Clip and backlight assembly
    1.
    发明申请
    Clip and backlight assembly 失效
    夹子和背光组件

    公开(公告)号:US20100008066A1

    公开(公告)日:2010-01-14

    申请号:US12456193

    申请日:2009-06-12

    IPC分类号: G09F13/04 A44B21/00

    摘要: A clip provided by the present invention includes an insert portion that is inserted into an insertion hole formed in a flat-shaped chassis and that engages with the chassis, and a collar portion that is formed in a flat shape around the circumference of the insert portion. When the insert portion is inserted into the insertion hole, the collar portion and the chassis clamp at least one light emitting board that is positioned in contact with the chassis, and the thickness of the collar portion is set to be equal to or less than an amount of protrusion of a light emitting portion formed protrudingly from the light emitting board.

    摘要翻译: 由本发明提供的夹子包括插入到形成在平板状底盘中的插入孔中并与底座接合的插入部分,以及围绕插入部分的圆周形成为扁平形状的套环部分 。 当插入部分插入到插入孔中时,套环部分和底架夹紧至少一个与底架接触的发光板,并且套环部分的厚度设定为等于或小于 从发光板突出地形成的发光部的突出量。

    Clip and backlight assembly
    2.
    发明授权
    Clip and backlight assembly 失效
    夹子和背光组件

    公开(公告)号:US08215819B2

    公开(公告)日:2012-07-10

    申请号:US12456193

    申请日:2009-06-12

    IPC分类号: F21V7/04

    摘要: A clip provided by the present invention includes an insert portion that is inserted into an insertion hole formed in a flat-shaped chassis and that engages with the chassis, and a collar portion that is formed in a flat shape around the circumference of the insert portion. When the insert portion is inserted into the insertion hole, the collar portion and the chassis clamp at least one light emitting board that is positioned in contact with the chassis, and the thickness of the collar portion is set to be equal to or less than an amount of protrusion of a light emitting portion formed protrudingly from the light emitting board.

    摘要翻译: 由本发明提供的夹子包括插入到形成在平板状底盘中的插入孔中并与底座接合的插入部分,以及围绕插入部分的圆周形成为扁平形状的凸缘部分 。 当插入部分插入到插入孔中时,套环部分和底架夹紧至少一个与底架接触的发光板,并且套环部分的厚度设定为等于或小于 从发光板突出地形成的发光部的突出量。

    Light-emitting-diode backlight device
    3.
    发明授权
    Light-emitting-diode backlight device 失效
    发光二极管背光装置

    公开(公告)号:US08142042B2

    公开(公告)日:2012-03-27

    申请号:US12402829

    申请日:2009-03-12

    IPC分类号: G09F13/08

    摘要: A light-emitting-diode backlight device includes a light source substrate to which many light-emitting diodes are mounted, and a bottom chassis having the light source substrate mounted to a principal surface side of the bottom chassis. Illumination light from the light-emitting diodes is supplied to a display panel unit. A back-surface side of the bottom chassis is provided with a heat-dissipating unit making uniform a temperature distribution over the entire bottom chassis. The heat-dissipating unit includes a mounting plate, a heat pipe, and a radiating fin. The mounting plate is mounted to at least a high-temperature area of the bottom chassis. The heat pipe is disposed on both the high-temperature area and a low-temperature area, and is mounted to the mounting plate. The radiating fin is mounted to the low-temperature area, and connected to an end of the heat pipe.

    摘要翻译: 发光二极管背光装置包括安装有许多发光二极管的光源基板和安装在底板的主表面侧的具有光源基板的底架。 来自发光二极管的照明光被提供给显示面板单元。 底部底盘的背面侧设置有散热单元,其在整个底部底盘上均匀地分布温度。 散热单元包括安装板,热管和散热片。 安装板安装在底部底盘的至少一个高温区域。 热管设置在高温区域和低温区域上,并安装在安装板上。 散热片安装在低温区域,并连接到热管的一端。

    Light-Emitting-Diode Backlight Device
    4.
    发明申请
    Light-Emitting-Diode Backlight Device 失效
    发光二极管背光装置

    公开(公告)号:US20090231881A1

    公开(公告)日:2009-09-17

    申请号:US12402829

    申请日:2009-03-12

    IPC分类号: F21V7/04

    摘要: A light-emitting-diode backlight device includes a light source substrate to which many light-emitting diodes are mounted, and a bottom chassis having the light source substrate mounted to a principal surface side of the bottom chassis. Illumination light from the light-emitting diodes is supplied to a display panel unit. A back-surface side of the bottom chassis is provided with a heat-dissipating unit making uniform a temperature distribution over the entire bottom chassis. The heat-dissipating unit includes a mounting plate, a heat pipe, and a radiating fin. The mounting plate is mounted to at least a high-temperature area of the bottom chassis. The heat pipe is disposed on both the high-temperature area and a low-temperature area, and is mounted to the mounting plate. The radiating fin is mounted to the low-temperature area, and connected to an end of the heat pipe.

    摘要翻译: 发光二极管背光装置包括安装有许多发光二极管的光源基板和安装在底板的主表面侧的具有光源基板的底架。 来自发光二极管的照明光被提供给显示面板单元。 底部底盘的背面侧设置有散热单元,其在整个底部底盘上均匀地分布温度。 散热单元包括安装板,热管和散热片。 安装板安装在底部底盘的至少一个高温区域。 热管设置在高温区域和低温区域上,并安装在安装板上。 散热片安装在低温区域,并连接到热管的一端。

    Absorbent article with leaking-prevention units having elastic members
    5.
    发明授权
    Absorbent article with leaking-prevention units having elastic members 有权
    具有防弹单元的吸收制品具有弹性构件

    公开(公告)号:US09072631B2

    公开(公告)日:2015-07-07

    申请号:US13321423

    申请日:2010-05-17

    摘要: A leakage-preventing unit 50 of an absorbent article 1 is formed by elastic members 51 and sheets 52. The leakage-preventing unit 50 includes a central region C and a pair of end unit regions S positioned outside a longitudinal direction L from the central region C.The elastic members 51 includesa fixed unit 51A fixed to the sheet 52 in a state when the elastic members 51 extend in the longitudinal direction L and a free end 51B positioned outside the longitudinal direction L from the fixed unit 51A, which is not fixed to the sheet 52. The end unit regions S includes a joint processing unit 53A in which a joint process for joining the portions where the sheets 52 face each other is performed and a non-joint processing unit 53B in which the joint process is not performed. The free end 51B is arranged in the non-joint processing unit 53B.

    摘要翻译: 吸收性物品1的防漏单元50由弹性构件51和片52形成。防漏单元50包括中心区域C和位于从中心区域的纵向方向L外侧的一对端部单元区域S 弹性构件51包括固定单元51A,该固定单元51A在弹性构件51沿长度方向L延伸的状态下固定到片材52,而固定单元51A从固定单元51A位于长度方向L外侧的自由端51B 端部单元区域S包括接合处理单元53A,其中进行用于连接片材52彼此面对的部分的接合处理和非接合处理单元53B,其中接合处理不是 执行。 自由端51B布置在非联合处理单元53B中。

    Array-type photo module
    6.
    发明授权
    Array-type photo module 有权
    阵列型照片模块

    公开(公告)号:US08744223B2

    公开(公告)日:2014-06-03

    申请号:US13410131

    申请日:2012-03-01

    IPC分类号: G02B6/32

    CPC分类号: G02B6/425 G02B6/4215

    摘要: The present invention provides an array-type photo module including a filter, which, in each channel, transmits therethrough a portion of emitted light from an incident optical fiber on the opposite side of a gradient-index lens array and reflects another portion of the emitted light from the incident optical fiber toward the gradient-index lens array, and a light-shielding member which is arranged on the opposite side of the filter from the gradient-index lens array, so as to be spaced from the filter and, in each channel, has an opening passing therethrough transmitted light from the filter on the opposite side of the filter. The array-type photo module is easily and inexpensively manufactured, and may be used in a high-density array, with low crosstalk.

    摘要翻译: 本发明提供了一种阵列型照相模块,它包括一个滤光器,它在每个通道中透过其中一部分来自入射光纤的发射光,在入射光纤位于相反的一个梯度折射率透镜阵列上, 从入射光纤到达梯度折射率透镜阵列的光;以及遮光构件,其设置在与滤光镜相反的一侧,与滤光镜相隔离,并且每个 通道具有穿过过滤器相对侧上的来自过滤器的透射光的开口。 阵列型光模块容易且廉价地制造,并且可以以低串扰的高密度阵列使用。

    Optical module
    7.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号:US08545111B2

    公开(公告)日:2013-10-01

    申请号:US12666583

    申请日:2008-06-30

    IPC分类号: G02B6/36

    摘要: An optical module has a structure for reducing the stress applied to a package. The optical module is structured so that an end face of a waveguide (37) of a planar lightwave circuit (30) is joined to a plurality of packages (40) storing therein optical elements so that the waveguide is optically coupled to the optical elements. The optical module includes a housing (3) storing therein a planar lightwave circuit and a plurality of packages in which an upper face of a protrusion (270) formed in the bottom section is fixed to the planar lightwave circuit (30). Each of the plurality of packages (40) is electrically connected to an electric part (22) provided in the housing (3) via flexible printed circuits (271a, 271b).

    摘要翻译: 光学模块具有用于减小施加到包装上的应力的结构。 光学模块被构造成使得平面光波电路(30)的波导(37)的端面与存储有光学元件的多个封装(40)接合,使得波导光耦合到光学元件。 光学模块包括容纳有平面光波电路的壳体(3)和形成在底部的突起(270)的上表面固定在平面光波回路(30)上的多个封装体。 所述多个封装体(40)中的每一个通过柔性印刷电路(271a,271b)电连接到设置在所述壳体(3)中的电气部件(22)。

    Imaging apparatus for outputting an image signal according to a set shooting mode
    8.
    发明授权
    Imaging apparatus for outputting an image signal according to a set shooting mode 有权
    用于根据设定的拍摄模式输出图像信号的成像装置

    公开(公告)号:US08274574B2

    公开(公告)日:2012-09-25

    申请号:US12139141

    申请日:2008-06-13

    申请人: Yuichi Suzuki

    发明人: Yuichi Suzuki

    IPC分类号: H04N5/225 H04N3/14 H04N5/335

    摘要: An imaging apparatus having as a shooting mode a normal shooting mode and a continuous shooting mode for generating a plurality of pieces of image data, includes a setting unit operable to set a shooting mode, an imaging element having as a read mode a normal read mode for outputting image signals of all pixels and a mixing read mode for mixing and outputting an image signal of a predetermined pixel and image signals of peripheral pixels of the predetermined pixel, and a pixel mixing controller operable to control the read mode of the imaging element. The pixel mixing controller controls the imaging element to operate in the mixing read mode when the shooting mode is set to the continuous shooting mode.

    摘要翻译: 具有用于产生多张图像数据的正常拍摄模式和连续拍摄模式的拍摄模式的成像装置包括可设置拍摄模式的设置单元,具有作为读取模式的正常读取模式的成像元件 用于输出所有像素的图像信号和用于混合和输出预定像素的图像信号的混合读取模式和预定像素的外围像素的图像信号的像素混合控制器,以及可操作以控制成像元件的读取模式的像素混合控制器。 当拍摄模式设置为连拍模式时,像素混合控制器控制成像元件在混合读取模式下操作。

    ABSORBENT ARTICLE
    9.
    发明申请
    ABSORBENT ARTICLE 有权
    吸收品

    公开(公告)号:US20120116344A1

    公开(公告)日:2012-05-10

    申请号:US13321423

    申请日:2010-05-17

    IPC分类号: A61F13/475

    摘要: A leakage-preventing unit 50 of an absorbent article 1 is formed by elastic members 51 and sheets 52. The leakage-preventing unit 50 includes a central region C and a pair of end unit regions S positioned outside a longitudinal direction L from the central region C.The elastic members 51 includesa fixed unit 51A fixed to the sheet 52 in a state when the elastic members 51 extend in the longitudinal direction L and a free end 51B positioned outside the longitudinal direction L from the fixed unit 51A, which is not fixed to the sheet 52. The end unit regions S includes a joint processing unit 53A in which a joint process for joining the portions where the sheets 52 face each other is performed and a non-joint processing unit 53B in which the joint process is not performed. The free end 51B is arranged in the non-joint processing unit 53B.

    摘要翻译: 吸收性物品1的防漏单元50由弹性构件51和片52形成。防漏单元50包括中心区域C和位于从中心区域的纵向方向L外侧的一对端部单元区域S 弹性构件51包括固定单元51A,该固定单元51A在弹性构件51沿长度方向L延伸的状态下固定到片材52,而固定单元51A从固定单元51A位于长度方向L外侧的自由端51B 端部单元区域S包括接合处理单元53A,其中进行用于连接片材52彼此面对的部分的接合处理和非接合处理单元53B,其中接合处理不是 执行。 自由端51B布置在非联合处理单元53B中。