-
1.发明授权Highly thermally conductive thermoplastic resin composition and thermoplastic resin 有权高导热性热塑性树脂组合物和热塑性树脂公开(公告)号：US08946335B2
公开(公告)日：2015-02-03
申请号：US13126246
申请日：2009-10-28
CPC分类号： C08K3/0033 , C08K3/013 , C08K3/22 , C08K3/28 , C08L67/00
摘要： A thermoplastic resin composition according to the present invention contains an inorganic filler and a thermoplastic resin whose main chain contains a repeating unit represented by the general formula (1): -M-Sp- . . . (1) wherein M represents a mesogenic group; and Sp represents a spacer.
摘要翻译： 根据本发明的热塑性树脂组合物含有主链含有由通式（1）表示的重复单元的无机填料和热塑性树脂：-M-Sp-。 。 。 （1）其中M表示介晶基团; Sp表示间隔物。
-
公开(公告)号：US20130043425A1
公开(公告)日：2013-02-21
申请号：US13641964
申请日：2011-04-14
IPC分类号： C08G63/16 , C09K5/00 , C08G63/181 , C08G63/19 , C08G63/02
CPC分类号： C08G63/185 , C08K3/28 , C08L67/00
摘要： Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die.The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol % or more ends of molecular chains are carboxyl groups.
摘要翻译： 本发明提供一种热塑性树脂，其特征在于，（A）在加入导热性填料时显着提高树脂组合物的导热性，（B）也可以通过使用一般的注塑成形模而进行注塑成型。 热塑性树脂是其中：主链主要具有特定重复单元的树脂; 并且分子链的60mol％以上的末端是羧基。
-
3.发明申请HIGHLY THERMALLY CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN 有权高导热热塑性树脂组合物和热塑性树脂公开(公告)号：US20110204282A1
公开(公告)日：2011-08-25
申请号：US13126246
申请日：2009-10-28
IPC分类号： C09K5/00 , C08G63/685 , C08G63/672 , C08G63/181
CPC分类号： C08K3/0033 , C08K3/013 , C08K3/22 , C08K3/28 , C08L67/00
摘要： A thermoplastic resin composition according to the present invention contains an inorganic filler and a thermoplastic resin whose main chain contains a repeating unit represented by the general formula (1): -M-Sp- (1) wherein M represents a mesogenic group; and Sp represents a spacer.
摘要翻译： 根据本发明的热塑性树脂组合物含有主链含有通式（1）表示的重复单元的无机填料和热塑性树脂：-M-Sp-（1）其中M表示介晶基团; Sp表示间隔物。
-
公开(公告)号：US08921507B2
公开(公告)日：2014-12-30
申请号：US13641964
申请日：2011-04-14
CPC分类号： C08G63/185 , C08K3/28 , C08L67/00
摘要： Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die.The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol % or more ends of molecular chains are carboxyl groups.
摘要翻译： 本发明提供一种热塑性树脂，其特征在于，（A）在加入导热性填料时显着提高树脂组合物的导热性，（B）也可以通过使用一般的注塑成形模而进行注射成型。 热塑性树脂是其中：主链主要具有特定重复单元的树脂; 并且分子链的60mol％以上的末端是羧基。
-
公开(公告)号：US08637630B2
公开(公告)日：2014-01-28
申请号：US13641939
申请日：2011-04-14
CPC分类号： C08G63/20 , C08G63/193
摘要： Provided is a thermoplastic resin having excellent thermal conductivity, in which thermoplastic resin a change in number average molecular mass caused by progress of polymerization occurring when the thermoplastic resin material is melted and a change in thermal conductivity caused by the change in number average molecular mass are low. The thermoplastic resin has (A) a specific structure and (B) ends of molecular chains sealed by a monofunctional low molecular weight compound. The resin itself has excellent thermal conductivity. The change in number average molecular mass becomes small during melting of the thermoplastic resin material, so that the change in thermal conductivity of the resin itself becomes small.
摘要翻译： 本发明提供一种导热性优异的热塑性树脂，其中热塑性树脂在热塑性树脂材料熔融时发生的聚合过程引起的数均分子量的变化和由数均分子量的变化导致的导热率的变化是 低。 热塑性树脂具有（A）特定结构，（B）由单官能低分子量化合物密封的分子链末端。 树脂本身具有优良的导热性。 在热塑性树脂材料的熔融期间，数均分子量的变化变小，因此树脂本身的热导率的变化变小。
-
公开(公告)号：US20130035468A1
公开(公告)日：2013-02-07
申请号：US13641939
申请日：2011-04-14
IPC分类号： C08G63/193 , C08G63/672 , C08G63/181
CPC分类号： C08G63/20 , C08G63/193
摘要： Provided is a thermoplastic resin having excellent thermal conductivity, in which thermoplastic resin a change in number average molecular mass caused by progress of polymerization occurring when the thermoplastic resin material is melted and a change in thermal conductivity caused by the change in number average molecular mass are low. The thermoplastic resin has (A) a specific structure and (B) ends of molecular chains sealed by a monofunctional low molecular weight compound. The resin itself has excellent thermal conductivity. The change in number average molecular mass becomes small during melting of the thermoplastic resin material, so that the change in thermal conductivity of the resin itself becomes small.
摘要翻译： 本发明提供一种导热性优异的热塑性树脂，其中热塑性树脂在热塑性树脂材料熔融时发生的聚合过程引起的数均分子量的变化和由数均分子量的变化导致的导热率的变化是 低。 热塑性树脂具有（A）特定结构，（B）由单官能低分子量化合物密封的分子链末端。 树脂本身具有优良的导热性。 在热塑性树脂材料的熔融期间，数均分子量的变化变小，因此树脂本身的热导率的变化变小。
-
7.发明申请THERMALLY-CONDUCTIVE ORGANIC ADDITIVE, RESIN COMPOSITION, AND CURED PRODUCT 审中-公开导热有机添加剂，树脂组合物和固化产品公开(公告)号：US20120175549A1
公开(公告)日：2012-07-12
申请号：US13395914
申请日：2010-04-26
IPC分类号： C09K5/00 , C07C69/78 , C07C291/08 , C07C69/353
CPC分类号： C08L67/02 , C09K5/14 , C09K19/3804 , F28F21/06
摘要： The present invention provides a thermally-conductive organic additive which (i) is an organic polymer, unlike a thermally-conductive inorganic filler such as ceramic, metal and a carbon material, (ii) is capable of imparting thermal conductivity to plastic by being added thereto, (iii) can reduce the weight of a composition even when added to a resin in a large amount, without causing abrasion on molds and deteriorating an electrical insulation property of the composition, and (iv) provides the composition with excellent molding processability. The present thermally-conductive organic additive includes a liquid crystalline thermoplastic resin which has a mainly-chain structure, wherein a main chain of the liquid crystalline thermoplastic resin contains mainly a repeating unit represented by the general formula (1): -M-Sp- (1) wherein M represents a mesogenic group; and Sp represents a spacer, the liquid crystalline thermoplastic resin itself having thermal conductivity of not less than 0.45 W/(m·K).
摘要翻译： 本发明提供一种导热性有机添加剂，其与（i）为有机聚合物不同于陶瓷，金属和碳材料等导热性无机填料，（ii）能够通过添加赋予塑料导热性 （iii）即使在大量添加到树脂中也可以降低组合物的重量，而不会造成模具磨损并降低组合物的电绝缘性，（iv）提供具有优异成型加工性的组合物。 本发明的导热性有机添加剂包括具有主链结构的液晶性热塑性树脂，其中液晶热塑性树脂的主链主要包含由通式（1）表示的重复单元：-M-Sp- （1）其中M表示介晶基团; Sp表示间隔物，液晶热塑性树脂本身的导热率不低于0.45W /（m·K）。
-
公开(公告)号：US20120141348A1
公开(公告)日：2012-06-07
申请号：US13390558
申请日：2010-08-10
IPC分类号： C01B21/064
CPC分类号： C01B21/0645 , C01P2002/72 , C01P2004/03 , C01P2004/32 , C01P2004/52 , C01P2004/61
摘要： Disclosed is a process for producing spheroidized boron nitride which enable the further improvement in the heat conductivity of a heat dissipative member. Specifically disclosed is a process for producing spheroidized boron nitride, which is characterized by using spheroidized graphite as a raw material and reacting the spheroidized graphite with a boron oxide and nitrogen at a high temperature ranging from 1600 to 2100° C. to produce the spheroidized boron nitride. The boron oxide to be used in the reaction is preferably boron oxide (B2O3), boric acid (H3BO3), or a substance capable of generating a boron oxide at a higher temperature. A gas to be used in the reaction is preferably nitrogen or ammonia.
摘要翻译： 公开了一种制造球状氮化硼的方法，其能够进一步提高散热构件的导热性。 具体公开了一种制造球状氮化硼的方法，其特征在于以球状石墨为原料，使球化石墨与氧化硼和氮在1600〜2100℃的高温下反应，生成球化硼 氮化物。 在反应中使用的氧化硼优选为氧化硼（B 2 O 3），硼酸（H 3 BO 3））或能够在较高温度下产生氧化硼的物质。 反应中使用的气体优选为氮气或氨气。
-
公开(公告)号：US08617503B2
公开(公告)日：2013-12-31
申请号：US13390558
申请日：2010-08-10
IPC分类号： C01B21/064 , C01B35/02 , B32B5/16 , B32B9/00
CPC分类号： C01B21/0645 , C01P2002/72 , C01P2004/03 , C01P2004/32 , C01P2004/52 , C01P2004/61
摘要： Disclosed is a process for producing spheroidized boron nitride which enable the further improvement in the heat conductivity of a heat dissipative member. Specifically disclosed is a process for producing spheroidized boron nitride, which is characterized by using spheroidized graphite as a raw material and reacting the spheroidized graphite with a boron oxide and nitrogen at a high temperature ranging from 1600 to 2100° C. to produce the spheroidized boron nitride. The boron oxide to be used in the reaction is preferably boron oxide (B2O3), boric acid (H3BO3), or a substance capable of generating a boron oxide at a higher temperature. A gas to be used in the reaction is preferably nitrogen or ammonia.
摘要翻译： 公开了一种制造球状氮化硼的方法，其能够进一步提高散热构件的导热性。 具体公开了一种制造球状氮化硼的方法，其特征在于以球状石墨为原料，使球化石墨与氧化硼和氮在1600〜2100℃的高温下反应，生成球化硼 氮化物。 在反应中使用的氧化硼优选为氧化硼（B 2 O 3），硼酸（H 3 BO 3））或能够在较高温度下产生氧化硼的物质。 反应中使用的气体优选为氮气或氨气。
-
公开(公告)号：US09142357B2
公开(公告)日：2015-09-22
申请号：US13981027
申请日：2012-02-21
申请人： Kazuaki Matsumoto
发明人： Kazuaki Matsumoto
CPC分类号： H01G9/02 , H01G11/06 , H01G11/52 , H01G11/60 , H01M2/145 , H01M2/1626 , H01M2/1633 , Y02E60/13 , Y02T10/7022 , Y10T29/49108
摘要： The object of an exemplary embodiment of the invention is to provide a separator for an electric storage device which has small heat shrinkage in a high-temperature environment, and in which the increase of the battery temperature can be suppressed. An exemplary embodiment of the invention is a separator for an electric storage device, which comprises a cellulose derivative represented by a prescribed formula. The separator for an electric storage device can be obtained, for example, by treating a cellulose separator containing cellulose with a halogen-containing carboxylic acid or a halogen-containing alcohol.
摘要翻译： 本发明的一个示例性实施例的目的是提供一种用于在高温环境中具有小热收缩并且可以抑制电池温度升高的蓄电装置的隔板。 本发明的一个示例性实施方案是用于蓄电装置的隔板，其包含由规定式表示的纤维素衍生物。 用于蓄电装置的隔板可以通过例如通过用含卤素的羧酸或含卤素的醇处理含有纤维素的纤维素分离器来获得。
-
-
-
-
-
-
-
-
-
搜索结果
76 条记录 (耗时 0.02 秒)
