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    Copper wire
    1.
    发明授权
    Copper wire 失效
    铜线

    公开(公告)号：US5830583A

    公开(公告)日：1998-11-03

    申请号：US792795

    申请日：1997-02-03

    申请人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

    发明人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

    IPC分类号： C25D1/04

    CPC分类号： C25D1/04 ,  Y10S428/935 ,  Y10T428/12431

    摘要： This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

    摘要翻译： 本发明涉及具有基本上无定向晶粒结构的基本上均匀的无晶粒状的铜线。 本发明还涉及一种制造铜线的方法，包括：切割铜箔以形成铜线的至少一根线，所述铜箔是具有基本上无定向晶粒结构的可退火的电沉积铜箔，其基本上无柱状，所述 箔的特征在于在177℃退火15分钟后的疲劳延展性至少约25％; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。 本发明还涉及一种制造铜线的方法，包括：使阳极和阴极之间的电解质水溶液流动，并在阳极和阴极上施加有效量的电压以将铜箔沉积在阴极上，所述电解质溶液的特征在于 通过高达约5ppm的氯离子浓度和高达约0.2ppm的有机添加剂浓度; 切割所述箔以形成至少一根丝线; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。

    Copper wire and process for making copper wire
    3.
    发明授权
    Copper wire and process for making copper wire 失效
    铜线和铜线制造工艺

    公开(公告)号：US6123788A

    公开(公告)日：2000-09-26

    申请号：US647707

    申请日：1996-05-24

    申请人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

    发明人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

    IPC分类号： C22F1/08 ,  C25D1/04 ,  C25D3/38 ,  C25D5/10 ,  H05K1/00

    CPC分类号： C25D1/04 ,  C25D5/10 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105

    摘要： This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

    摘要翻译： 本发明涉及具有基本上无定向晶粒结构的基本上均匀的无晶粒状的铜线。 本发明还涉及一种制造铜线的方法，包括：切割铜箔以形成铜线的至少一根线，所述铜箔是具有基本上无定向晶粒结构的可退火的电沉积铜箔，其基本上无柱状，所述 箔的特征在于在177℃退火15分钟后的疲劳延展性至少约25％; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。 本发明还涉及一种制造铜线的方法，包括：使阳极和阴极之间的电解质水溶液流动，并在阳极和阴极上施加有效量的电压以将铜箔沉积在阴极上，所述电解质溶液的特征在于 通过高达约5ppm的氯离子浓度和高达约0.2ppm的有机添加剂浓度; 切割所述箔以形成至少一根丝线; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。

    Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
    4.
    发明授权
    Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives 失效
    电沉积铜箔和使用具有可控添加的氯离子和有机添加剂的电解质溶液制成的方法

    公开(公告)号：US5403465A

    公开(公告)日：1995-04-04

    申请号：US68690

    申请日：1993-05-28

    申请人： R. Duane Apperson ,  Sidney J. Clouser ,  Richard D. Patrick

    发明人： R. Duane Apperson ,  Sidney J. Clouser ,  Richard D. Patrick

    IPC分类号： C23C28/02 ,  C23C30/00 ,  C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  H05K3/00 ,  H05K3/38

    CPC分类号： H05K1/09 ,  C25D1/04 ,  C25D3/38 ,  H05K2201/0355 ,  H05K3/382 ,  Y10T428/12

    摘要： This invention is directed to an electrodeposited copper foil having a matte-side raw foil R.sub.tm of about 4 to about 10 microns, an ultimate tensile strength measured at 23.degree. C. in the range of about 55,000 to about 80,000 psi, an elongation measured at 23.degree. C. of about 6% to about 25%, an ultimate tensile strength measured at 180.degree. C. in the range of about 30,000 psi to about 40,000 psi, an elongation measured at 180.degree. C. of about 4% to about 15%, and a thermal stability of less than about -20%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) preparing an electrolyte solution comprising copper ions, sulfate ions, chloride ions at a concentration of about 1.2 to about 4.5 ppm, at least one organic additive at a concentration of about 0.4 to about 20 ppm, and at least one impurity at a concentration of about 0.01 to about 20 grams per liter; (B) flowing said electrolyte solution between an anode and a cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode, the current density being in the range of about 0.1 to about 3 A/cm.sup.2 ; and (C) removing copper foil from said cathode.

    摘要翻译： 本发明涉及一种电沉积铜箔，其具有约4至约10微米的无光泽原始薄膜Rtm，在23℃下测量的约55,000至约80,000psi范围内的极限拉伸强度， 23℃，约6％至约25％，在180℃下测量的极限拉伸强度在约30,000psi至约40,000psi的范围内，在180℃下测量的约4％至约15 ％，热稳定性小于约-20％。 本发明还涉及一种制备上述箔的方法，该方法包括：（A）制备包含铜离子，硫酸根离子，浓度约为1.2至约4.5ppm的氯离子，至少一种有机添加剂的电解质溶液 浓度为约0.4至约20ppm，和至少一种浓度为约0.01至约20克/升的杂质; （B）在阳极和阴极之间流动所述电解质溶液，并且在所述阳极和所述阴极上施加有效量的电压以在所述阴极上沉积铜，所述电流密度在约0.1至约3A / cm 2 ; 和（C）从所述阴极去除铜箔。