公开(公告)号：US11024567B2

公开(公告)日：2021-06-01

申请号：US16677150

申请日：2019-11-07

Applicant: Siyang Grande Electronics Co., Ltd.

Inventor： Yunhui Zhong

IPC: H01L21/56 ,  H01L23/495 ,  H01L21/78 ,  H01L21/66 ,  H01L23/31 ,  H01L29/861 ,  H05K3/34

Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.

公开(公告)号：US20170154840A1

公开(公告)日：2017-06-01

申请号：US15361144

申请日：2016-11-25

Applicant: Siyang Grande Electronics Co., Ltd.

Inventor： Yunhui Zhong

IPC: H01L23/495 ,  H01L21/66 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L29/861

CPC classification number: H01L23/49562 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L22/10 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49551 ,  H01L23/49579 ,  H01L29/861 ,  H01L2224/32245 ,  H05K3/3426 ,  H05K2201/10174 ,  H05K2201/10628 ,  H05K2201/10651

Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.