-
公开(公告)号：US20060205891A1
公开(公告)日：2006-09-14
申请号：US10552540
申请日：2004-04-12
IPC分类号： C08G65/48
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
-
2.发明授权Thermosetting resin composition, multilayer body using same, and circuit board 有权热固性树脂组合物，使用其的多层体和电路板公开(公告)号：US07521511B2
公开(公告)日：2009-04-21
申请号：US10552540
申请日：2004-04-12
IPC分类号： A47G19/08 , B32B15/04 , B32B15/08 , C08J3/00 , C08K5/49 , C08K5/51 , C08L61/00 , C08L61/04 , C08L63/00 , C08L67/00 , C08L71/02 , C08L71/12
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group. By using such a composition, multilayer bodies and circuit boards with excellent properties can be manufactured.
摘要翻译： 提供了用于制造电路板和积聚电路板和堆积板的热固性树脂组合物，以及使用这些组合物制造的多层体和电路板。 组合物含有聚酰亚胺树脂（A），酚醛树脂（B）和环氧树脂（C）成分。 混合比例（A）/ [（B）+（C）]为0.4〜2.0，该比例为（A）与（B）和（C）的总重量之比。 通过使用这样的组成，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。 组合物含有聚酰亚胺树脂（A），磷腈（D）和氰酸酯（E）。 D包括通过交联（D-1），具有至少一个酚羟基的（D-2））制备的含酚羟基的苯氧基磷腈（D-1）和/或交联的苯氧基磷腈（D-2）。 通过使用这样的组合物，可以制造具有优异性能的多层体和电路板。
-
3.发明申请Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board 有权热固性树脂组合物，使用其的多层体和电路板公开(公告)号：US20080306220A1
公开(公告)日：2008-12-11
申请号：US12188898
申请日：2008-08-08
IPC分类号： C08G73/10
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions.A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc.A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the 4 phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
摘要翻译： 本发明涉及适合用于制造柔性印刷电路板（FPC）和积聚电路板的电路板的热固性树脂组合物以及使用这种热固性树脂组合物制造的多层体和电路板。 热固性树脂组合物含有聚酰亚胺树脂组分（A），酚醛树脂组分（B）和环氧树脂组分（C）。 重量比（A）/ [（B）+（C）]的混合比在0.4至2.0的范围内，重量比为组分（A）的重量与总重量的比例 组分（B）和组分（C）。 通过使用这种热固性树脂组合物，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂（A），磷腈 化合物（D）和氰酸酯化合物（E）。 磷腈化合物（D）包括通过使4苯氧基磷腈化合物（D-1），交联的苯氧基磷腈化合物（D-2）交联而制备的含酚羟基的苯氧基磷腈化合物（D-1）和/或交联的苯氧基磷腈化合物 D-2）具有至少一个酚羟基。 通过使用这种热固性树脂组合物，可以制造介电特性，加工性，耐热性和阻燃性优异的多层体和电路板。
-
4.发明授权Thermosetting resin composition, multilayer body using same, and circuit board 有权热固性树脂组合物，使用其的多层体和电路板公开(公告)号：US08501874B2
公开(公告)日：2013-08-06
申请号：US12188898
申请日：2008-08-08
IPC分类号： A47G19/08 , B32B15/04 , B32B15/08 , C07F9/24 , C08F283/00 , C08F283/04 , C08G18/77 , C08G59/14 , C08G65/32 , C08G65/48 , C08G69/48 , C08G79/02 , C08K5/49 , C08K5/51 , C08K5/5399 , C08L61/00 , C08L61/04 , C08L63/00 , C08L67/00 , C08L71/02 , C08L71/12 , C08L75/04 , C08L77/00 , C08L85/02
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions.A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc.A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
摘要翻译： 本发明涉及适合用于制造柔性印刷电路板（FPC）和积聚电路板的电路板的热固性树脂组合物以及使用这种热固性树脂组合物制造的多层体和电路板。 热固性树脂组合物含有聚酰亚胺树脂组分（A），酚醛树脂组分（B）和环氧树脂组分（C）。 重量比（A）/ [（B）+（C）]的混合比在0.4至2.0的范围内，重量比为组分（A）的重量与总重量的比例 组分（B）和组分（C）。 通过使用这种热固性树脂组合物，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂（A），磷腈 化合物（D）和氰酸酯化合物（E）。 磷腈化合物（D）包括通过使苯氧基磷腈化合物（D-1）交联而制得的交联的苯氧基磷腈化合物（D-1）和/或交联的苯氧基磷腈化合物（D-1），交联的苯氧基磷腈化合物 -2）具有至少一个酚羟基。 通过使用这种热固性树脂组合物，可以制造介电特性，加工性，耐热性和阻燃性优异的多层体和电路板。
-
公开(公告)号：US08946349B2
公开(公告)日：2015-02-03
申请号：US13821764
申请日：2011-08-10
申请人： Koji Okada , Ryoji Tanaka , Yoshiyuki Udagawa
发明人： Koji Okada , Ryoji Tanaka , Yoshiyuki Udagawa
摘要： A rubber composition that can be used in applications such as automotive tires and can improve the fuel efficiency performance and driving stability of automobiles and the like, a method for producing a rubber composition, and a tire using the same are provided.A rubber composition comprising: (A) a conjugated diene rubber which is obtained by polymerizing a conjugated diene compound or polymerizing a conjugated diene compound and an aromatic vinyl compound and has a group having an active hydrogen and a group capable of chemically binding to a silica, (B) a silica, (C) a silane coupling agent (I) capable of reacting with a carbon-carbon double bond of the conjugated diene in the conjugated diene rubber, and (D) a silane coupling agent (II) capable of reacting with the group having an active hydrogen; a method for producing a rubber composition, which comprises mixing the above-mentioned composition; and a tire which is obtained by crosslinking and molding the rubber composition obtained by the method for production.
-
公开(公告)号：US08927656B2
公开(公告)日：2015-01-06
申请号：US14000072
申请日：2012-02-15
申请人： Takeshi Yuasa , Koji Okada
发明人： Takeshi Yuasa , Koji Okada
摘要： Objects of the present invention are to provide a rubber composition that can obtain a rubber elastic body having small rolling resistance and excellent impact resilience and a method for producing the same, and to provide a tire having small rolling resistance and excellent impact resilience. The rubber composition of the present invention is obtained by kneading a conjugated diene polymer (A) having a group with bonding reactivity to silica only at one site of one molecule of the polymer, a polymer (B) having groups with bonding reactivity to silica at a plurality of sites of one molecule of the polymer, and a filler (C) containing silica.
-
公开(公告)号：US08898193B2
公开(公告)日：2014-11-25
申请号：US13181937
申请日：2011-07-13
申请人： Tatsuro Ikeda , Koji Okada , Norikazu Hosaka , Fumihiko Sano , Toshio Okamoto
发明人： Tatsuro Ikeda , Koji Okada , Norikazu Hosaka , Fumihiko Sano , Toshio Okamoto
CPC分类号： G06F21/10 , G06F17/30165 , G06F17/30575 , G06F2221/2105 , G06F2221/2141
摘要： According to one embodiment, the resource access unit accesses a first resource including a replication target object and policy data assigned to the object. The policy data includes base policy data including a first condition and assertion policy data including a second condition. The first retrieval unit obtains first attribute data for accessing the first resource. The first policy evaluation unit determines whether the first attribute satisfies the first condition. When the first condition is satisfied, the copy processing unit executes the copy processing for copying the object. The second retrieval unit obtains the second attribute data for accessing the second resource. The second policy evaluation unit determines whether the second attribute data satisfies the second condition. When the second condition is satisfied, the paste processing unit executes paste processing for pasting the object to the second resource.
摘要翻译： 根据一个实施例，资源访问单元访问包括复制目标对象的第一资源和分配给对象的策略数据。 策略数据包括基本策略数据，包括第一条件和包括第二条件的断言策略数据。 第一检索单元获取用于访问第一资源的第一属性数据。 第一策略评估单元确定第一属性是否满足第一条件。 当满足第一条件时，复制处理单元执行用于复制对象的复制处理。 第二检索单元获得用于访问第二资源的第二属性数据。 第二策略评估单元确定第二属性数据是否满足第二条件。 当满足第二条件时，粘贴处理单元执行用于将对象粘贴到第二资源的粘贴处理。
-
公开(公告)号：US08863305B2
公开(公告)日：2014-10-14
申请号：US12552927
申请日：2009-09-02
申请人： Koji Okada , Tatsuro Ikeda , Masataka Yamada , Minoru Nishizawa , Takanori Nakamizo , Toshio Okamoto
发明人： Koji Okada , Tatsuro Ikeda , Masataka Yamada , Minoru Nishizawa , Takanori Nakamizo , Toshio Okamoto
CPC分类号： G06F21/6209 , G06F21/31 , H04L2463/101
摘要： In a file-access control system according to an embodiment of this invention, control data in accordance with actions made is imparted, as an obligation-type policy, to a document file. Next, a policy evaluation control unit evaluates and executes the obligation-type policy imparted to the document file in accordance with the action to the document file. The execution of the obligation-type policy includes the controlling of a document application on the basis of an obligation fulfillment action. Therefore, an active control can be performed in accordance with any manipulation made to the document, and the access to the document can be changed.
摘要翻译： 在根据本发明的实施例的文件访问控制系统中，根据所做出的动作的控制数据作为义务型策略被赋予文档文件。 接下来，策略评估控制单元根据对文档文件的动作评估并执行赋予文档文件的义务类型策略。 义务型政策的执行包括在义务履行行动的基础上控制文件申请。 因此，可以根据对文档的任何操作来执行主动控制，并且可以改变对文档的访问。
-
9.发明授权Camera body, interchangeable lens, accessory, camera system, and method for rewriting information 有权相机主体，可互换镜头，附件，相机系统以及重写信息的方法公开(公告)号：US08412034B2
公开(公告)日：2013-04-02
申请号：US13048373
申请日：2011-03-15
申请人： Koji Okada
发明人： Koji Okada
IPC分类号： G03B17/56
CPC分类号： G03B17/14 , G03B17/565 , G03B2206/00
摘要： A camera system includes a camera body, an interchangeable lens, and an accessory to be mounted between the camera body and the interchangeable lens, wherein the accessory includes a signal processing unit configured to process a signal input into the accessory, a storage unit configured to store information used for performing the signal processing, and a blocking unit configured to prevent direct communication from the camera body to the interchangeable lens when the information stored in the storage unit is rewritten via the camera body.
摘要翻译： 相机系统包括相机主体，可互换镜头和要安装在相机主体和可更换镜头之间的附件，其中附件包括被配置为处理输入到附件中的信号的信号处理单元，配置为 存储用于执行信号处理的信息，以及阻挡单元，被配置为当存储在存储单元中的信息经由相机主体重写时，防止从相机主体到可互换镜头的直接通信。
-
公开(公告)号：US08381865B2
公开(公告)日：2013-02-26
申请号：US12581333
申请日：2009-10-19
申请人： Koji Okada
发明人： Koji Okada
IPC分类号： B60K13/04
CPC分类号： E02F9/0866 , E02F9/00
摘要： A gate-shaped muffler mount including front and rear leg portions and a muffler attaching portion is attached to a mounting bracket for supporting an engine with bolts so as to straddle a hydraulic pump. One of mounting holes has a diameter larger than the diameter of the bolt, and the muffler mount is therefore rotatable around the other bolt along the axial direction of a bellows. By this rotation, the bellows can be positionally adjusted in the axial direction relative to an engine exhaust pipe so that assembly errors can be absorbed.
摘要翻译： 包括前腿部分段和后腿部分以及消音器附接部分的门形消声器安装件安装在用螺栓支撑发动机以便跨越液压泵的安装支架上。 其中一个安装孔的直径大于螺栓的直径，因此消声器安装件可沿着波纹管的轴向方向围绕另一个螺栓旋转。 通过该旋转，波纹管可以相对于发动机排气管在轴向上进行位置调节，从而可以吸收组装误差。
-
-
-
-
-
-
-
-
-
搜索结果
156 条记录 (耗时 0.032 秒)
