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29 条记录 (耗时 0.028 秒)

    LED lamp module
    1.
    发明授权
    LED lamp module 有权
    LED灯模组

    公开(公告)号：US08643271B2

    公开(公告)日：2014-02-04

    申请号：US12320824

    申请日：2009-02-05

    申请人： Shota Shimonishi ,  Hiroyuki Tajima ,  Toshimasa Hayashi ,  Hideki Kokubu

    发明人： Shota Shimonishi ,  Hiroyuki Tajima ,  Toshimasa Hayashi ,  Hideki Kokubu

    IPC分类号： H01L23/02

    CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V19/0015 ,  F21V29/87 ,  F21V29/89 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp.

    摘要翻译： 本发明提供一种LED灯模块，包括金属基座，安装在金属基底上的柔性基板，具有通孔，表面安装型LED灯，其包括在陶瓷封装的背面上具有突出部分的陶瓷封装， LED芯片安装在陶瓷封装上，并具有光输出面。 突出部分通过通孔与金属基座热连接，并且LED灯通过导电构件在突出部分之外的部分处与柔性板电连接。 LED灯模块包括覆盖除了光输出表面之外的LED灯的一部分的盖和柔性板并按压LED灯。

    LED lamp module
    2.
    发明申请
    LED lamp module 有权
    LED灯模组

    公开(公告)号：US20090206718A1

    公开(公告)日：2009-08-20

    申请号：US12320824

    申请日：2009-02-05

    申请人： Shota Shimonishi ,  Hiroyuki Tajima ,  Toshimasa Hayashi ,  Hideki Kokubu

    发明人： Shota Shimonishi ,  Hiroyuki Tajima ,  Toshimasa Hayashi ,  Hideki Kokubu

    IPC分类号： H01J61/52

    CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V19/0015 ,  F21V29/87 ,  F21V29/89 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp

    摘要翻译： 本发明提供一种LED灯模块，包括金属基座，安装在金属基底上的柔性基板，具有通孔，表面安装型LED灯，其包括在陶瓷封装的背面上具有突出部分的陶瓷封装， LED芯片安装在陶瓷封装上，并具有光输出面。 突出部分通过通孔与金属基座热连接，并且LED灯通过导电构件在突出部分之外的部分处与柔性板电连接。 LED灯模块包括覆盖除了光输出表面之外的LED灯的一部分的盖和柔性板并按压LED灯

    Light-emitting device
    5.
    发明申请
    Light-emitting device 有权
    发光装置

    公开(公告)号：US20080225532A1

    公开(公告)日：2008-09-18

    申请号：US12073466

    申请日：2008-03-05

    申请人： Hideki Kokubu ,  Toshimasa Hayashi ,  Kenichi Koya ,  Michio Miyawaki

    发明人： Hideki Kokubu ,  Toshimasa Hayashi ,  Kenichi Koya ,  Michio Miyawaki

    IPC分类号： F21V15/00

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H04M1/22 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227

    摘要： In a light-emitting device including a base body portion which is configured by integrally forming a reflection case and a terminal holding portion provided at the rear portion of the reflection case and lead members to be inserted into the base body portion, portions of the lead members extracted outside of the base body portion are bent along the terminal holding portion to form a pair of connection portions to be connected to the pattern of a wiring board, respectively, a plurality of radiation plates are provided at the lead member. The plurality of the radiation plates are extracted from the same surface (lower surface) of the base body portion. Since the plurality of radiation plates are provided, at the time of being the radiation plates, the base body portion is prevented from being applied with an excessive force and the damage of the base body portion can be prevented.

    摘要翻译： 在包括通过一体地形成反射壳体的基体部分和设置在反射壳体的后部的端子保持部分和插入到基体部分中的引线部件的发光装置中，引线的部分 从基体部抽出的部件沿着端子保持部弯曲，分别与布线基板的图形连接形成一对连接部，多个放射板设置在引导部件上。 多个辐射板从基体部分的相同表面（下表面）提取出来。 由于设置了多个辐射板，所以在放射板的作用下，防止基体部分施加过大的力并且可以防止基体部分的损坏。

    Light emitting device
    6.
    发明授权
    Light emitting device 失效
    发光装置

    公开(公告)号：US08698187B2

    公开(公告)日：2014-04-15

    申请号：US13200647

    申请日：2011-09-28

    申请人： Hideki Kokubu ,  Kosei Fukui ,  Toshimasa Hayashi

    发明人： Hideki Kokubu ,  Kosei Fukui ,  Toshimasa Hayashi

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device comprises a case having a space therein, the space defined by an inner bottom surface and an inner side surface of the case, a lead frame housed in the space, and having a bending portion bent along the inner side surface of the case, and a light emitting element electrically connected to the lead frame, wherein a rear surface of the bending portion is embedded in the case and a front surface of the bending portion is exposed from the inner side surface of the case so as to oppose the light emitting element, and wherein a projecting portion projected from the inner bottom surface and inclined to the inner side surface of the case is formed on the inner side surface of the case.

    摘要翻译： 发光装置包括壳体，其中具有由壳体的内底表面和内侧表面限定的空间，容纳在该空间中的引线框架，并且具有弯曲部分沿着 壳体和电连接到引线框架的发光元件，其中弯曲部分的后表面嵌入壳体中，并且弯曲部分的前表面从壳体的内侧表面暴露以与壳体相对 发光元件，并且其中从所述内底面突出并且倾斜于所述壳体的内侧表面的突出部分形成在所述壳体的内侧表面上。

    Light emitting device
    10.
    发明申请
    Light emitting device 有权
    发光装置

    公开(公告)号：US20090167142A1

    公开(公告)日：2009-07-02

    申请号：US12318340

    申请日：2008-12-24

    申请人： Hideki Kokubu ,  Toshimasa Hayashi ,  Yuhki Ito ,  Michio Miyawaki

    发明人： Hideki Kokubu ,  Toshimasa Hayashi ,  Yuhki Ito ,  Michio Miyawaki

    IPC分类号： H01J5/48

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a side surface light emitting type light emitting device mounted on the surface of a wiring board, the light emitting device comprises: a base body part having a reflecting case and a terminal holding part formed integrally with the reflecting case in the rear part of the reflecting case; and lead members inserted into the base body part, having a pair of connecting parts including base parts of the connecting parts drawn out from the lower surface of the base body part and bent along the lower surface and side bending parts provided in the base parts of the connecting parts and bent along the side surfaces of the terminal holding part and connected to a pattern of the wiring board; and is characterized in that the base parts of the connecting parts are provided with protruding parts protruding toward the center of the lower surface of the terminal holding part and cut-out parts are provided for accommodating the protruding parts in the lower surface of the terminal holding part.

    摘要翻译： 在安装在布线板的表面上的侧面发光型发光器件中，发光器件包括：基体部分，其具有反射壳体和端子保持部分，该反射壳体与端子保持部分一体形成在反射壳体的后部 反映案例 以及引导部件插入到基体部分中，具有一对连接部分，包括从基体部分的下表面引出并沿着下表面弯曲的连接部分的基部，以及设置在基体部分的基部中的侧弯曲部分 所述连接部分沿着所述端子保持部分的侧表面弯曲并连接到所述布线板的图案; 其特征在于，连接部的基部具有朝向端子保持部的下表面的中心突出的突出部，并且设置有用于将突出部容纳在端子保持部的下表面中的切口部 部分。