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    RFID TAG
    3.
    发明申请
    RFID TAG 审中-公开
    RFID标签

    公开(公告)号：US20110068904A1

    公开(公告)日：2011-03-24

    申请号：US12958928

    申请日：2010-12-02

    申请人： Shunji Baba ,  Noritsugu Ozaki ,  Toru Maniwa ,  Manabu Kai ,  Yoshiyasu Sugimura ,  Satoru Nogami

    发明人： Shunji Baba ,  Noritsugu Ozaki ,  Toru Maniwa ,  Manabu Kai ,  Yoshiyasu Sugimura ,  Satoru Nogami

    IPC分类号： H04Q5/22

    CPC分类号： H01Q7/00 ,  G06K19/07749 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/005

    摘要： An RFID tag includes: a tabular dielectric member 11; an antenna pattern 12 that extends over a top surface and an undersurface of the dielectric member and forms a loop antenna L1 having both ends existing on one surface of the top surface and the undersurface; a circuit chip 13 that is electrically connected to the antenna pattern; a first electrode 14 that is connected directly or via a conductor to one end 12a of the both ends of the loop antenna and spreads on the one surface of the top surface and the undersurface; and a second electrode 15 that is connected via a conductor to the other end 12b of the both ends of the loop antenna and spreads on the other surface of the top surface and the undersurface, along the first electrode 14.

    摘要翻译： RFID标签包括：片状电介质构件11; 天线图案12，其延伸在电介质构件的顶表面和下表面上，并形成环形天线L1，其两端存在于顶表面和下表面的一个表面上; 电连接到天线图案的电路芯片13; 第一电极14，其直接或经由导体连接到环形天线的两端的一端12a并扩散在顶表面和下表面的一个表面上; 以及第二电极15，其经由导体连接到环形天线的两端的另一端12b，并沿着第一电极14扩散在顶表面和下表面的另一表面上。

    RFID tag
    4.
    发明授权
    RFID tag 有权
    RFID标签

    公开(公告)号：US08424771B2

    公开(公告)日：2013-04-23

    申请号：US12824309

    申请日：2010-06-28

    申请人： Shunji Baba ,  Noritsugu Ozaki ,  Manabu Kai ,  Satoru Nogami ,  Yoshiyasu Sugimura

    发明人： Shunji Baba ,  Noritsugu Ozaki ,  Manabu Kai ,  Satoru Nogami ,  Yoshiyasu Sugimura

    IPC分类号： G06K19/06

    CPC分类号： G06K19/07749 ,  G06K19/0775

    摘要： An RFID tag includes a semiconductor package, a substrate and an antenna pattern. The semiconductor package includes a semiconductor chip encapsulated therein and a plurality of connection terminals thereon. The plurality of connection terminals includes signal terminals and dummy terminals. The semiconductor package is mounted on the substrate. The antenna pattern is formed on the substrate and is electrically connected to the signal terminals. The antenna pattern is extended so as to overlap with at least a part of a bottom region of the semiconductor package.

    摘要翻译： RFID标签包括半导体封装，衬底​​和天线图案。 半导体封装包括封装在其中的半导体芯片和其上的多个连接端子。 多个连接端子包括信号端子和虚拟端子。 半导体封装安装在基板上。 天线图案形成在基板上并且电连接到信号端子。 天线图案被延伸以与半导体封装的底部区域的至少一部分重叠。

    RFID tag set, RFID tag and RFID tag component
    5.
    发明授权
    RFID tag set, RFID tag and RFID tag component 失效
    RFID标签组，RFID标签和RFID标签组件

    公开(公告)号：US07427919B2

    公开(公告)日：2008-09-23

    申请号：US11231933

    申请日：2005-09-22

    申请人： Shunji Baba ,  Toru Maniwa ,  Takashi Yamagajo ,  Manabu Kai ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura

    发明人： Shunji Baba ,  Toru Maniwa ,  Takashi Yamagajo ,  Manabu Kai ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura

    IPC分类号： G08B13/14

    CPC分类号： G06K19/07758 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07779

    摘要： An RFID tag is constructed by pasting a first component and second component together. The first component includes a tabular first base made of dielectric and a metal layer covering one of the front and back of the first base. The second component includes a sheet-like second base, a metal pattern provided on the second base and electrically connected to the metal layer of the first component to constitute a communication antenna, a circuit chip connected to the metal pattern which carries out a radio communication through the communication antenna, and an adhesive material layer which bonds the second base to the other of the front and back of the first base. The metal layer of the first component and the metal pattern of the second component are electrically connected by the conductive component.

    摘要翻译： 通过将第一部件和第二部件粘贴在一起构成RFID标签。 第一部件包括由电介质制成的片状第一基底和覆盖第一基底的前后之一的金属层。 第二部件包括片状第二基座，设置在第二基座上并电连接到第一部件的金属层以构成通信天线的金属图案，连接到执行无线电通信的金属图案的电路芯片 通过通信天线，以及将第二基座连接到第一基座的前后的另一个的粘合材料层。 第一部件的金属层和第二部件的金属图案通过导电部件电连接。

    RFID tag set, RFID tag and RFID tag component
    6.
    发明申请
    RFID tag set, RFID tag and RFID tag component 失效
    RFID标签组，RFID标签和RFID标签组件

    公开(公告)号：US20060232418A1

    公开(公告)日：2006-10-19

    申请号：US11231933

    申请日：2005-09-22

    申请人： Shunji Baba ,  Toru Maniwa ,  Takashi Yamagajo ,  Manabu Kai ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura

    发明人： Shunji Baba ,  Toru Maniwa ,  Takashi Yamagajo ,  Manabu Kai ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura

    IPC分类号： G08B13/14

    CPC分类号： G06K19/07758 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07779

    摘要： An RFID tag is constructed by pasting a first component and second component together. The first component includes a tabular first base made of dielectric and a metal layer covering one of the front and back of the first base. The second component includes a sheet-like second base, a metal pattern provided on the second base and electrically connected to the metal layer of the first component to constitute a communication antenna, a circuit chip connected to the metal pattern which carries out a radio communication through the communication antenna, and an adhesive material layer which bonds the second base to the other of the front and back of the first base. The metal layer of the first component and the metal pattern of the second component are electrically connected by the conductive component.

    摘要翻译： 通过将第一部件和第二部件粘贴在一起构成RFID标签。 第一部件包括由电介质制成的片状第一基底和覆盖第一基底的前后之一的金属层。 第二部件包括片状第二基座，设置在第二基座上并电连接到第一部件的金属层以构成通信天线的金属图案，连接到执行无线电通信的金属图案的电路芯片 通过通信天线，以及将第二基座连接到第一基座的前后的另一个的粘合材料层。 第一部件的金属层和第二部件的金属图案通过导电部件电连接。

    RFID tag and manufacturing method thereof
    8.
    发明申请
    RFID tag and manufacturing method thereof 有权
    RFID标签及其制造方法

    公开(公告)号：US20080036673A1

    公开(公告)日：2008-02-14

    申请号：US11882232

    申请日：2007-07-31

    申请人： Takashi Yamagajo ,  Toru Maniwa ,  Manabu Kai ,  Yasuyuki Oishi ,  Yoshiyasu Sugimura ,  Shunji Baba

    发明人： Takashi Yamagajo ,  Toru Maniwa ,  Manabu Kai ,  Yasuyuki Oishi ,  Yoshiyasu Sugimura ,  Shunji Baba

    IPC分类号： H01Q1/38 ,  H01Q9/16

    CPC分类号： H01Q1/2208 ,  G06K19/07749 ,  G06K19/07786 ,  H01Q9/0457 ,  H01Q21/29 ,  Y10T29/49016

    摘要： An RFID tag having a tag antenna and an LSI chip, comprising: a power-supply pattern on which the LSI chip is mounted; a patch antenna that functions as the tag antenna; and a high-frequency connection section that makes a high-frequency connection between the power-supply pattern and the patch antenna. The high-frequency connection section is formed, for example, by forming a slot in the patch antenna, layering one end of a small dipole antenna that functions as the power-supply pattern over the slot so that it crosses over the slot, and supplying power from the small dipole antenna to the patch antenna.

    摘要翻译： 一种具有标签天线和LSI芯片的RFID标签，包括：安装有LSI芯片的电源图案; 贴片天线，用作标签天线; 以及在电源图案和贴片天线之间进行高频连接的高频连接部。 高频连接部例如通过在贴片天线中形成狭缝而形成，将小偶极天线的一端层叠成在插槽上方作为电源图案，使其与插槽交叉，并且供给 功率从小偶极天线到贴片天线。

    RFID tag and manufacturing method thereof
    9.
    发明授权
    RFID tag and manufacturing method thereof 有权
    RFID标签及其制造方法

    公开(公告)号：US08462052B2

    公开(公告)日：2013-06-11

    申请号：US13206901

    申请日：2011-08-10

    申请人： Takashi Yamagajo ,  Toru Maniwa ,  Manabu Kai ,  Yasuyuki Oishi ,  Yoshiyasu Sugimura ,  Shunji Baba

    发明人： Takashi Yamagajo ,  Toru Maniwa ,  Manabu Kai ,  Yasuyuki Oishi ,  Yoshiyasu Sugimura ,  Shunji Baba

    IPC分类号： H01Q1/38 ,  G08B13/14

    CPC分类号： H01Q1/2208 ,  G06K19/07749 ,  G06K19/07786 ,  H01Q9/0457 ,  H01Q21/29 ,  Y10T29/49016

    摘要： An RFID tag having a tag antenna and an LSI chip, comprising: a power-supply pattern on which the LSI chip is mounted; a patch antenna that functions as the tag antenna; and a high-frequency connection section that makes a high-frequency connection between the power-supply pattern and the patch antenna. The high-frequency connection section is formed, for example, by forming a slot in the patch antenna, layering one end of a small dipole antenna that functions as the power-supply pattern over the slot so that it crosses over the slot, and supplying power from the small dipole antenna to the patch antenna.

    摘要翻译： 一种具有标签天线和LSI芯片的RFID标签，包括：安装有LSI芯片的电源图案; 贴片天线，用作标签天线; 以及在电源图案和贴片天线之间进行高频连接的高频连接部。 高频连接部例如通过在贴片天线中形成狭缝而形成，将小偶极天线的一端层叠成在插槽上方作为电源图案，使其与插槽交叉，并且供给 功率从小偶极天线到贴片天线。

    RFID tag and manufacturing method thereof
    10.
    发明授权
    RFID tag and manufacturing method thereof 有权
    RFID标签及其制造方法

    公开(公告)号：US08022878B2

    公开(公告)日：2011-09-20

    申请号：US11882232

    申请日：2007-07-31

    申请人： Takashi Yamagajo ,  Toru Maniwa ,  Manabu Kai ,  Yasuyuki Oishi ,  Yoshiyasu Sugimura ,  Shunji Baba

    发明人： Takashi Yamagajo ,  Toru Maniwa ,  Manabu Kai ,  Yasuyuki Oishi ,  Yoshiyasu Sugimura ,  Shunji Baba

    IPC分类号： H01Q1/38 ,  H01Q9/16

    CPC分类号： H01Q1/2208 ,  G06K19/07749 ,  G06K19/07786 ,  H01Q9/0457 ,  H01Q21/29 ,  Y10T29/49016

    摘要： An RFID tag having a tag antenna and an LSI chip, comprising: a power-supply pattern on which the LSI chip is mounted; a patch antenna that functions as the tag antenna; and a high-frequency connection section that makes a high-frequency connection between the power-supply pattern and the patch antenna. The high-frequency connection section is formed, for example, by forming a slot in the patch antenna, layering one end of a small dipole antenna that functions as the power-supply pattern over the slot so that it crosses over the slot, and supplying power from the small dipole antenna to the patch antenna.

    摘要翻译： 一种具有标签天线和LSI芯片的RFID标签，包括：安装有LSI芯片的电源图案; 贴片天线，用作标签天线; 以及在电源图案和贴片天线之间进行高频连接的高频连接部。 高频连接部例如通过在贴片天线中形成狭缝而形成，将小偶极天线的一端层叠成在插槽上方作为电源图案，使其与插槽交叉，并且供给 功率从小偶极天线到贴片天线。