted in a bottom surface of the blade is provided which senses the distance between the bottom surface of the robot blade and an adjacent surface below the robot blade such that any possible scratching of the adjacent surface is eliminated. The adjacent surface below the robot blade may be a wafer surface in a wafer cassette, or a wafer pedestal surface in a process machine. The distance sensors are mounted in recesses in the bottom surface of the blade which may be suitably capacitance sensors, ultrasonic sensors or optical sensors. The distance sensed by the distance sensors is analyzed by a controller and compared to a predetermined value of a minimum allowable distance such that any danger of scratching the adjacent surface is eliminated.

摘要翻译： 公开了一种通过机器人刀片传送晶片的装置和使用该装置的方法。 在该装置中，设置有安装在叶片的底表面中的距离传感器的机器人叶片，其感测机器人叶片的底表面和机器人叶片下方的相邻表面之间的距离，使得可能划伤 相邻表面被消除。 机器人刀片下面的相邻表面可以是晶片盒中的晶片表面，或处理机器中的晶片基座表面。 距离传感器安装在叶片底面的凹槽中，其可以是适当的电容传感器，超声波传感器或光学传感器。 由距离传感器感测的距离由控制器分析，并与最小可允许距离的预定值进行比较，从而消除了刮擦相邻表面的任何危险。