公开(公告)号：US5661636A

公开(公告)日：1997-08-26

申请号：US542165

申请日：1995-10-12

申请人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori ,  Takeshi Uenaka ,  Tomomi Morii

发明人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori ,  Takeshi Uenaka ,  Tomomi Morii

IPC分类号： G06K19/077 ,  G11B33/12 ,  G11B33/14 ,  G06F1/16 ,  H05K7/10

CPC分类号： G11B33/121 ,  G11B33/1493

摘要： An IC card with an on-board hard disk unit comprising a frame; a circuit board inside the frame; and a hard disk unit mounted on the circuit board. The IC card also has a metal front panel supported by the frame, and covering the entire IC card, including the hard disk unit. Thus, the outer surface of the IC card is made stronger, and the hard disk is protected from static electricity. The metal front panel includes a first portion where the IC card is relatively thin and a second, bulging portion where the IC card is relatively thick. The bulging portion accommodates the hard disk unit. The front panel may include a vent or mesh.

摘要翻译： 一种具有板载硬盘单元的IC卡，包括框架; 框架内的电路板; 以及安装在电路板上的硬盘单元。 IC卡还具有由框架支撑的金属前面板，并且覆盖包括硬盘单元的整个IC卡。 因此，IC卡的外表面变得更强，并且保护硬盘免受静电。 金属前面板包括IC卡相对较薄的第一部分和IC卡相对较厚的第二凸起部分。 凸出部容纳硬盘单元。 前面板可以包括排气孔或网孔。

公开(公告)号：US5982624A

公开(公告)日：1999-11-09

申请号：US907054

申请日：1997-08-06

申请人： Shigeo Onoda ,  Tomomi Morii ,  Makoto Omori ,  Jun Ohbuchi ,  Yasuhiro Murasawa

发明人： Shigeo Onoda ,  Tomomi Morii ,  Makoto Omori ,  Jun Ohbuchi ,  Yasuhiro Murasawa

IPC分类号： B42D15/10 ,  G06F1/18 ,  G06K19/077 ,  H05K7/14

CPC分类号： G06K19/07743

摘要： In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.

摘要翻译： 在IC卡中，用于连接用于安装电子部件的板的框架被上下面板覆盖。 用于将IC卡连接到计算机的主连接器设置在框架的一端。 此外，要连接到外部系统的一个或多个子连接器设置在板上，并且子连接器的销延伸到上面板中的开口。 子连接器支持在板和上面板之间。 因此，用于各种功能的各种子连接器可以与IC卡一起使用。 在修改示例中，在上面板上与主连接器相对设置子连接器，并且其引脚沿与板平行的方向延伸。

公开(公告)号：US5886402A

公开(公告)日：1999-03-23

申请号：US899812

申请日：1997-07-24

申请人： Shigeo Onoda ,  Tomomi Morii

发明人： Shigeo Onoda ,  Tomomi Morii

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H01L23/02

CPC分类号： H05K5/0269

摘要： A semiconductor device card receiving a circuit substrate (1) which has electronic component parts (2) assembled therein, comprises a pair of metal sheets (10, 10) forming a front and a back surfaces of the card and a pair of opposed resin-made frames (11, 12) surrounding peripheries of the respective metal sheets to be connected by embedding bent portions 100 of the peripheries of the metal sheets (10, 10) into the resin-made frames (11, 12), and the paired opposed frames are provided at their contact end portions with fusible projections (13) and grooves (14) adapted to engage with the projections (13) and are connected to each other by fusing at least a leading end of the projection (13) within the groove (14). A plurality of projecting portions (10a) are projected downward from the bent portions (100) of one of the paired metal sheets 10 and engaging portions (10b) adapted to engage with the projecting portions (10a) are formed in the bent portions (100) of the opposite metal sheet (10), so that the paired sheet metals can be electrically conducted to each other by the engagement between the projecting portions (10a) and the engaging portions (10b) and the connection of the opposed side frames can be reinforced. The connecting strength can be improved by employing an ultrasonic bonding. While the number of the components parts can be decreased, the connecting strength can be further improved.

摘要翻译： 一种接收组装有电子部件（2）的电路基板（1）的半导体器件卡，包括形成卡的正面和背面的一对金属板（10,10）和一对相对的树脂 - 通过将金属板（10,10）的周边的弯曲部分100嵌入到树脂制框架（11,12）中，围绕要连接的各个金属板的周边的制造框架（11,12） 框架在其接触端部处设置有可熔突起（13）和适于与突起（13）接合的凹槽（14），并且通过将突起（13）的至少前端融合在凹槽内而彼此连接 （14）。 多个突出部分（10a）从一对金属片10中的一个的弯曲部分（100）向下突出，并且在弯曲部分（100）中形成适于与突出部分（10a）接合的接合部分（10b） ），使得成对的金属片可以通过突出部分（10a）和接合部分（10b）之间的接合彼此导电，并且相对的侧框架的连接可以是 加强。 通过采用超声波接合可以提高连接强度。 虽然可以减少部件数量，但可以进一步提高连接强度。

公开(公告)号：US5926374A

公开(公告)日：1999-07-20

申请号：US61869

申请日：1998-04-17

申请人： Shigeo Onoda ,  Tomomi Morii ,  Kiyotaka Nishino

发明人： Shigeo Onoda ,  Tomomi Morii ,  Kiyotaka Nishino

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14 ,  B65D85/86

CPC分类号： H05K5/0269

摘要： There is provided an IC card where a pair of, upper and lower metal panels are respectively fixed to the frame; edge portions of the metal panel are provided with bend portions; grooves each of which comprises a pair of uneven vertical walls having a plurality of depressions and projections extending in the direction of the width of the frame are provided on the top and bottom surfaces of the frame; the distance between the projections on both the uneven vertical walls in the direction of the width of the frame is set so as to be smaller than the thickness of the bend portions by a given amount; and the metal panel is fixed to the frame with the bend portions press-fitted into the grooves along the projections. The IC card is advantageous in the manufacturing cost and is capable of stably providing a fixing force sufficient to withstand a long-term use, with regard to the fixation of upper and lower panel members to a frame.

摘要翻译： 提供了一个IC卡，其中一对上，下金属板分别固定在框架上; 金属面板的边缘部分设有弯曲部分; 在框架的顶表面和底表面上设置有包括一对不平坦的垂直壁，其具有在框架的宽度方向上延伸的多个凹陷和突起; 将两个不平坦的垂直壁上的凸起在框架的宽度方向上的距离设定为小于弯曲部分的厚度一定量; 并且金属板固定到框架上，其中弯曲部分沿着凸起压配合到凹槽中。 IC卡在制造成本方面是有利的，并且能够稳定地提供足以承受长期使用的固定力，关于将上板和下板构件固定到框架上。

公开(公告)号：US5578868A

公开(公告)日：1996-11-26

申请号：US449431

申请日：1995-05-24

申请人： Jun Obuchi ,  Hiroshi Miura ,  Tomomi Morii ,  Shigeo Onoda

发明人： Jun Obuchi ,  Hiroshi Miura ,  Tomomi Morii ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/538 ,  H01L23/02

CPC分类号： H01L23/5388 ,  G06K19/077 ,  H01L2924/0002

摘要： An IC memory card has a connector that cannot warp during the manufacturing process even if the connector is long, such as a connector at one longer side of the IC memory card with an increased number of poles. The IC memory card has grooves in the surfaces of a flange portion of the connector body opposing a surface with which the connection with an external unit is established, the grooves being adjacent the connector body and extending lengthwise along all of the longer side of the IC memory card for preventing warping.

摘要翻译： IC存储卡具有在制造过程中即使连接器较长也不会翘曲的连接器，例如具有增加的极数的IC存储卡的一个较长侧的连接器。 IC存储卡在连接器主体的凸缘部分的与形成与外部单元的连接的表面相对的表面中具有凹槽，凹槽与连接器主体相邻并且沿IC的所有长边沿纵向延伸 用于防止翘曲的存储卡。

公开(公告)号：US6166912A

公开(公告)日：2000-12-26

申请号：US81677

申请日：1998-05-20

申请人： Tomomi Morii ,  Kiyotaka Nishino ,  Shigeo Onoda

发明人： Tomomi Morii ,  Kiyotaka Nishino ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K5/02 ,  H05K7/14

CPC分类号： H05K5/0269

摘要： There is provided an IC card and manufacturing method thereof assuring a highly reliable fixed portion in fixing upper and lower panel members to a frame made of resin as well as an advantage in terms of manufacturing cost. In the IC card in which a pair of upper and lower panel members covering card planar portions are respectively fixed to the upper and the lower surfaces of a resin frame which supports a peripheral portion of an electric circuit board and a connector attached to an end portion of the electric circuit board, the panel members have their peripheral edge portions which are provided with a bent portion extending along the peripherial edge portions and are formed by bending the panel material at a specified angle, and a welding use resin layer is formed on the surface of the bent portion and the periphery of the planar portion of the panel member. On the other hand, the frame is provided with a groove portion for receiving therein the bent portion, and the welding use resin layer is melted in a pressurized state while making the welding use resin layer abut against the frame with the bent portion fitted in to the groove portion, thereby fixing the panel members to the frame.

摘要翻译： 提供了一种IC卡及其制造方法，其确保将上，下面板构件固定在由树脂制成的框架上的高度可靠的固定部分以及制造成本方面的优点。 在其中一对覆盖卡片平面部分的上下面板部件分别固定在支撑电路板的周边部分的树脂框架的上表面和下表面的IC卡中，以及连接到端部的连接器 所述面板部件的周边部分设置有沿着周边部分延伸的弯曲部分，并且通过以特定角度弯曲面板材料而形成，并且在该电路板上形成焊接用树脂层 弯曲部分的表面和面板部件的平面部分的周边。 另一方面，框架设置有用于在其中容纳弯曲部分的槽部分，并且焊接用树脂层在加压状态下熔化，同时使焊接用树脂层与弯曲部分嵌合在一起的框架抵靠在框架上 槽部，从而将面板部件固定在框架上。