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8 条记录 (耗时 0.022 秒)

    Laminator
    1.
    发明授权
    Laminator 失效
    层压机

    公开(公告)号：US4844772A

    公开(公告)日：1989-07-04

    申请号：US46603

    申请日：1987-05-07

    申请人： Sigeo Sumi ,  Fumio Hamamura ,  Ichio Fukuda ,  Mitsuhiro Seki ,  Noriyasu Sawada

    发明人： Sigeo Sumi ,  Fumio Hamamura ,  Ichio Fukuda ,  Mitsuhiro Seki ,  Noriyasu Sawada

    IPC分类号： B26D1/00 ,  B26D1/18 ,  B26D5/12 ,  B29C31/00 ,  B32B37/22 ,  G03F7/16

    CPC分类号： B32B37/226 ,  B26D1/0006 ,  B26D1/185 ,  B26D5/12 ,  B32B38/0004 ,  B32B38/1808 ,  B32B38/185 ,  B32B38/1858 ,  G03F7/161 ,  B26D2001/002 ,  B29C2791/006 ,  B29C31/00 ,  B29L2031/3425 ,  Y10T156/1343 ,  Y10T156/1734 ,  Y10T156/1741 ,  Y10T156/1744

    摘要： A laminator for cutting a continuous thin film in a predetermined size and laminating same over a substrate is disclosed which comprises a stationary laminator body; a thin film supply member for supplying the continuous thin film to the substrate; a temporary bonding member for temporarily bonding a leading end of the continuous thin film within a pathway of thin film supply; and a support member for supporting the thin film supply member and the temporary bonding member in such a manner that the thin film supply member and the temporary bonding member are movable toward or away from the substrate. The support member is mounted on the stationary laminator body. The laminator also includes a cutter for cutting the continuous thin film in a predetermined size. The cutter is secured to the laminator body in an area near the pathway of thin film supply between the thin film supply member and the substrate.

    摘要翻译： 公开了一种用于在预定尺寸上切割连续薄膜并层压在衬底上的层压机，其包括固定层压机主体; 用于将所述连续薄膜供给到所述基板的薄膜供给部件; 临时接合构件，用于在薄膜供给路径内暂时粘接连续薄膜的前端; 以及支撑构件，用于以薄膜供给构件和临时接合构件朝向或远离衬底移动的方式支撑薄膜供应构件和临时接合构件。 支撑构件安装在固定层压机主体上。 层压机还包括用于以预定尺寸切割连续薄膜的切割器。 切割器在薄膜供应构件和基底之间的薄膜供应路径附近的区域中固定到层压机主体。

    Laminator
    3.
    发明授权
    Laminator 失效
    层压机

    公开(公告)号：US4909891A

    公开(公告)日：1990-03-20

    申请号：US116819

    申请日：1987-11-05

    申请人： Sigeo Sumi ,  Fumio Hamamura ,  Noriyasu Sawada ,  Ichio Fukuda

    发明人： Sigeo Sumi ,  Fumio Hamamura ,  Noriyasu Sawada ,  Ichio Fukuda

    IPC分类号： B29C31/00 ,  B32B37/22 ,  H05K3/00

    CPC分类号： B32B37/226 ,  B32B38/185 ,  B32B38/1858 ,  B29C2791/006 ,  B29C31/00 ,  B29L2031/3425 ,  H05K3/0079 ,  Y10T156/17 ,  Y10T156/1712

    摘要： A laminator for bonding a film onto a substrate is disclosed which comprises a film supply plate for supplying the film along a supply path, a film temporary bonding body and a film temporary bonding edge member for temporarily bonding the film in pressing contact with the substrate. The film temporary bonding edge member is detachably provided on the film temporary bonding body. A first heat insulator is interposed between the film temporary bonding body and the film temporary bonding edge member. The temporary bonding body is detachably provided at a leading end of the film supply path of the film supply plate. A second insulator is interposed between the film supply plate and the film temporary bonding body.

    摘要翻译： 公开了一种用于将膜结合到基板上的层压机，其包括用于沿着供给路径供应薄膜的薄膜供应板，薄膜临时粘合体和用于临时粘合与基板压接的薄膜临时粘合边缘部件。 胶片临时粘合边缘部件可拆卸地设置在胶片临时粘合体上。 在薄膜临时粘合体和胶片临时粘合边缘部件之间插入第一绝热体。 临时粘合体可拆卸地设置在胶片供给板的胶片供给路径的前端。 第二绝缘体插入在薄膜供应板和薄膜临时粘合体之间。

    Apparatus for fitting rotary
    5.
    发明授权
    Apparatus for fitting rotary 失效
    旋转装置

    公开(公告)号：US4848692A

    公开(公告)日：1989-07-18

    申请号：US935496

    申请日：1986-11-26

    申请人： Fumio Hamamura ,  Noriyasu Sawada ,  Ichio Fukuda

    发明人： Fumio Hamamura ,  Noriyasu Sawada ,  Ichio Fukuda

    IPC分类号： H05K3/06 ,  B29C65/02 ,  B29C65/48 ,  B29L9/00 ,  F16D1/08

    CPC分类号： F16D1/0847 ,  Y10T279/10 ,  Y10T403/7049

    摘要： A device for fixing a roller to a rotary shaft, particularly useful with supply and take-up rollers in a laminator device for printed circuit boards, in which only a single tightening operation is required to fix the roller to the shaft. A support member and a press member when assembled together fit inside an end of the roller. A manually rotatable screw threaded to the press member passes through a hole in the support and presses against a sleeve through which the shaft passes and which is press-fitted inside the support member. Guide plates hold the support member and press member in place.

    摘要翻译： 一种用于将辊固定到旋转轴的装置，特别适用于用于印刷电路板的层压机装置中的供应和卷取辊，其中仅需要单一的紧固操作将辊固定到轴上。 当组装在一起时，支撑构件和压力构件配合在辊的端部内。 螺纹连接到压力构件的可手动旋转的螺纹穿过支撑件中的孔并且压靠轴穿过的套筒，并被压配合在支撑构件内部。 导板将支撑构件和压力构件保持在适当位置。

    Film peeling method and apparatus for practicing same
    6.
    发明授权
    Film peeling method and apparatus for practicing same 失效
    薄膜剥离方法及其实施方法

    公开(公告)号：US5312505A

    公开(公告)日：1994-05-17

    申请号：US979430

    申请日：1992-11-19

    申请人： Shigeo Sumi ,  Fumio Hamamura ,  Mitsuhiro Seki ,  Ichio Fukuda

    发明人： Shigeo Sumi ,  Fumio Hamamura ,  Mitsuhiro Seki ,  Ichio Fukuda

    IPC分类号： B29C63/00 ,  G03F7/16 ,  H05K3/00 ,  B32B35/00

    CPC分类号： H05K3/0079 ,  B29C63/0013 ,  G03F7/16 ,  Y10T156/1105 ,  Y10T156/1906

    摘要： A film peeling apparatus is disclosed wherein a base plate stuck with the films is conveyed to a film peeling position, where a contact tightness of leading edges of the films to the base plate is reduced by a film contact tightness reducer while relative moving speed of the base plate and the reducer is decreased by slowing down the conveyance speed of the base plate or by moving the reducer in synchronism with the conveyance of the base plate without stopping the conveyance of the base plate.

    摘要翻译： 公开了一种薄膜剥离装置，其中粘贴有薄膜的基板被输送到薄膜剥离位置，其中薄膜前端到底板的接触紧密度通过薄膜接触紧密度减小器减小，同时相对移动速度 通过减慢基板的输送速度或者通过与基板的输送同步地移动减速器，而不停止基板的输送，减小了基板和减速器。

    Thin film coating method
    7.
    发明授权
    Thin film coating method 失效
    薄膜涂布法

    公开(公告)号：US4844758A

    公开(公告)日：1989-07-04

    申请号：US159996

    申请日：1988-02-24

    申请人： Fumio Hamamura ,  Ichio Fukuda

    发明人： Fumio Hamamura ,  Ichio Fukuda

    IPC分类号： G03F7/16 ,  B29C63/02 ,  B29C65/02 ,  B29C65/78 ,  B29L9/00 ,  B32B37/16 ,  B32B37/22 ,  G03C1/74 ,  G03F7/00 ,  G03F7/26 ,  H05K3/00 ,  H05K3/06

    CPC分类号： B32B37/226 ,  B32B38/185 ,  B29L2031/3425 ,  B32B2457/08 ,  H05K3/0079 ,  Y10T156/1343

    摘要： In a thin film coating method, tack members are brought close to a surface of a substrate to temporarily tack the forward end portion of a web of thin film to the forward end of the substrate. Compression-bonding rollers are then brought into a tacking position where the forward end portion of the thin film is tacked from a standby position where the compression-bonding rollers do not touch the tack members to make compression-bonding contact with the forward end portion of the tacked thin film after the tack members are moved away from the surface of the substrate. The compression-bonding rollers are then rotated at the tacking position for the double purpose of conveying the substrate and adhering the thin film to the substrate. In this process, the forward end of the substrate is detected to produce a detection signal at a detection position before the substrate is conveyed to the tacking position, the conveyance of the substrate is stopped after the forward end of the substrate has been conveyed from the detection position to the tacking position, and the tack members are brought close to the conveyance passage of the substrate while the forward end of the substrate is being conveyed from the detection position to the tacking position to thereby tack the forward end of the thin film to the surface of the substrate after the forward end of the substrate is stopped at the tacking position.

    Method of peeling a bonded film from a circuit board
    8.
    发明授权
    Method of peeling a bonded film from a circuit board 失效
    从电路板剥离粘结膜的方法

    公开(公告)号：US5110393A

    公开(公告)日：1992-05-05

    申请号：US532408

    申请日：1990-06-04

    申请人： Shigeo Sumi ,  Ichio Fukuda

    发明人： Shigeo Sumi ,  Ichio Fukuda

    IPC分类号： B65H41/00 ,  B29C63/00 ,  H05K3/00 ,  H05K3/06

    CPC分类号： B29C63/0013 ,  H05K3/0079 ,  Y10S156/922 ,  Y10S29/078 ,  Y10T156/11 ,  Y10T156/19

    摘要： An apparatus for bonding a multi-layer thin film onto a substrate and for removing a layer of the film. A printed circuit board having a multi-layer film bonded to a planar surface thereof has one layer of the film lifted at a leading edge by vibration and fluid pressure. The leading edge is mechanically gripped and a pulling force applied thereto to draw the film from the surface of the circuit board and to transfer the removed film along a path to a discharge apparatus. The transfer apparatus includes frictionally engaged belts which direct the film along a transfer path to a source of ionized fluid which is applied to the film in order to remove static and direct the film along the transfer path towards a used film receptacle.