Housing structure of electronic device and manufacturing method thereof
    5.
    发明申请
    Housing structure of electronic device and manufacturing method thereof 审中-公开
    电子设备的外壳结构及其制造方法

    公开(公告)号:US20120062082A1

    公开(公告)日:2012-03-15

    申请号:US13064083

    申请日:2011-03-04

    Applicant: Shu-Chen Lin

    Inventor: Shu-Chen Lin

    Abstract: A housing structure of electronic device and a manufacturing method thereof are provided. The housing structure of electronic device comprises a metal member and a plastic member. A surface of the metal member is formed with a plurality of micro anchored apertures. Each micro anchored aperture has an irregular inner wall. The plastic member is integrated on the surface of the metal member, wherein the plastic member extends in the micro anchored apertures and fully abutted and adhered on the irregular inner walls.

    Abstract translation: 提供电子设备的壳体结构及其制造方法。 电子装置的壳体结构包括金属构件和塑料构件。 金属构件的表面形成有多个微锚定孔。 每个微型锚定孔具有不规则的内壁。 塑料构件整合在金属构件的表面上,其中塑料构件在微锚定孔中延伸并且完全邻接并粘附在不规则内壁上。

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