HIGH-k CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS
    2.
    发明申请
    HIGH-k CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS 有权
    高k封闭阻尼电介带工程SONOS和MONOS

    公开(公告)号:US20110003452A1

    公开(公告)日:2011-01-06

    申请号:US12881570

    申请日:2010-09-14

    IPC分类号: H01L21/336 H01L21/28

    摘要: A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric including a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably includes a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used.

    摘要翻译: 阻挡介电工程的电荷捕获存储单元包括电荷俘获元件,其通过阻挡电介质与栅极分离,所述阻挡电介质包括与电荷俘获元件接触的缓冲层,例如可以以高质量制造的二氧化硅,以及 与栅极和沟道中的所述一个接触的第二覆盖层。 覆盖层的介电常数高于第一层的介电常数,优选包括高<! - SIPO

    High-κ capped blocking dielectric bandgap engineered SONOS and MONOS

    公开(公告)号:US08119481B2

    公开(公告)日:2012-02-21

    申请号:US12881570

    申请日:2010-09-14

    IPC分类号: H01L21/336

    摘要: A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric including a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably includes a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used.

    HIGH-k CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS
    6.
    发明申请
    HIGH-k CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS 有权
    高k封闭阻尼电介带工程SONOS和MONOS

    公开(公告)号:US20090059676A1

    公开(公告)日:2009-03-05

    申请号:US12182318

    申请日:2008-07-30

    摘要: A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric comprising a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably comprises a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used.

    摘要翻译: 阻挡介电工程的电荷捕获存储单元包括电荷俘获元件,其通过阻挡电介质与栅极分离,该阻挡电介质包括与电荷俘获元件接触的缓冲层,例如可以制造高质量的二氧化硅,以及 与栅极和沟道中的所述一个接触的第二覆盖层。 封盖层的介电常数高于第一层,并且优选包含高卡宾材料。 第二层也具有相对高的导带偏移。 提供了通道和电荷捕获元件之间的带隙设计的隧穿层,其与本文所述的多层阻挡电介质组合,通过空穴隧穿提供高速擦除操作。 替代地,使用单层隧穿层。

    High-κ capped blocking dielectric bandgap engineered SONOS and MONOS
    7.
    发明授权
    High-κ capped blocking dielectric bandgap engineered SONOS and MONOS 有权
    高科技 封装阻塞介质带隙工程SONOS和MONOS

    公开(公告)号:US08330210B2

    公开(公告)日:2012-12-11

    申请号:US13398825

    申请日:2012-02-16

    IPC分类号: H01L29/792

    摘要: A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric including a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably includes a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used.

    摘要翻译: 阻挡介电工程的电荷捕获存储单元包括电荷俘获元件,其通过阻挡电介质与栅极分离,所述阻挡电介质包括与电荷俘获元件接触的缓冲层,例如可以以高质量制造的二氧化硅,以及 与栅极和沟道中的所述一个接触的第二覆盖层。 覆盖层的介电常数高于第一层的介电常数,优选包括高<! - SIPO

    HIGH-K CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS
    8.
    发明申请
    HIGH-K CAPPED BLOCKING DIELECTRIC BANDGAP ENGINEERED SONOS AND MONOS 有权
    高K封闭阻尼电阻带工程SONOS和MONOS

    公开(公告)号:US20120146126A1

    公开(公告)日:2012-06-14

    申请号:US13398825

    申请日:2012-02-16

    IPC分类号: H01L29/792 H01L21/28

    摘要: A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric including a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably includes a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used.

    摘要翻译: 阻挡介电工程的电荷捕获存储单元包括电荷俘获元件,其通过阻挡电介质与栅极分离,所述阻挡电介质包括与电荷俘获元件接触的缓冲层,例如可以以高质量制造的二氧化硅,以及 与栅极和沟道中的所述一个接触的第二覆盖层。 覆盖层的介电常数高于第一层的介电常数,优选包括高<! - SIPO

    High-κ capped blocking dielectric bandgap engineered SONOS and MONOS
    9.
    发明授权
    High-κ capped blocking dielectric bandgap engineered SONOS and MONOS 有权
    高科技 封装阻塞介质带隙工程SONOS和MONOS

    公开(公告)号:US07816727B2

    公开(公告)日:2010-10-19

    申请号:US12182318

    申请日:2008-07-30

    摘要: A blocking dielectric engineered, charge trapping memory cell includes a charge trapping element that is separated from a gate by a blocking dielectric including a buffer layer in contact with the charge trapping element, such as silicon dioxide which can be made with high-quality, and a second capping layer in contact with said one of the gate and the channel. The capping layer has a dielectric constant that is higher than that of the first layer, and preferably includes a high-κ material. The second layer also has a conduction band offset that is relatively high. A bandgap engineered tunneling layer between the channel and the charge trapping element is provided which, in combination with the multilayer blocking dielectric described herein, provides for high-speed erase operations by hole tunneling. In an alternative, a single layer tunneling layer is used.

    摘要翻译: 阻挡介电工程的电荷捕获存储单元包括电荷俘获元件,其通过阻挡电介质与栅极分离,所述阻挡电介质包括与电荷俘获元件接触的缓冲层,例如可以以高质量制造的二氧化硅,以及 与栅极和沟道中的所述一个接触的第二覆盖层。 覆盖层的介电常数高于第一层的介电常数,优选包括高<! - SIPO

    Semiconductor device and method of manufacturing the same
    10.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07910981B2

    公开(公告)日:2011-03-22

    申请号:US11898528

    申请日:2007-09-13

    IPC分类号: H01L29/792

    摘要: A semiconductor device having a non-volatile memory and a method of manufacturing the same are provided. The semiconductor device includes a base material and a stack structure. The stack structure disposed on the base material at least includes a tunneling layer, a trapping layer and a dielectric layer. The trapping layer is disposed on the tunneling layer. The dielectric layer has a dielectric constant and is disposed on the trapping layer. The dielectric layer is transformed from a first solid state to a second solid state when the dielectric layer undergoes a process.

    摘要翻译: 提供了具有非易失性存储器的半导体器件及其制造方法。 半导体器件包括基底材料和堆叠结构。 设置在基材上的堆叠结构至少包括隧穿层,捕获层和电介质层。 捕获层设置在隧道层上。 电介质层具有介电常数并且设置在捕获层上。 当电介质层进行处理时,电介质层从第一固态转变为第二固态。