摘要:
This invention involves a bandgap reference circuit in IC. The temperature coefficient of conventional bandgap reference is large and the higher order compensation is difficult to implement. This invention provides an adaptive compensated bandgap reference which solves the problem only using lower order (first order) temperature coefficient compensation. The invention adopts segmental compensation circuit to realize adaptive segmental compensation of bandgap reference with low temperature coefficient. The technical solution includes traditional bandgap voltage reference circuit and adaptive feedback compensation circuit which consists of sample and hold circuit, voltage comparator and control module. This invention controls the bandgap voltage reference through systematical view and it has high process compatibility. This invention can find the best temperature characteristic curve adaptively, the output voltage has low temperature coefficient, meeting the requirement of fabrication process, the implementation is simple with small area. This invention relates to integrated circuits.
摘要:
This invention involves a bandgap reference circuit in IC. The temperature coefficient of conventional bandgap reference is large and the higher order compensation is difficult to implement. This invention provides an adaptive compensated bandgap reference which solves the problem only using lower order (first order) temperature coefficient compensation. The invention adopts segmental compensation circuit to realize adaptive segmental compensation of bandgap reference with low temperature coefficient. The technical solution includes traditional bandgap voltage reference circuit and adaptive feedback compensation circuit which consists of sample and hold circuit, voltage comparator and control module. This invention controls the bandgap voltage reference through systematical view and it has high process compatibility. This invention can find the best temperature characteristic curve adaptively, the output voltage has low temperature coefficient, meeting the requirement of fabrication process, the implementation is simple with small area. This invention relates to integrated circuits.
摘要:
This invention relates to secondary or tertiary recovery processes for the recovery of oil from subterranean oil-bearing reservoirs. More particularly, this invention relates to an improved method for the recovery of petroleum from underground reservoirs, which petroleum contains sulfonate surfactants and water and for a method of removing said sulfonate surfactants and water from petroleum produced from said recovery processes.
摘要:
Catalysts producing a sharply peaked alkoxylation distribution during the alkoxylation of organic materials comprise mixtures of BF.sub.3 and metal alkyls or metal alkoxides, SiF.sub.4 and metal alkyls or metal alkoxides, or mixtures of these catalysts.
摘要:
Color may be removed from colored polyphenylated alkane by contacting this material with certain adsorbants. The adsorbants provided comprise certain crystalline zeolites in a silica alumina matrix and bauxite clay having at least one material selected from the group consisting of ferric oxide, titanium oxide, and zirconium oxide, which is activated by sulfuric acid and then calcined to provide the effective adsorbant.
摘要:
Basic compounds of Ba and Sr used in the production of peaked alcohol alkoxylates can be removed from the products by precipitating with some polybasic organic acids. Examples of effective acids include glutaric, diglycolic, adipic, and azelaic acids.
摘要:
FIG. 1 is a front, right and bottom perspective view of a pillow, showing my design. FIG. 2 is a rear, left and top perspective view thereof. FIG. 3 is a front elevation view thereof. FIG. 4 is a rear elevation view thereof. FIG. 5 is a left side elevation view thereof. FIG. 6 is a right side elevation view thereof. FIG. 7 is a top plan view thereof; and, FIG. 8 is a bottom plan view thereof.
摘要:
A fixation device for an intramedullary nail for proximal femoral fractures, including a main intramedullary nail, a combined locking nail, and cortical bone screws. The main intramedullary nail has a longitudinal axis, a proximal end, and a distal end with a tip. The proximal end includes a through hole for assembling the combined locking nail. The distal end includes an oblong through hole and a circular through hole, both for receiving the cortical bone screws. The combined locking nail includes a head, a distal end of the locking nail, a sleeve, a connecting block, and a cover cap. The connecting block includes a left-handed external thread. The cover cap includes a left-handed internal thread matching with the external thread of the connecting block, a symmetrical sliding plane, and a protrusion block disposed at the end of the symmetrical sliding plane.
摘要:
A solar powered spectral photosynthetic bioreactor system for culturing microalgae at high density, the system comprising a photobioreactor and further comprising a solar collector, optical fiber, an illuminant device within the photobioreactor, and a residual gas absorption device and culture medium separation and recovery device each connected to the photobioreactor; the illuminant device having one end connected to a spectral light intensity adjusting device installed above the photobioreactor; the adjusting device connected to the solar collector via the optical fiber; a gas distributor provided between the underside of the illuminant device and a base part of the photobioreactor; the distributor connected to an output end of a gas mixing device. This system can effectively improve utilization of solar energy, lower external electrical power consumption, and resolve the problems of solar energy being intermittent and unstable in nature and difficult to collect, ensuring continuous and stable culturing of microalgae.
摘要:
A new adhesive system is presented. It has been discovered that crosslinked polymeric materials may be used both as spacer particles and as filler in adhesives. The adhesives are especially useful for attaching electronic devices where controlled adhesive bond width is required and the devices make use of lead free solder or otherwise require high temperature processing. New methods for selection of suitable material to be used as spacer and filler material are presented.