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公开(公告)号：US07091623B2
公开(公告)日：2006-08-15
申请号：US10980671
申请日：2004-11-02
申请人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
发明人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
CPC分类号： H01L25/50 , H01L24/97 , H01L25/0657 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06582 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/351 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00
摘要： A multi-chip semiconductor package and a fabrication method thereof are provided. A substrate having an upper surface and a lower surface is prepared. At least a first chip is mounted on the upper surface of the substrate. A non-conductive material is applied over predetermined area on the first chip and the upper surface of the substrate. At least a second chip is mounted on the non-conductive material, and formed with at least a suspending portion free of interference in position with the first chip, wherein the non-conductive material is dimensioned in surface area at least corresponding to the second chip, so as to allow the suspending portion to be supported on the non-conductive material. With the second chip being completely supported on the non-conductive material without causing a conventional chip-crack problem, structural intactness and reliability can be effectively assured for fabricated package products.
摘要翻译： 提供一种多芯片半导体封装及其制造方法。 制备具有上表面和下表面的基材。 至少第一芯片安装在基板的上表面上。 在第一芯片和基板的上表面上的预定区域上施加非导电材料。 至少第二芯片安装在非导电材料上，并形成有至少一个与第一芯片无干涉位置的悬挂部分，其中非导电材料的尺寸设计在至少对应于第二芯片的表面积 以使悬挂部分能够支撑在非导电材料上。 通过将第二芯片完全支撑在非导电材料上，而不会导致常规的芯片裂纹问题，可以有效地确保制造的封装产品的结构完整性和可靠性。
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公开(公告)号：US06879030B2
公开(公告)日：2005-04-12
申请号：US10262309
申请日：2002-09-30
申请人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
发明人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
IPC分类号： H01L23/31 , H01L23/495 , H01L23/02
CPC分类号： H01L24/97 , H01L23/3114 , H01L23/3135 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/351 , H01L2224/85 , H01L2924/00 , H01L2224/05599
摘要： A strengthened window-type semiconductor package is provided. A substrate having an opening is mounted with at least a chip in a manner that, an active surface of the chip covers and partly exposed to the opening, and electrically connected to the substrate by bonding wires formed through the opening. An elastic non-conductive material is applied over the chip exclusive of the active surface. An upper encapsulant is formed to encapsulate the chip and the non-conductive material, and a lower encapsulant is formed to encapsulate the bonding wires and seal the opening. With provision of the non-conductive material for encapsulating the chip before forming the upper encapsulant, the chip can be prevented from cracking particularly at corner and edge positions that encounter relatively greater thermal stress during subsequent fabrication processes such as curing of the upper encapsulant and thermal cycles.
摘要翻译： 提供了一种加强的窗型半导体封装。 具有开口的基板至少以芯片的形式安装，芯片的有效表面覆盖并部分地暴露于开口，并且通过通过开口形成的接合线电连接到基板。 弹性非导电材料施加在芯片之上，而非活性表面。 形成上部密封剂以封装芯片和非导电材料，并且形成下部密封剂以封装接合线并密封开口。 通过提供用于在形成上部密封剂之前封装芯片的非导电材料，特别是在随后的制造过程中遇到相对较大的热应力的拐角和边缘位置，例如固化上密封剂和热 周期。
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公开(公告)号：US20050064631A1
公开(公告)日：2005-03-24
申请号：US10980671
申请日：2004-11-02
申请人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
发明人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
IPC分类号： H01L21/44 , H01L21/50 , H01L21/98 , H01L25/065 , H01L29/768
CPC分类号： H01L25/50 , H01L24/97 , H01L25/0657 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06582 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/351 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00
摘要： A multi-chip semiconductor package and a fabrication method thereof are provided. A substrate having an upper surface and a lower surface is prepared. At least a first chip is mounted on the upper surface of the substrate. A non-conductive material is applied over predetermined area on the first chip and the upper surface of the substrate. At least a second chip is mounted on the non-conductive material, and formed with at least a suspending portion free of interference in position with the first chip, wherein the non-conductive material is dimensioned in surface area at least corresponding to the second chip, so as to allow the suspending portion to be supported on the non-conductive material. With the second chip being completely supported on the non-conductive material without causing a conventional chip-crack problem, structural intactness and reliability can be effectively assured for fabricated package products.
摘要翻译： 提供一种多芯片半导体封装及其制造方法。 制备具有上表面和下表面的基材。 至少第一芯片安装在基板的上表面上。 在第一芯片和基板的上表面上的预定区域上施加非导电材料。 至少第二芯片安装在非导电材料上，并形成有至少一个与第一芯片无干涉位置的悬挂部分，其中非导电材料的尺寸设计在至少对应于第二芯片的表面积 以使悬挂部分能够支撑在非导电材料上。 通过将第二芯片完全支撑在非导电材料上，而不会导致常规的芯片裂纹问题，可以有效地确保制造的封装产品的结构完整性和可靠性。
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公开(公告)号：US06825064B2
公开(公告)日：2004-11-30
申请号：US10261796
申请日：2002-09-30
申请人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
发明人： Shiann-Tsong Tsai , Yu-Ming Hsu , Wen-Lung Wu , Kuen-Huang Chen , Wen-Sheng Su , Chin-Hsing Lin
IPC分类号： H01L2144
CPC分类号： H01L25/50 , H01L24/97 , H01L25/0657 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06582 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/351 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00
摘要： A multi-chip semiconductor package and a fabrication method thereof are provided. A substrate having an upper surface and a lower surface is prepared. At least a first chip is mounted on the upper surface of the substrate. A non-conductive material is applied over predetermined area on the first chip and the upper surface of the substrate. At least a second chip is mounted on the non-conductive material, and formed with at least a suspending portion free of interference in position with the first chip, wherein the non-conductive material is dimensioned in surface area at least corresponding to the second chip, so as to allow the suspending portion to be supported on the non-conductive material. With the second chip being completely supported on the non-conductive material without causing a conventional chip-crack problem, structural intactness and reliability can be effectively assured for fabricated-package products.
摘要翻译： 提供一种多芯片半导体封装及其制造方法。 制备具有上表面和下表面的基材。 至少第一芯片安装在基板的上表面上。 在第一芯片和基板的上表面上的预定区域上施加非导电材料。 至少第二芯片安装在非导电材料上，并形成有至少一个与第一芯片无干涉位置的悬挂部分，其中非导电材料的尺寸设计在至少对应于第二芯片的表面积 以使悬挂部分能够支撑在非导电材料上。 由于第二芯片完全支撑在非导电材料上，而不会导致常规的芯片裂纹问题，因此可以有效地确保制造的封装产品的结构完整性和可靠性。
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公开(公告)号：US07972163B2
公开(公告)日：2011-07-05
申请号：US12489979
申请日：2009-06-23
IPC分类号： H01R13/627
CPC分类号： H01R13/6275
摘要： An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body.
摘要翻译： 电连接器包括多个销，隔离体和闭锁机构。 隔离体包括接收部。 接收部分布置在隔离体的前边缘处，并且具有第一接合元件。 闩锁机构具有与第一接合元件接合的第二接合元件，使得闩锁机构固定到隔离体上。
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公开(公告)号：US20100003844A1
公开(公告)日：2010-01-07
申请号：US12489979
申请日：2009-06-23
IPC分类号： H01R13/627
CPC分类号： H01R13/6275
摘要： An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body.
摘要翻译： 电连接器包括多个销，隔离体和闭锁机构。 隔离体包括接收部。 接收部分布置在隔离体的前边缘处，并且具有第一接合元件。 闩锁机构具有与第一接合元件接合的第二接合元件，使得闩锁机构固定到隔离体上。
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7.发明授权公开(公告)号：US06571036B2
公开(公告)日：2003-05-27
申请号：US09982751
申请日：2001-10-22
申请人： Jau-Jan Deng , Chin-Hsing Lin
发明人： Jau-Jan Deng , Chin-Hsing Lin
IPC分类号： G02B632
CPC分类号： G02B6/3652 , G02B6/264 , G02B6/29361 , G02B6/2937 , G02B6/2938 , G02B6/29389 , G02B6/32 , G02B6/3636
摘要： A structure facilitating easy assembly of fiber-optic communication components includes a lower and an upper support being provided with small and big V-shaped cuts, respectively, for receiving optical fibers and collimators, respectively. The upper support is inverted to seat on a middle recess of the lower support, such that tangent planes passing top points of the optical fibers and the collimators are contained in horizontal planes passing openings of the small and the big V-shaped cuts, respectively, and axes of the collimators are either in alignment with or horizontally coplanar with axes of the optical fibers. The two supports together define a central positioning cavity between them for receiving different function elements, such as optical isolator, modularized filter, etc., between the collimators, so that fiber-optic communication components with reduced volume and increased reliability could be easily assembled in mass production at reduced cost.
摘要翻译： 促进光纤通信部件容易组装的结构包括分别具有分别用于接收光纤和准直器的小的和大的V形切口的下部和上部支撑件。 上支撑件被倒置以位于下支撑件的中间凹部上，使得通过光纤和准直器的顶点的切平面分别包含在通过小V形切口和大V形切口的开口的水平面中， 并且准直器的轴与光纤的轴线对准或水平共面。 两个支架一起在它们之间定义一个中心定位腔，以便在准直器之间接收不同的功能元件，如光隔离器，模块化滤波器等，从而可以轻松组装具有减小体积和增加可靠性的光纤通信组件 大批量生产成本降低。
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