公开(公告)号：US20130038140A1

公开(公告)日：2013-02-14

申请号：US13643853

申请日：2011-04-08

申请人： Shinsei Seki ,  Sadao Shinohara

发明人： Shinsei Seki ,  Sadao Shinohara

IPC分类号： H01H47/00

CPC分类号： H02M7/53873 ,  H02P27/08 ,  H03K17/08142 ,  H03K17/145 ,  H03K17/74 ,  H03K2017/0806 ,  H03K2217/0036 ,  Y02B70/1483 ,  Y10T307/747

摘要： Provided is a switching circuit including an arm having two switching elements connected. The switching elements are SiC semiconductors, and when a commutation current flows to the reverse conducting element, the switching element having the reverse conducting element connected in parallel thereto is turned on.

摘要翻译： 提供一种包括连接有两个开关元件的臂的开关电路。 开关元件是SiC半导体，并且当换向电流流向反向导通元件时，具有并联连接的反向导通元件的开关元件导通。

公开(公告)号：US08654554B2

公开(公告)日：2014-02-18

申请号：US13548209

申请日：2012-07-13

申请人： Shinsei Seki

发明人： Shinsei Seki

IPC分类号： H02M7/537

CPC分类号： H02M7/003 ,  H01L23/36 ,  H01L23/492 ,  H01L24/32 ,  H01L24/33 ,  H01L25/071 ,  H01L25/18 ,  H01L2224/32012 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H02M2001/123 ,  H02M2001/327 ,  H01L2924/00

摘要： A semiconductor device includes at least one arm series circuit, a conductive first thermal buffer member, and a conductive second thermal buffer member. The arm series circuit includes an upper arm, a lower arm, a positive-electrode terminal, a negative-electrode terminal, and an output terminal. The first thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the first switching device and smaller than a linear expansion coefficient of one of the positive-electrode terminal and the output terminal. The second thermal buffer member has a linear expansion coefficient greater than a linear expansion coefficient of the second switching device and smaller than a linear expansion coefficient of one of the negative-electrode terminal and the output terminal.

摘要翻译： 半导体器件包括至少一个臂串联电路，导电第一热缓冲元件和导电的第二热缓冲元件。 臂串联电路包括上臂，下臂，正极端子，负极端子和输出端子。 第一热缓冲部件的线膨胀系数大于第一开关装置的线膨胀系数，并且小于正极端子和输出端子之一的线膨胀系数。 第二热缓冲构件的线膨胀系数大于第二开关装置的线性膨胀系数，并且小于负极端子和输出端子之一的线性膨胀系数。

公开(公告)号：US20130069573A1

公开(公告)日：2013-03-21

申请号：US13637935

申请日：2011-03-09

申请人： Shinsei Seki

发明人： Shinsei Seki

IPC分类号： H02P6/14

CPC分类号： H05K7/1432 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/492 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L25/071 ,  H01L25/18 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In the motor-driving circuit module, a first electrode surface of a first electrode and a third electrode surface of a third electrode are arranged so as to face each other and such that currents flow in opposite directions in the first electrode and the third electrode when a current flows through the first electrode. Additionally, a second electrode surface of a second electrode and the third electrode surface of the third electrode are arranged so as to face each other and such that currents flow in opposite directions in the second electrode and the third electrode when a current flows through the second electrode.

摘要翻译： 在马达驱动电路模块中，第一电极的第一电极表面和第三电极的第三电极表面被布置成彼此面对，使得电流在第一电极和第三电极中沿相反方向流动， 电流流过第一电极。 此外，第二电极的第二电极表面和第三电极的第三电极表面布置成彼此面对，并且当电流流过第二电极和第二电极时，电流在第二电极和第三电极中沿相反方向流动 电极。