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    Method of manufacturing semiconductor wafer and system therefor
    1.
    发明授权
    Method of manufacturing semiconductor wafer and system therefor 失效
    制造半导体晶片的方法及其系统

    公开(公告)号：US5427644A

    公开(公告)日：1995-06-27

    申请号：US167025

    申请日：1993-12-16

    申请人： Shinji Nagatsuka ,  Takeshi Kagamida

    发明人： Shinji Nagatsuka ,  Takeshi Kagamida

    IPC分类号： B28D5/00 ,  H01L21/00 ,  H01L21/677 ,  B32B35/00

    CPC分类号： H01L21/67028 ,  B28D5/0082 ,  H01L21/6776 ,  Y10S156/93 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T83/0472

    摘要： An ingot is conveyed to a slicing machine by an ingot loader. Then, the ingot is cut into a wafer by the slicing machine. And, the cut wafer is conveyed to a peel-off portion and soaked in a warm water tank for a predetermined time so that the adhesive of the slice base can be heat softened, and then the slice base is hammered by a hammer rod so as to be peeled off from the wafer. Further, the wafer, from which the slice base has been peeled off, is conveyed to a wash-dry device, and washed and dried. The washed and dried wafer is conveyed to a surface inspecting device by a conveying device and judged a pass or fail to the wafer standard in the surface inspecting device. And, the passed wafer is conveyed to a chamfering device and the edge of the wafer is chamfered by the chamfering device. Then, the chamfered wafer is washed and dried by a wash-dry device, thereafter, conveyed to the storing part by the conveying device and stored.

    摘要翻译： 锭通过锭装载机输送到切片机。 然后，通过切片机将锭切成晶片。 并且，将切割的晶片输送到剥离部分并在温水槽中浸泡预定时间，使得切片基底的粘合剂可以被热软化，然后通过锤杆锤击切片基底，以便 从晶片剥离。 此外，切片基底已被剥离的晶片被输送到洗涤 - 干燥装置，并洗涤和干燥。 经洗涤并干燥的晶片通过输送装置输送到表面检查装置，并在表面检查装置中判断通过或不符合晶片标准。 并且，将经过的晶片输送到倒角装置，并且通过倒角装置对晶片的边缘进行倒角。 然后，通过洗涤干燥装置洗涤并干燥倒角的晶片，然后通过输送装置输送到存储部分并储存。

    Workpiece measuring apparatus
    2.
    发明授权
    Workpiece measuring apparatus 失效

    公开(公告)号：US06742273B2

    公开(公告)日：2004-06-01

    申请号：US10232946

    申请日：2002-08-30

    申请人： Shinji Nagatsuka ,  Mamoru Kamiya ,  Yoichi Kawasaki

    发明人： Shinji Nagatsuka ,  Mamoru Kamiya ,  Yoichi Kawasaki

    IPC分类号： G01B500

    CPC分类号： G01B5/0002 ,  B23Q17/20 ,  B24B49/02

    摘要： A workpiece measuring apparatus for measuring at least one of a size and a shape of a workpiece, machined by a turning or a grinding process system, includes a machine base, a column mounted on the machine base and having a mounting mechanism on at least one of the sides thereof, a measuring gauge unit removably mounted at an arbitrary position on the mounting mechanism of the column, and a conveying unit for conveying the machined workpiece to the measurement position where measurement can be performed by the measuring gauge unit. Thus, in the workpiece measuring apparatus according to the present invention, a measuring gauge unit can be fixedly added or removed in response to the change in the shape of the workpiece or the number of the desired measurement points.