Backlight module, printed circuit board used for backlight module, and manufacturing method for the same
    1.
    发明授权
    Backlight module, printed circuit board used for backlight module, and manufacturing method for the same 有权
    背光模块,用于背光模块的印刷电路板及其制造方法

    公开(公告)号:US09084345B2

    公开(公告)日:2015-07-14

    申请号:US13811279

    申请日:2013-01-11

    Abstract: The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.

    Abstract translation: 本发明公开了一种背光模块,背光模块用的印刷电路板及其制造方法。 印刷电路板包括光条区域和散热区域。 所述灯条区域用于安装所述背光模块的灯条并形成有用于为所述灯条供电的导电电路; 以及与轻棒区域连接的散热区域,其中,光条区域和散热区域的连接位置与切割槽配合,并且切割槽位于印刷电路板的侧面,用于安装光条 以防止散热区域和通过切割槽的光条区域的导电电路之间的短路连接。 本发明可以避免由于印刷电路板的散热区上的导电层的未完成蚀刻引起的短路问题。

    Method of making a backlight module for a printed circuit board
    2.
    发明授权
    Method of making a backlight module for a printed circuit board 有权
    制造印刷电路板的背光模组的方法

    公开(公告)号:US09545012B2

    公开(公告)日:2017-01-10

    申请号:US14647807

    申请日:2013-01-11

    Abstract: A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region.

    Abstract translation: 提供一种用于制造背光模块的印刷电路板的方法。 印刷电路板包括光条区域和散热区域。 用于安装背光模块的光棒并形成有用于为光棒供电的导电电路的光条区域。 散热区域与光条区域连接。 对光棒区域和散热区域的连接位置进行切割以形成位于印刷电路板侧的狭槽,以防止散热区域与光条的导电电路之间的短路 地区。 切割部分地穿透其上形成有导电电路的电介质层的厚度,以便将光条区域与散热区域完全分离。

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