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1.发明申请Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board 审中-公开聚酰亚胺树脂组合物，含聚酰胺树脂的聚合物膜和使用其的层压板以及制造印刷线路板的方法公开(公告)号：US20070269665A1
公开(公告)日：2007-11-22
申请号：US10557307
申请日：2004-05-17
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/06 , B32B27/34 , C08K5/37 , H05K1/0373 , H05K3/181 , H05K3/389 , H05K3/4661 , H05K2201/0154 , Y10T428/31681 , C08L79/08
摘要： The present invention relates to a polyimide resin composition including an organic thiol compound and a thermoplastic polyimide resin, a polymeric film containing the polyimide resin, a laminate including the same, and a printed circuit board. By using the polyimide resin composition, it is possible to form an electroless plating film having high adhesive strength even under high-temperature, high-humidity conditions in spite of the fact that the surface roughness of the insulating layer is extremely low. Furthermore, by using the polymeric film and a laminate including the polymeric film and a metal layer, it is possible to obtain a printed circuit board capable of forming high-density circuit and having excellent adhesiveness, and excellent adhesion reliability in a high-temperature, high-humidity environment.
摘要翻译： 本发明涉及包含有机硫醇化合物和热塑性聚酰亚胺树脂的聚酰亚胺树脂组合物，含有聚酰亚胺树脂的聚合物膜，包含该聚酰亚胺树脂的层压体和印刷电路板。 通过使用聚酰亚胺树脂组合物，即使在绝缘层的表面粗糙度非常低的情况下，即使在高温，高湿度条件下也可以形成具有高粘合强度的化学镀膜。 此外，通过使用聚合物膜和包含聚合物膜和金属层的层压体，可以获得能够形成高密度电路并且具有优异的粘合性的印刷电路板，并且在高温下具有优异的粘附可靠性， 高湿度环境。
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2.发明授权Thermosetting resin composition, multilayer body using same, and circuit board 有权热固性树脂组合物，使用其的多层体和电路板公开(公告)号：US08501874B2
公开(公告)日：2013-08-06
申请号：US12188898
申请日：2008-08-08
IPC分类号： A47G19/08 , B32B15/04 , B32B15/08 , C07F9/24 , C08F283/00 , C08F283/04 , C08G18/77 , C08G59/14 , C08G65/32 , C08G65/48 , C08G69/48 , C08G79/02 , C08K5/49 , C08K5/51 , C08K5/5399 , C08L61/00 , C08L61/04 , C08L63/00 , C08L67/00 , C08L71/02 , C08L71/12 , C08L75/04 , C08L77/00 , C08L85/02
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions.A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc.A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
摘要翻译： 本发明涉及适合用于制造柔性印刷电路板（FPC）和积聚电路板的电路板的热固性树脂组合物以及使用这种热固性树脂组合物制造的多层体和电路板。 热固性树脂组合物含有聚酰亚胺树脂组分（A），酚醛树脂组分（B）和环氧树脂组分（C）。 重量比（A）/ [（B）+（C）]的混合比在0.4至2.0的范围内，重量比为组分（A）的重量与总重量的比例 组分（B）和组分（C）。 通过使用这种热固性树脂组合物，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂（A），磷腈 化合物（D）和氰酸酯化合物（E）。 磷腈化合物（D）包括通过使苯氧基磷腈化合物（D-1）交联而制得的交联的苯氧基磷腈化合物（D-1）和/或交联的苯氧基磷腈化合物（D-1），交联的苯氧基磷腈化合物 -2）具有至少一个酚羟基。 通过使用这种热固性树脂组合物，可以制造介电特性，加工性，耐热性和阻燃性优异的多层体和电路板。
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3.发明申请公开(公告)号：US20070074896A1
公开(公告)日：2007-04-05
申请号：US11542229
申请日：2006-10-04
IPC分类号： H05K1/02
CPC分类号： B32B27/38 , B32B15/092 , B32B15/20 , B32B27/281 , B32B2270/00 , B32B2307/206 , B32B2307/306 , B32B2457/08 , C08G59/4042 , H05K1/0353 , H05K2201/0154
摘要： It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition. The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).
摘要翻译： 本发明的目的是提供一种在GHz频带中具有令人满意的粘合性，良好的加工性，高耐热性和优异的介电特性的热固性树脂组合物; 以及包含所述热固性树脂组合物的层压体和电路板。 本发明提供一种包含含有至少一种具有特定结构的酰亚胺低聚物的酰亚胺低聚物组分（A）和含有至少一种环氧树脂的环氧树脂组分（B）的热固性树脂组合物。 此外，本发明还提供还包含聚酰亚胺树脂组分（C）的热固性树脂组合物。
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4.发明申请LAMINATE, METHOD FOR PRODUCING LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开层压板，生产层压板的方法，柔性印刷电路板及制造柔性印刷电路板的方法公开(公告)号：US20100266850A1
公开(公告)日：2010-10-21
申请号：US12746959
申请日：2008-12-03
CPC分类号： H05K3/387 , H05K1/036 , H05K1/0393 , H05K2201/0129 , H05K2201/0141 , H05K2203/1105 , Y10T428/31504
摘要： An object of the present invention is to improve, in a laminate and a flexible printed circuit board obtained using the laminate, (i) adhesiveness between a resin material and a plating layer and (ii) soldering heat resistance after moisture absorption. This object is attained by a method for producing a laminate including at least a polymer film, a to-be-plated layer containing at least a crystalline thermoplastic resin, and a plating layer, said method including the steps of: A) applying plating to a resin material including at least a polymer film and a to-be-plated layer containing at least a crystalline thermoplastic resin, in order to produce a laminate including at least the polymer film, the to-be-plated layer containing at least the crystalline thermoplastic resin, and a plating layer: and B) heating the laminate.
摘要翻译： 本发明的目的在于提高使用层叠体得到的层叠体和柔性印刷电路板，（i）树脂材料与镀层之间的粘合性，（ii）吸湿后的耐热性。 该目的通过一种用于制造至少包含聚合物膜，至少含有结晶热塑性树脂的镀覆层和镀层的层压体的方法来实现，所述方法包括以下步骤：A）将电镀施加到 至少包含聚合物膜和至少含有结晶热塑性树脂的被镀层的树脂材料，以便制造至少包含聚合物膜的层压体，至少含有晶体的结晶 热塑性树脂和镀层; B）加热层压体。
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5.发明授权Thermosetting resin composition, multilayer body using same, and circuit board 有权热固性树脂组合物，使用其的多层体和电路板公开(公告)号：US07521511B2
公开(公告)日：2009-04-21
申请号：US10552540
申请日：2004-04-12
IPC分类号： A47G19/08 , B32B15/04 , B32B15/08 , C08J3/00 , C08K5/49 , C08K5/51 , C08L61/00 , C08L61/04 , C08L63/00 , C08L67/00 , C08L71/02 , C08L71/12
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group. By using such a composition, multilayer bodies and circuit boards with excellent properties can be manufactured.
摘要翻译： 提供了用于制造电路板和积聚电路板和堆积板的热固性树脂组合物，以及使用这些组合物制造的多层体和电路板。 组合物含有聚酰亚胺树脂（A），酚醛树脂（B）和环氧树脂（C）成分。 混合比例（A）/ [（B）+（C）]为0.4〜2.0，该比例为（A）与（B）和（C）的总重量之比。 通过使用这样的组成，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。 组合物含有聚酰亚胺树脂（A），磷腈（D）和氰酸酯（E）。 D包括通过交联（D-1），具有至少一个酚羟基的（D-2））制备的含酚羟基的苯氧基磷腈（D-1）和/或交联的苯氧基磷腈（D-2）。 通过使用这样的组合物，可以制造具有优异性能的多层体和电路板。
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6.发明申请Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board 有权热固性树脂组合物，使用其的多层体和电路板公开(公告)号：US20080306220A1
公开(公告)日：2008-12-11
申请号：US12188898
申请日：2008-08-08
IPC分类号： C08G73/10
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions.A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc.A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the 4 phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
摘要翻译： 本发明涉及适合用于制造柔性印刷电路板（FPC）和积聚电路板的电路板的热固性树脂组合物以及使用这种热固性树脂组合物制造的多层体和电路板。 热固性树脂组合物含有聚酰亚胺树脂组分（A），酚醛树脂组分（B）和环氧树脂组分（C）。 重量比（A）/ [（B）+（C）]的混合比在0.4至2.0的范围内，重量比为组分（A）的重量与总重量的比例 组分（B）和组分（C）。 通过使用这种热固性树脂组合物，可以制造介电特性，粘合性，加工性，耐热性，流动性等优异的多层体和电路板。热固性树脂组合物含有聚酰亚胺树脂（A），磷腈 化合物（D）和氰酸酯化合物（E）。 磷腈化合物（D）包括通过使4苯氧基磷腈化合物（D-1），交联的苯氧基磷腈化合物（D-2）交联而制备的含酚羟基的苯氧基磷腈化合物（D-1）和/或交联的苯氧基磷腈化合物 D-2）具有至少一个酚羟基。 通过使用这种热固性树脂组合物，可以制造介电特性，加工性，耐热性和阻燃性优异的多层体和电路板。
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7.发明授权公开(公告)号：US08067523B2
公开(公告)日：2011-11-29
申请号：US11542229
申请日：2006-10-04
IPC分类号： C08G65/00
CPC分类号： B32B27/38 , B32B15/092 , B32B15/20 , B32B27/281 , B32B2270/00 , B32B2307/206 , B32B2307/306 , B32B2457/08 , C08G59/4042 , H05K1/0353 , H05K2201/0154
摘要： It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition.The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).
摘要翻译： 本发明的目的是提供一种在GHz频带中具有令人满意的粘合性，良好的加工性，高耐热性和优异的介电特性的热固性树脂组合物; 以及包含所述热固性树脂组合物的层压体和电路板。 本发明提供一种包含含有至少一种具有特定结构的酰亚胺低聚物的酰亚胺低聚物组分（A）和含有至少一种环氧树脂的环氧树脂组分（B）的热固性树脂组合物。 此外，本发明还提供还包含聚酰亚胺树脂组分（C）的热固性树脂组合物。
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公开(公告)号：US20060205891A1
公开(公告)日：2006-09-14
申请号：US10552540
申请日：2004-04-12
IPC分类号： C08G65/48
CPC分类号： C08L79/08 , C08L63/00 , C08L2205/03 , H05K3/4676 , H05K2201/0154 , Y10T428/12569 , Y10T428/31678 , Y10T428/31681
摘要： The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.
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