Abstract:
The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.
Abstract:
A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region.