公开(公告)号：US20080225532A1

公开(公告)日：2008-09-18

申请号：US12073466

申请日：2008-03-05

申请人： Hideki Kokubu ,  Toshimasa Hayashi ,  Kenichi Koya ,  Michio Miyawaki

发明人： Hideki Kokubu ,  Toshimasa Hayashi ,  Kenichi Koya ,  Michio Miyawaki

IPC分类号： F21V15/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H04M1/22 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227

摘要： In a light-emitting device including a base body portion which is configured by integrally forming a reflection case and a terminal holding portion provided at the rear portion of the reflection case and lead members to be inserted into the base body portion, portions of the lead members extracted outside of the base body portion are bent along the terminal holding portion to form a pair of connection portions to be connected to the pattern of a wiring board, respectively, a plurality of radiation plates are provided at the lead member. The plurality of the radiation plates are extracted from the same surface (lower surface) of the base body portion. Since the plurality of radiation plates are provided, at the time of being the radiation plates, the base body portion is prevented from being applied with an excessive force and the damage of the base body portion can be prevented.

摘要翻译： 在包括通过一体地形成反射壳体的基体部分和设置在反射壳体的后部的端子保持部分和插入到基体部分中的引线部件的发光装置中，引线的部分 从基体部抽出的部件沿着端子保持部弯曲，分别与布线基板的图形连接形成一对连接部，多个放射板设置在引导部件上。 多个辐射板从基体部分的相同表面（下表面）提取出来。 由于设置了多个辐射板，所以在放射板的作用下，防止基体部分施加过大的力并且可以防止基体部分的损坏。

公开(公告)号：US07993038B2

公开(公告)日：2011-08-09

申请号：US12073466

申请日：2008-03-05

申请人： Hideki Kokubu ,  Toshimasa Hayashi ,  Kenichi Koya ,  Michio Miyawaki

发明人： Hideki Kokubu ,  Toshimasa Hayashi ,  Kenichi Koya ,  Michio Miyawaki

IPC分类号： F21V15/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H04M1/22 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227

摘要： In a light-emitting device including a base body portion which is configured by integrally forming a reflection case and a terminal holding portion provided at the rear portion of the reflection case and lead members to be inserted into the base body portion, portions of the lead members extracted outside of the base body portion are bent along the terminal holding portion to form a pair of connection portions to be connected to the pattern of a wiring board, respectively, a plurality of radiation plates are provided at the lead member. The plurality of the radiation plates are extracted from the same surface (lower surface) of the base body portion. Since the plurality of radiation plates are provided, at the time of being the radiation plates, the base body portion is prevented from being applied with an excessive force and the damage of the base body portion can be prevented.

摘要翻译： 在包括通过一体地形成反射壳体的基体部分和设置在反射壳体的后部的端子保持部分和插入到基体部分中的引线部件的发光装置中，引线的部分 从基体部抽出的部件沿着端子保持部弯曲，分别与布线基板的图形连接形成一对连接部，多个放射板设置在引导部件上。 多个辐射板从基体部分的相同表面（下表面）提取出来。 由于设置了多个辐射板，所以在放射板的作用下，防止基体部分施加过大的力并且可以防止基体部分的损坏。

公开(公告)号：US20130043502A1

公开(公告)日：2013-02-21

申请号：US13695752

申请日：2011-03-26

申请人： Kenichi Koya ,  Tadaaki Ikeda ,  Michio Miyawaki ,  Hiroki Utatsu

发明人： Kenichi Koya ,  Tadaaki Ikeda ,  Michio Miyawaki ,  Hiroki Utatsu

IPC分类号： H01L33/62 ,  H01L33/60

CPC分类号： H01L33/486 ,  B29C39/10 ,  B29C45/14639 ,  B29L2011/00 ,  H01L24/48 ,  H01L24/73 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A light emitting device 10 includes a light emitting element 11, a package 13 in which the light emitting element 11 is accommodated, and a sealing member 14 configured to seal the light emitting element 11. The package 13 includes a base 13B configured to hold the light emitting element 11 and a frame part 13A vertically standing on the base 13B so as to surround the light emitting element 11. The sealing member 14 is embedded in a region surrounded by the frame part 13A. The frame part 13A includes a protruding wall 15 upwardly protruding from an upper end surface 132a of the frame part 13A and provided so as to surround the light emitting element 11.

摘要翻译： 发光器件10包括发光元件11，容纳有发光元件11的封装13以及密封构件14，密封构件14用于密封发光元件11.封装13包括：基座13B， 发光元件11和围绕发光元件11的底座13B垂直地竖立的框架部13A。密封构件14嵌入由框架部13A包围的区域中。 框架部13A包括从框架部13A的上端面132a向上方突出并设置为围绕发光元件11的突出壁15。

公开(公告)号：US06642072B2

公开(公告)日：2003-11-04

申请号：US10014454

申请日：2001-12-14

申请人： Tomio Inoue ,  Kenichi Sanada ,  Kenichi Koya ,  Yasuhiko Fukuda

发明人： Tomio Inoue ,  Kenichi Sanada ,  Kenichi Koya ,  Yasuhiko Fukuda

IPC分类号： H01L2100

CPC分类号： H01L33/40 ,  H01L25/167 ,  H01L33/32 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A GaN-based LED element 1 having a double heterostructure, which includes a GaN layer and the like and is formed on a sapphire substrate, is mounted face-down on a Si diode element 2 formed in a silicon substrate. Electrical connections are provided via Au microbumps 11 and 12 between a p-side electrode 5 of the GaN-based LED element 1 and an n-side electrode 8 of the Si diode element 2 and between an n-side electrode 6 of the GaN-based LED element 1 and a p-side electrode 7 of the Si diode element 2. The Si diode element 2 functions to protect the LED element 1 from an electrostatic destruction. The Si diode element 2 has a backside electrode 9 connected to a leadframe 13a. The p-side electrode 7 of the Si diode element 2 has a bonding pad portion 10 connected to a leadframe 13b via an Au wire 17.

公开(公告)号：US08552444B2

公开(公告)日：2013-10-08

申请号：US12743330

申请日：2008-11-13

申请人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

发明人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

IPC分类号： H01L29/72

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

摘要翻译： 来自半导体发光元件的光在各个方向上行进。 因此，不能有效地利用沿着照明方向以外的方向行进的光。 已经提出了用于形成具有倾斜侧表面的半导体发光元件以及在倾斜侧表面上形成反射层的装置。 然而，由于通过蚀刻方法等形成倾斜表面，所以形成倾斜表面需要很长时间，并且难以控制倾斜表面。 作为这些问题的解决方案，将半导体发光元件放置在副安装座基板上并用密封剂密封，然后在相邻的半导体发光元件之间的部分中形成凹槽。 所形成的槽被反射材料填充，并且发光表面被抛光。 然后，将副安装座基板分割为各个半导体发光元件。 因此，可以获得在其侧表面具有反射层的半导体发光器件。

公开(公告)号：US20120305973A1

公开(公告)日：2012-12-06

申请号：US13522913

申请日：2011-01-25

申请人： Yoshihiko Chosa ,  Takashi Kuwaharada ,  Kiyoshi Fujihara ,  Kenichi Koya

发明人： Yoshihiko Chosa ,  Takashi Kuwaharada ,  Kiyoshi Fujihara ,  Kenichi Koya

IPC分类号： H01L33/60

CPC分类号： H01L33/50 ,  H01L25/0753 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0091 ,  H01L2924/00 ,  H01L2924/00014

摘要： To provide a light emitting device which emits high-luminance, uniform white light with reduced variations in luminance, a light emitting element 101 is mounted on a substrate 105 and covered with a wavelength conversion layer 106 of uniform thickness, and then a light scattering layer 107 made of a translucent resin containing a light reflecting material is formed. As the light scattering layer 107, a high density region 109 in which a density of the light reflecting material is high is formed immediately above a central part of a light emitting surface of the light emitting element 101, and a low density region 110 in which the density of the light reflecting material is low is formed around a region immediately above the central part of the light emitting surface of the light emitting element. A translucent resin layer 108 is formed on the light scattering layer 107.

摘要翻译： 为了提供一种随着亮度变化而发出高亮度，均匀的白光的发光装置，将发光元件101安装在基板105上并被均匀厚度的波长转换层106覆盖，然后将光散射层 形成由含有光反射材料的半透明树脂制成的薄膜107。 作为光散射层107，在发光元件101的发光面的中央部的正上方形成有其中光反射材料的密度高的高密度区域109和低密度区域110，其中 在发光元件的发光面的中心部正上方的区域附近形成光反射材料的密度。 在光散射层107上形成半透明树脂层108。

公开(公告)号：US20100258830A1

公开(公告)日：2010-10-14

申请号：US12743330

申请日：2008-11-13

申请人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

发明人： Yoshiyuki Ide ,  Hidenori Kamei ,  Isamu Yonekura ,  Kunihiko Obara ,  Koichi Nakahara ,  Kouji Nakatsu ,  Yoshirou Tooya ,  Toshirou Kitazono ,  Toshihide Maeda ,  Kenichi Koya ,  Takahiro Shirahata

IPC分类号： H01L33/52 ,  H01L33/60 ,  H01L21/78

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

摘要翻译： 来自半导体发光元件的光在各个方向上行进。 因此，不能有效地利用沿着照明方向以外的方向行进的光。 已经提出了用于形成具有倾斜侧表面的半导体发光元件以及在倾斜侧表面上形成反射层的装置。 然而，由于通过蚀刻方法等形成倾斜表面，所以形成倾斜表面需要很长时间，并且难以控制倾斜表面。 作为这些问题的解决方案，将半导体发光元件放置在副安装座基板上并用密封剂密封，然后在相邻的半导体发光元件之间的部分中形成凹槽。 所形成的槽被反射材料填充，并且发光表面被抛光。 然后，将副安装座基板分割为各个半导体发光元件。 因此，可以获得在其侧表面具有反射层的半导体发光器件。

公开(公告)号：US07834370B2

公开(公告)日：2010-11-16

申请号：US11667374

申请日：2005-11-11

申请人： Kenichi Koya ,  Yukio Kishimoto

发明人： Kenichi Koya ,  Yukio Kishimoto

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L33/483 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light emitting device includes a mount member and a semiconductor light emitting element arranged on the mount member. The mount member includes a substrate; an electrode assembly (a positive electrode, a negative electrode, and bumps) that are arranged on a top surface of a substrate and contacts the semiconductor light emitting element. A reflecting member is out of contact with the semiconductor light emitting element and the electrode assembly. According to this structure, a semiconductor light emitting device can be provided, which efficiently outputs output light using a material having a high reflectance regardless of whether the material is appropriate for an electrode.

摘要翻译： 半导体发光器件包括安装构件和布置在安装构件上的半导体发光元件。 安装构件包括基板; 布置在基板的顶表面上并接触半导体发光元件的电极组件（正极，负极和凸块）。 反射构件与半导体发光元件和电极组件不接触。 根据该结构，可以提供半导体发光器件，其可以使用具有高反射率的材料有效地输出输出光，而不管材料是否适合于电极。

公开(公告)号：US06597019B2

公开(公告)日：2003-07-22

申请号：US09984148

申请日：2001-10-29

申请人： Tomio Inoue ,  Kenichi Sanada ,  Kenichi Koya ,  Yasuhiko Fukuda

发明人： Tomio Inoue ,  Kenichi Sanada ,  Kenichi Koya ,  Yasuhiko Fukuda

IPC分类号： H01L3300

CPC分类号： H01L33/40 ,  H01L25/167 ,  H01L33/32 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A GaN-based LED element 1 having a double heterostructure, which includes a GaN layer and the like and is formed on a sapphire substrate, is mounted face-down on a Si diode element 2 formed in a silicon substrate. Electrical connections are provided via Au microbumps 11 and 12 between a p-side electrode 5 of the GaN-based LED element 1 and an n-side electrode 8 of the Si diode element 2 and between an n-side electrode 6 of the GaN-based LED element 1 and a p-side electrode 7 of the Si diode element 2. The Si diode element 2 functions to protect the LED element 1 from an electrostatic destruction. The Si diode element 2 has a backside electrode 9 connected to a leadframe 13a. The p-side electrode 7 of the Si diode element 2 has a bonding pad portion 10 connected to a leadframe 13b via an Au wire 17.

摘要翻译： 在蓝宝石衬底上形成有包括GaN层等的双异质结构的GaN基LED元件1面朝下安装在形成于硅衬底中的Si二极管元件2上。 在GaN基LED元件1的p侧电极5和Si二极管元件2的n侧电极8之间以及在GaN基LED元件1的n侧电极6之间的Au微胶片11和12之间， 基于硅的LED元件1和Si二极管元件2的p侧电极7.Si二极管元件2用于保护LED元件1免受静电破坏。 Si二极管元件2具有连接到引线框13a的背面电极9。 Si二极管元件2的p侧电极7具有通过Au线17与引线框架13b连接的接合焊盘部10。

公开(公告)号：US20070295980A1

公开(公告)日：2007-12-27

申请号：US11667374

申请日：2005-11-11

申请人： Kenichi Koya ,  Yukio Kishimoto

发明人： Kenichi Koya ,  Yukio Kishimoto

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/60 ,  H01L33/483 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light emitting device 100 comprises: a mount member 130 and a semiconductor light emitting element 110 arranged on the mount member 130, the mount member 130 including: a substrate 131; an electrode assembly (a positive electrode 134, a negative electrode 135, and bumps 140 to 144) that is arranged on a top surface of the substrate 131 and contacts the semiconductor light emitting element 110; and a reflecting member 132 that is out of contact with the semiconductor light emitting element 110 and the electrode assembly. According to this structure, a semiconductor light emitting device can be provided, which efficiently outputs output light using a material having a high reflectance regardless of whether the material is appropriate for an electrode.

摘要翻译： 半导体发光器件100包括：安装构件130和布置在安装构件130上的半导体发光元件110，安装构件130包括：基板131; 布置在基板131的顶表面上并接触半导体发光元件110的电极组件（正电极134，负电极135和凸块140至144） 以及与半导体发光元件110和电极组件不接触的反射部件132。 根据该结构，可以提供半导体发光器件，其可以使用具有高反射率的材料有效地输出输出光，而不管材料是否适合于电极。