公开(公告)号：US09859146B2

公开(公告)日：2018-01-02

申请号：US14238860

申请日：2012-08-13

申请人： Shinji Himori ,  Yoshiyuki Kobayashi ,  Takehiro Kato ,  Etsuji Ito

发明人： Shinji Himori ,  Yoshiyuki Kobayashi ,  Takehiro Kato ,  Etsuji Ito

IPC分类号： H01L21/00 ,  H01L21/687 ,  H01L21/306 ,  H01L21/67

CPC分类号： H01L21/68742 ,  H01L21/30604 ,  H01L21/67063

摘要： A semiconductor manufacturing device includes a stage, a plurality of pins, and a driving unit. The stage includes a mounting surface. The mounting surface has a first region for mounting thereon a substrate, and a second region for mounting thereon a focus ring. The second region is provided to surround the first region. A plurality of holes is formed in the stage. The holes extend in a direction that intersects the mounting surface while passing through the boundary between the first region and the second region. The pins are provided in the respective holes. Each of the pins has a first and a second upper end surface. The second upper end surface is provided above the first upper end surface, and is offset towards the first region with respect to the first upper end surface. The driving unit moves the pins up and down in the aforementioned direction.

公开(公告)号：US20140213055A1

公开(公告)日：2014-07-31

申请号：US14238860

申请日：2012-08-13

申请人： Shinji Himori ,  Yoshiyuki Kobayashi ,  Takehiro Kato ,  Etsuji Ito

发明人： Shinji Himori ,  Yoshiyuki Kobayashi ,  Takehiro Kato ,  Etsuji Ito

IPC分类号： H01L21/687 ,  H01L21/67 ,  H01L21/306

CPC分类号： H01L21/68742 ,  H01L21/30604 ,  H01L21/67063

摘要： A semiconductor manufacturing device includes a stage, a plurality of pins, and a driving unit. The stage includes a mounting surface. The mounting surface has a first region for mounting thereon a substrate, and a second region for mounting thereon a focus ring. The second region is provided to surround the first region. A plurality of holes is formed in the stage. The holes extend in a direction that intersects the mounting surface while passing through the boundary between the first region and the second region. The pins are provided in the respective holes. Each of the pins has a first and a second upper end surface. The second. upper end surface is provided above the first upper end surface, and is offset towards the first region with respect to the first upper end surface. The driving unit moves the pins up and down in the aforementioned direction.

摘要翻译： 半导体制造装置包括台，多个销和驱动单元。 舞台包括安装表面。 安装表面具有用于在其上安装基板的第一区域和用于在其上安装聚焦环的第二区域。 第二区域设置成围绕第一区域。 在台阶上形成多个孔。 这些孔在穿过第一区域和第二区域之间的边界的同时沿着与安装表面相交的方向延伸。 销设置在相应的孔中。 每个销具有第一和第二上端表面。 第二。 上端表面设置在第一上端表面上方，并且相对于第一上端表面偏移到第一区域。 驱动单元在上述方向上上下移动销。

公开(公告)号：US10147633B2

公开(公告)日：2018-12-04

申请号：US13611327

申请日：2012-09-12

申请人： Shinji Himori ,  Takehiro Kato ,  Etsuji Ito

发明人： Shinji Himori ,  Takehiro Kato ,  Etsuji Ito

IPC分类号： B65G43/00 ,  B65G47/90 ,  H01L21/677 ,  H01L21/687

摘要： A transfer apparatus transfers an object to be transferred onto a case. The transfer apparatus includes a transfer arm, an arm shaft, a plurality of electromagnets, and a control unit. The transfer arm has a pick unit on a front end thereof and extends and retracts in a horizontal direction. The object to be transferred is held on the pick unit. The arm shaft supports the transfer arm. The plurality of electromagnets apply an force in upward direction to the transfer arm by generating a magnetic field in the case. The control unit controls the plurality of electromagnets in such a manner that when the transfer arm extends and retracts in the horizontal direction, the force in upward direction applied to the transfer arm increases as a length from the arm shaft to the front end of the transfer arm increases.

公开(公告)号：US07368876B2

公开(公告)日：2008-05-06

申请号：US10854142

申请日：2004-05-27

申请人： Toshihiro Hayami ,  Etsuji Ito ,  Itsuko Sakai

发明人： Toshihiro Hayami ,  Etsuji Ito ,  Itsuko Sakai

IPC分类号： H01J7/24

CPC分类号： H01J37/32174 ,  H01J37/32082

摘要： A low-cost plasma processing apparatus which permits reduction of the cost, as well as reduction of the loss of transmitted power. The plasma processing apparatus 1 has an apparatus main body 2 and auxiliary equipment 3. The auxiliary equipment 3 is comprised of a power supply apparatus 5 that supplies power to a processing chamber 4, and a plurality of dry pumps 6 and 7, and so on. The power supply apparatus 5 is comprised of a matching unit 9, an RF amplifier 13 that is connected to the matching unit 9 via a coaxial cable 24, and a power controller 12 having a DC amplifier 14 therein. The RF amplifier 13 is formed in a separate body to the DC amplifier 14 and disposed in a position away from the DC amplifier 14 and close to the matching unit 9, and is connected to the DC amplifier 14 via an ordinary cable 25.

摘要翻译： 一种低成本的等离子体处理装置，其允许降低成本，并且减少发射功率的损失。 等离子体处理装置1具有装置主体2和辅助装置3。 辅助设备3包括向处理室4供电的供电设备5和多个干泵6和7等。 电源装置5由匹配单元9，经由同轴电缆24连接到匹配单元9的RF放大器13以及其中具有DC放大器14的功率控制器12组成。 RF放大器13形成在与DC放大器14分离的主体中，并且设置在远离DC放大器14并靠近匹配单元9的位置，并且通过普通电缆25连接到DC放大器14。

公开(公告)号：US20050011452A1

公开(公告)日：2005-01-20

申请号：US10854142

申请日：2004-05-27

申请人： Toshihiro Hayami ,  Etsuji Ito ,  Itsuko Sakai

发明人： Toshihiro Hayami ,  Etsuji Ito ,  Itsuko Sakai

IPC分类号： H01J37/32 ,  C23C16/00

CPC分类号： H01J37/32174 ,  H01J37/32082

摘要： A low-cost plasma processing apparatus which permits reduction of the cost, as well as reduction of the loss of transmitted power. The plasma processing apparatus 1 has an apparatus main body 2 and auxiliary equipment 3. The auxiliary equipment 3 is comprised of a power supply apparatus 5 that supplies power to a processing chamber 4, and a plurality of dry pumps 6 and 7, and so on. The power supply apparatus 5 is comprised of a matching unit 9, an RF amplifier 13 that is connected to the matching unit 9 via a coaxial cable 24, and a power controller 12 having a DC amplifier 14 therein. The RF amplifier 13 is formed in a separate body to the DC amplifier 14 and disposed in a position away from the DC amplifier 14 and close to the matching unit 9, and is connected to the DC amplifier 14 via an ordinary cable 25.

摘要翻译： 一种低成本的等离子体处理装置，其允许降低成本，并且减少发射功率的损失。 等离子体处理装置1具有设备主体2和辅助设备3.辅助设备3包括向处理室4供电的供电设备5和多个干泵6和7等 。 电源装置5由匹配单元9，经由同轴电缆24连接到匹配单元9的RF放大器13以及其中具有DC放大器14的功率控制器12组成。 RF放大器13形成在与DC放大器14分离的主体中，并且设置在远离DC放大器14并靠近匹配单元9的位置，并且通过普通电缆25连接到DC放大器14。