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1.发明授权公开(公告)号：US08268195B2
公开(公告)日：2012-09-18
申请号：US12388862
申请日：2009-02-19
CPC分类号： C09D5/24 , C08G2261/1424 , C08G2261/3223 , C08G2261/3243 , C08G2261/722 , C08G2261/794 , C08L71/00 , C08L79/02 , C08L81/06 , C09D7/65 , C09D11/52 , C09D165/00 , C09D179/04 , H01B1/127 , H01B1/128 , H01L51/0037 , H01L51/105 , H01L51/5203 , Y02E10/549 , C08L81/00 , C08L2666/22 , C08L71/126
摘要： An aqueous dispersion and a method for making an aqueous dispersion. The dispersion including at least one conductive polymer such as a polythienothiophene, at least one ether containing polymer and optionally at least one colloid-forming polymeric acid and one non-fluorinated polymeric acid. Devices utilizing layers formed of the inventive dispersions are also disclosed.
摘要翻译： 水性分散体和水分散体的制造方法。 该分散体包括至少一种导电聚合物如聚噻吩并噻吩，至少一种含醚聚合物和任选的至少一种胶体形成聚合酸和一种非氟化聚合酸。 还公开了利用由本发明分散体形成的层的装置。
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2.发明申请公开(公告)号：US20100081007A1
公开(公告)日：2010-04-01
申请号：US12388862
申请日：2009-02-19
CPC分类号： C09D5/24 , C08G2261/1424 , C08G2261/3223 , C08G2261/3243 , C08G2261/722 , C08G2261/794 , C08L71/00 , C08L79/02 , C08L81/06 , C09D7/65 , C09D11/52 , C09D165/00 , C09D179/04 , H01B1/127 , H01B1/128 , H01L51/0037 , H01L51/105 , H01L51/5203 , Y02E10/549 , C08L81/00 , C08L2666/22 , C08L71/126
摘要： An aqueous dispersion and a method for making an aqueous dispersion. The dispersion including at least one conductive polymer such as a polythienothiophene, at least one ether containing polymer and optionally at least one colloid-forming polymeric acid and one non-fluorinated polymeric acid. Devices utilizing layers formed of the inventive dispersions are also disclosed.
摘要翻译： 水性分散体和水分散体的制造方法。 该分散体包括至少一种导电聚合物如聚噻吩并噻吩，至少一种含醚聚合物和任选的至少一种胶体形成聚合酸和一种非氟化聚合酸。 还公开了利用由本发明分散体形成的层的装置。
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公开(公告)号：US20090107543A1
公开(公告)日：2009-04-30
申请号：US12248098
申请日：2008-10-09
CPC分类号： C08L65/00 , C08J3/05 , C08J7/047 , C08L27/18 , Y10T428/31786
摘要： An aqueous dispersion including a partially fluorinated dispersant, an electrically conductive polymer and a film forming additive. The film forming additive includes a boiling temperature greater than about 85° C. (185° F.). In addition, the concentration of the film forming additive is less than the solubility limit of the additive in water. The dynamic surface tension of the dispersion including the film forming additive is less than about 60 dynes/cm at 100 ms surface age. A method for making an electrically conductive polymer film and devices including electrically conductive polymer film are also disclosed.
摘要翻译： 包含部分氟化分散剂，导电聚合物和成膜添加剂的水分散体。 成膜添加剂包括大于约85℃（185°F）的沸点温度。 此外，成膜添加剂的浓度小于添加剂在水中的溶解度极限。 包括成膜添加剂的分散体的动态表面张力在100ms的表面寿命时小于约60达因/厘米。 还公开了制造导电聚合物膜的方法和包括导电聚合物膜的器件。
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公开(公告)号：US08183319B2
公开(公告)日：2012-05-22
申请号：US12248098
申请日：2008-10-09
IPC分类号： C08L27/18
CPC分类号： C08L65/00 , C08J3/05 , C08J7/047 , C08L27/18 , Y10T428/31786
摘要： An aqueous dispersion including a partially fluorinated dispersant, an electrically conductive polymer and a film forming additive. The film forming additive includes a boiling temperature greater than about 85° C. (185° F.). In addition, the concentration of the film forming additive is less than the solubility limit of the additive in water. The dynamic surface tension of the dispersion including the film forming additive is less than about 60 dynes/cm at 100 ms surface age. A method for making an electrically conductive polymer film and devices including electrically conductive polymer film are also disclosed.
摘要翻译： 包含部分氟化分散剂，导电聚合物和成膜添加剂的水分散体。 成膜添加剂包括大于约85℃（185°F）的沸点温度。 此外，成膜添加剂的浓度小于添加剂在水中的溶解度极限。 包括成膜添加剂的分散体的动态表面张力在100ms的表面寿命时小于约60达因/厘米。 还公开了制造导电聚合物膜的方法和包括导电聚合物膜的器件。
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公开(公告)号：US20090236979A1
公开(公告)日：2009-09-24
申请号：US12403511
申请日：2009-03-13
CPC分类号： H01L51/56 , H01L51/0037 , H01L51/5012 , H01L51/5048
摘要： The light-emitting device comprising an anode, a cathode, a semi-conducting layer between the anode and the cathode and a hole injection layer comprising a conducting polymer between the anode and the semi-conducting layer; where an interfacial bonding layer is formed in-situ between the hole injection layer and the semi-conducting is disclosed.
摘要翻译： 该发光装置包括阳极，阴极，阳极和阴极之间的半导体层，以及在阳极和半导体层之间包含导电聚合物的空穴注入层; 其中公开了在空穴注入层和半导体之间原位形成界面结合层。
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