摘要:
A thick film integrated circuit comprises a ceramic substrate, conductors formed on one surface of the ceramic substrate, circuit components mounted on the one surface of the ceramic substrate, a resistance for a variable resistor formed on the other surface of the ceramic substrate, variable resistor elements including an adjusting shaft and a slider member constituting the variable resistor formed in cooperation with the resistance, and means for mounting the elements of the variable resistor on the other surface of the ceramic substrate.
摘要:
An elastic surface wave device that has good frequency characteristics and no unwanted signals, and is highly suited for mass production, comprising a piezoelectric substrate, at least one pair of transmitting and receiving electrodes on the surface of said substrate, and elastic surface wave absorbers formed by curing a composition, the main component of which is a resin curable by ultraviolet radiation, disposed on at least part of the zone on said piezoelectric substrate that propagates unwanted elastic surface waves.
摘要:
A circuit board formed with a spark gap for protecting a circuit element such as a transistor connected to a picture tube of a television receiver when spark discharge occurring within the picture tube produces a current under a high voltage tending to destroy the transistor. The spark gap comprises a pair of metal balls disposed respectively on the confronting tip portions of a pair of discharge electrodes disposed opposite to each other on an insulator substrate so that spark discharge can always occur across these metal balls without occurring across the electrodes.
摘要:
An electrolytic capacitor includes a capacitor element having a pair of lead terminals, a thermoplastic synthetic resin cases enclosing the element therein and a thermosetting synthetic resin coating formed on the thermoplastic synthetic resin cases with the lead terminals being extended outwardly. The thermosetting synthetic resin coating formed on the thermoplastic resin cases provides fine affinity with the lead terminals and encloses the capacitor element enclosed in the thermoplastic resin cases airtightly with the lead terminals being extended outwardly.