公开(公告)号：US20220400590A1

公开(公告)日：2022-12-15

申请号：US17639006

申请日：2020-06-26

Applicant: Siemens Aktiengesellschaft

Inventor： Michael Hanisch ,  Jonas Massierer ,  Marco Matiwe ,  Dennis Sommerfeld ,  Ulrich Wittreich ,  Kay Jarchoff ,  Jörg Schubert ,  Dirk Wormuth

IPC: H05K13/08 ,  B23K1/00 ,  B23K3/08 ,  B23K37/04 ,  H05K13/00

Abstract: Various embodiments of the teachings herein include a device for detecting process parameters during a pass through an assembly line for assembling electronic components and/or for applying joining materials. The device may include: a carrier for transport by a conveying system of the assembly line and configured to receive a test plate; a sensor for measuring a process parameter during the pass; and a force sensor arranged to detect a force acting on the test plate during the pass.

公开(公告)号：US09986648B2

公开(公告)日：2018-05-29

申请号：US15561338

申请日：2016-03-29

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  KLEB- UND GIEβHARZTECHNIK DR. LUDECK GMBH

Inventor： Michael Hanisch ,  Heiko Huth ,  Wolfgang Ludeck ,  Bernd Mueller ,  Mathias Nowottnick ,  Andrey Prihodovsky ,  Dirk Seehase ,  Ulrich Wittreich ,  Dirk Wormuth

IPC: H05K3/34 ,  H05K1/18 ,  B23K1/00 ,  B23K1/008 ,  B23K101/42

CPC classification number: H05K3/341 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3415 ,  H05K3/3494 ,  H05K2203/1163 ,  H05K2203/176

Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.

公开(公告)号：US20180110131A1

公开(公告)日：2018-04-19

申请号：US15561338

申请日：2016-03-29

Applicant: Siemens Aktiengesellschaft ,  Kleb- und Giessharztechnik Dr. Ludeck GmbH

Inventor： Michael Hanisch ,  Heiko Huth ,  Wolfgang Ludeck ,  Bernd Mueller ,  Mathias Nowottnick ,  Andrey Prihodovsky ,  Dirk Seehase ,  Ulrich Wittreich ,  Dirk Wormuth

IPC: H05K3/34 ,  H05K1/18 ,  B23K1/00 ,  B23K1/008

CPC classification number: H05K3/341 ,  B23K1/0006 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3415 ,  H05K3/3494 ,  H05K2203/1163 ,  H05K2203/176

Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.