公开(公告)号：US20140191386A1

公开(公告)日：2014-07-10

申请号：US13894716

申请日：2013-05-15

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Mei-Chin Lee ,  Wang-Ting Chen ,  Chi-Tung Yeh ,  Chun-Tang Lin ,  Yi-Che Lai

IPC: H01L21/48 ,  H01L23/373

CPC classification number: H01L23/3738 ,  H01L23/367 ,  H01L23/42 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

Abstract: A semiconductor package is provided. The semiconductor package includes a substrate; a semiconductor element having opposite active and inactive surfaces and disposed on the substrate via the active surface thereof, wherein the inactive surface of the semiconductor element is roughened; a thermally conductive layer bonded to the inactive surface of the semiconductor element; and a heat sink disposed on the thermally conductive layer. The roughened inactive surface facilitates the bonding between the semiconductor element and the thermally conductive layer so as to eliminate the need to perform a gold coating process and the use of a flux and consequently reduce the formation of voids in the thermally conductive layer.

Abstract translation: 提供半导体封装。 半导体封装包括衬底; 半导体元件具有相反的有源和非活性表面，并经由其活性表面设置在衬底上，其中半导体元件的非活性表面被粗糙化; 接合到半导体元件的非活性表面的导热层; 以及布置在导热层上的散热器。 粗糙化的非活性表面促进了半导体元件和导热层之间的结合，从而消除了执行镀金工艺和使用焊剂的需要，从而减少导热层中空隙的形成。

公开(公告)号：US20140027926A1

公开(公告)日：2014-01-30

申请号：US13872468

申请日：2013-04-29

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wang-Ting Chen ,  Mu-Hsuan Chan ,  Yi-Chian Liao ,  Chun-Tang Lin ,  Yi-Che Lai

IPC: H01L23/28 ,  H01L23/538 ,  H01L21/56

CPC classification number: H01L21/561 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/28 ,  H01L23/31 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/81

Abstract: A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.

Abstract translation: 提供半导体封装，包括：载体; 至少设置在所述载体上的插入件; 形成在所述载体上的密封剂，用于在暴露所述插入件的顶侧的同时封装所述插入件; 设置在所述插入件的顶侧的半导体元件; 以及形成在插入件和半导体元件之间的粘合剂。 通过用封装剂封装插入件，避免了插入器的翘曲，并且为了将半导体元件设置在其上提供平坦的表面，从而提高了插入件与半导体元件之间的电连接的可靠性。