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公开(公告)号：US20090179138A1
公开(公告)日：2009-07-16
申请号：US12007887
申请日：2008-01-16
CPC分类号： G03F7/0002 , B29C33/10 , B29C33/3857 , B29C33/40 , B82Y10/00 , B82Y40/00
摘要： Soft mold and fabrication method thereof. The soft mold of the present invention comprises: a polymer layer having a printing pattern on a first surface thereof; at least one air channel on the first surface; and a back-plate attached to a second surface of the polymer layer. Additionally, the method for fabricating the soft mold includes: providing a mold having a predetermined pattern; positioning the mold in a cavity and calibrating the horizontal thereof; forming a polymer layer on the mold; attaching a back-plate to a top surface of the polymer layer and the dam; separating the polymer layer from the mold, wherein the polymer layer has a patterned surface; and cutting at least one air channel on the patterned surface of the polymer layer.
摘要翻译： 软模具及其制造方法。 本发明的软模具包括：在其第一表面上具有印刷图案的聚合物层; 在所述第一表面上的至少一个空气通道; 以及附接到聚合物层的第二表面的背板。 另外，制造软模具的方法包括：提供具有预定图案的模具; 将模具定位在空腔中并校准其水平面; 在模具上形成聚合物层; 将背板附接到聚合物层和坝的顶表面; 将聚合物层与模具分离，其中聚合物层具有图案化表面; 以及在聚合物层的图案化表面上切割至少一个空气通道。
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公开(公告)号：US07796337B2
公开(公告)日：2010-09-14
申请号：US11717128
申请日：2007-03-13
IPC分类号： G02B27/10
CPC分类号： B29D11/00365
摘要： An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.
摘要翻译： 公开了一种用于制造它的光学微结构板和模具。 光学微结构板包括基底。 在基板上形成光学微结构元件。 周期对准标记设置在基板上以提供用于通过模具制造光学微结构元件的对准。 通用对准标记设置在基板上以提供用于将另一个板粘合的对准。 具体地，模具包括在模具基板内的凹部，围绕凹部的扰流板和与扰流板相邻的缓冲区域。
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公开(公告)号：US20080225390A1
公开(公告)日：2008-09-18
申请号：US11717128
申请日：2007-03-13
CPC分类号： B29D11/00365
摘要： An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.
摘要翻译： 公开了一种用于制造它的光学微结构板和模具。 光学微结构板包括基底。 在基板上形成光学微结构元件。 周期对准标记设置在基板上以提供用于通过模具制造光学微结构元件的对准。 通用对准标记设置在基板上以提供用于将另一个板粘合的对准。 具体地，模具包括在模具基板内的凹部，围绕凹部的扰流板和与扰流板相邻的缓冲区域。
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公开(公告)号：US20110298073A1
公开(公告)日：2011-12-08
申请号：US12794257
申请日：2010-06-04
申请人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
发明人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L31/0232 , H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L31/0216 , H01L31/02164 , H01L31/02165
摘要： Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.
摘要翻译： 公开了一种用于形成图像传感器装置的方法。 首先，提供透镜，然后在透镜上形成第一牺牲元件。 随后，在透镜和第一牺牲元件上形成电磁干涉层，并且去除其上的第一牺牲元件和电磁干涉层，以形成具有暴露透镜的选定部分的开口的电磁干涉图案。 第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域，而透镜的选定部分的周边区域保持暴露。 接下来，在电磁干涉图案，第二牺牲元件和透镜的选定部分的周边区域上形成遮光层。 此后，去除第二牺牲元件和其上的遮光图案以将透镜的选定部分的中心区域作为透光区域。
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5.发明授权公开(公告)号：US07679167B2
公开(公告)日：2010-03-16
申请号：US11707110
申请日：2007-02-16
IPC分类号： H01L23/552
CPC分类号： H04N5/335 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05569 , H01L2224/10 , H01L2924/00014 , H04N5/2254 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
摘要翻译： 公开了一种用于图像传感器装置的封装模块。 封装模块包括设置在下基板和上基板之间的器件芯片。 第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。 第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。 第一焊盘在下基板的底表面上并且电连接到第一导电层。 本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。
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公开(公告)号：US20120155854A1
公开(公告)日：2012-06-21
申请号：US12974720
申请日：2010-12-21
CPC分类号： H01L27/14618 , G03B17/02 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , Y10T29/49002 , H01L2924/00
摘要： The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.
摘要翻译： 本发明提供一种相机模块及其制造方法。 相机模块包括在其底表面上具有多个焊球的图像传感器装置芯片。 光学透镜设置在图像传感器装置芯片上。 金属板具有在图像传感器装置的底面上延伸的部分。 金属涂层围绕光学透镜的垂直表面和金属板的一部分的顶表面。 第一遮光层覆盖金属涂层的垂直表面。
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公开(公告)号：US08251601B2
公开(公告)日：2012-08-28
申请号：US12974720
申请日：2010-12-21
IPC分类号： G03B17/00
CPC分类号： H01L27/14618 , G03B17/02 , H01L27/14623 , H01L27/14625 , H01L27/14683 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , Y10T29/49002 , H01L2924/00
摘要： The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.
摘要翻译： 本发明提供一种相机模块及其制造方法。 相机模块包括在其底表面上具有多个焊球的图像传感器装置芯片。 光学透镜设置在图像传感器装置芯片上。 金属板具有在图像传感器装置的底面上延伸的部分。 金属涂层围绕光学透镜的垂直表面和金属板的一部分的顶表面。 第一遮光层覆盖金属涂层的垂直表面。
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公开(公告)号：US08557626B2
公开(公告)日：2013-10-15
申请号：US12794257
申请日：2010-06-04
申请人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
发明人： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
IPC分类号： H01L31/0232 , H01L31/0236
CPC分类号： H01L31/0232 , H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L31/0216 , H01L31/02164 , H01L31/02165
摘要： Disclosed is a method for forming an image sensor device. First, a lens is provided, and a first sacrificial element is then formed on the lens. Subsequently, an electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and the electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens, while a peripheral region of the selected portion of the lens remains exposed. Next, a light-shielding layer is formed on the electromagnetic interference pattern, the second sacrificial element, and the peripheral region of the selected portion of the lens. Thereafter, the second sacrificial element and the light-shielding pattern thereon are removed to expose the center region of the selected portion of the lens as a light transmitting region.
摘要翻译： 公开了一种用于形成图像传感器装置的方法。 首先，提供透镜，然后在透镜上形成第一牺牲元件。 随后，在透镜和第一牺牲元件上形成电磁干涉层，并且去除其上的第一牺牲元件和电磁干涉层，以形成具有暴露透镜的选定部分的开口的电磁干涉图案。 第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域，而透镜的选定部分的周边区域保持暴露。 接下来，在电磁干涉图案，第二牺牲元件和透镜的选定部分的周边区域上形成遮光层。 此后，去除第二牺牲元件和其上的遮光图案以将透镜的选定部分的中心区域作为透光区域。
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9.发明申请公开(公告)号：US20080164550A1
公开(公告)日：2008-07-10
申请号：US11707110
申请日：2007-02-16
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H04N5/335 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05569 , H01L2224/10 , H01L2924/00014 , H04N5/2254 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
摘要翻译： 公开了一种用于图像传感器装置的封装模块。 封装模块包括设置在下基板和上基板之间的器件芯片。 第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。 第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。 第一焊盘位于下基板的底表面上并与第一导电层电连接。 本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。
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