公开(公告)号：US20240318303A1

公开(公告)日：2024-09-26

申请号：US18580544

申请日：2022-09-20

Applicant: Shibaura Machine Co., Ltd.

Inventor： Kazuhiro FUKADA ,  Yoshiaki KURIHARA ,  Takeshi NAMBA ,  Satoshi FUKUYAMA ,  Mitsunori KOKUBO

IPC: C23C14/56 ,  C23C14/34 ,  C23C14/50

CPC classification number: C23C14/568 ,  C23C14/34 ,  C23C14/50 ,  C23C14/566

Abstract: A surface treatment apparatus includes a placement part on which a workpiece is placed, a first housing part, a second housing part, and a conveyance part. The first housing part houses the workpiece placed on the placement part. The second housing part houses the workpiece placed on the placement part. The second housing part includes a surface treatment part performing at least one type of surface treatment. The conveyance part conveys the workpiece placed on the placement part in a longitudinal direction of the first housing part or the second housing part. The surface treatment apparatus performs surface treatment on the workpiece in a state where the second housing part is a single body or in a state where the first housing part and the second housing part are plurally coupled in a conveyance direction of the conveyance part.

公开(公告)号：US20250153134A1

公开(公告)日：2025-05-15

申请号：US18838444

申请日：2023-01-16

Applicant: Shibaura Machine Co., Ltd.

Inventor： Takeshi NAMBA ,  Kazuhiro FUKADA ,  Yoshiaki KURIHARA

IPC: B01J19/08 ,  B01J19/18 ,  C23C14/22 ,  C23C14/34

Abstract: A surface treatment apparatus includes a treatment electrode, a housing unit that is installed at a position facing the treatment electrode and is rotatable around a rotation shaft having an inclination with respect to a horizontal direction while housing a workpiece, a chamber that houses the treatment electrode and the housing unit, a surface treatment device that performs surface treatment on the workpiece housed in the housing unit and includes the treatment electrode, and a rotation device that rotates the housing unit around the rotation shaft when the surface treatment device performs the surface treatment on the workpiece.

公开(公告)号：US20250129464A1

公开(公告)日：2025-04-24

申请号：US18683873

申请日：2022-09-08

Applicant: Shibaura Machine Co., Ltd.

Inventor： Mitsunori KOKUBO ,  Satoshi FUKUYAMA ,  Kazuhiro FUKADA ,  Rintaro SUEKI ,  Yoshiaki KURIHARA ,  Takeshi NAMBA

IPC: C23C14/00 ,  C23C14/54

Abstract: A surface treatment apparatus includes a housing unit that houses at least one workpiece, a placement device in which the workpiece is placed such that the workpiece is substantially orthogonal to a normal direction of an outer peripheral surface of a rotating shaft extending in a horizontal direction, and faces outward, a first rotating device that rotates the placement device) around the rotating shaft in a state where the placement device is housed in the housing unit, a surface treatment device that extends inside the housing unit and in parallel with the rotating shaft and performs surface treatment by supplying gas to a surface of the workpiece, and an exhaust device that is provided inside the housing unit at a position different from a position where the surface treatment device is provided, and adjusts pressure and exhausts gas inside the housing unit.

公开(公告)号：US20250079126A1

公开(公告)日：2025-03-06

申请号：US18726294

申请日：2022-11-14

Applicant: Shibaura Machine Co., Ltd.

Inventor： Rintaro SUEKI ,  Kazuhiro FUKADA ,  Takeshi NAMBA

IPC: H01J37/32 ,  C23C14/00

Abstract: A surface treatment apparatus (10) performs film formation on a surface of a workpiece (W) in a chamber (20), and includes: an HCD electrode (210) (electrode) that supplies reaction gas to the workpiece (W) or a sputtering electrode (220) (electrode) that releases target particles to the workpiece (W), the HCD electrode (210) or the sputtering electrode (220) being placed facing the workpiece (W); a gas supply pipe (90) that is installed along an outer periphery of the electrode and has, along a longitudinal direction of the pipe, a plurality of gas ejection ports (91) through which film-forming gas, or an inert gas or a reactive gas for performing sputtering is supplied to an electrode surface of the electrode; and an exhaust device (51) (gas discharge unit) that discharges residual gas after film formation is ended, and the plurality of gas ejection ports (91) are arranged such that gas supplied from the gas supply pipe (90) is uniformly distributed on the electrode surface of the electrode.

公开(公告)号：US20240060171A1

公开(公告)日：2024-02-22

申请号：US18259885

申请日：2021-12-28

Applicant: Shibaura Machine Co., Ltd.

Inventor： Kazuhiro FUKADA ,  Satoshi FUKUYAMA ,  Mitsunori KOKUBO ,  Takeshi NAMBA

IPC: C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  C23C14/56

CPC classification number: C23C14/34 ,  C23C14/505 ,  C23C14/545 ,  C23C14/56

Abstract: A surface treatment apparatus includes a mounting device, a housing unit, a surface treatment device, a conveyance device, and a first adjustment device. A workpiece is mounted on the mounting device. The housing unit houses the workpiece mounted on the mounting device. The surface treatment device performs at least one kind of surface treatment on the workpiece housed in the housing unit. The conveyance device conveys the workpiece mounted on the mounting device along the surface treatment device. The first adjustment device adjusts an orientation of the workpiece according to a conveyance position by the conveyance device and a position of the surface treatment device.