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1.发明申请公开(公告)号：US20180294569A1
公开(公告)日：2018-10-11
申请号：US15943416
申请日：2018-04-02
发明人： Dinhphuoc Vu Hoang , Robert Francis Darveaux , Anthony James LoBianco , Lori Ann DeOrio , Hoang Mong Nguyen , Ki Wook Lee , Hardik Bhupendra Modi , Foad Arfaei Malekzadeh , Stephen Joseph Kovacic , René Rodriguez
摘要： An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The mold compound has a cavity defined therein between the planar antenna and the printed circuit board module, the cavity filled with a material different than the mold compound material. Optionally, the cavity can be filled with air. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.
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公开(公告)号：US10256535B2
公开(公告)日：2019-04-09
申请号：US15490436
申请日：2017-04-18
发明人： Hoang Mong Nguyen , Anthony James LoBianco , Gregory Edward Babcock , Darren Roger Frenette , George Khoury , René Rodriguez
IPC分类号： H01Q1/52 , H01Q1/22 , H01Q1/38 , H01L21/027 , H01L21/268 , H01L21/285 , H01L21/3205 , H01L21/78 , H01L23/498 , H01L23/552 , H01L23/66 , H01L23/00
摘要： Selectively shielded radio frequency modules are disclosed. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.
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公开(公告)号：US11069978B2
公开(公告)日：2021-07-20
申请号：US15943383
申请日：2018-04-02
发明人： Dinhphuoc Vu Hoang , Robert Francis Darveaux , Anthony James LoBianco , Lori Ann DeOrio , Hoang Mong Nguyen , Ki Wook Lee , Hardik Bhupendra Modi , Foad Arfaei Malekzadeh , Stephen Joseph Kovacic , René Rodriguez
IPC分类号： H01Q9/04 , B29C41/42 , H01Q5/35 , H01Q9/06 , H01Q1/52 , B29L31/34 , H01Q1/38 , H01Q21/06 , H01Q1/22
摘要： A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.
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公开(公告)号：US20180294568A1
公开(公告)日：2018-10-11
申请号：US15943383
申请日：2018-04-02
发明人： Dinhphuoc Vu Hoang , Robert Francis Darveaux , Anthony James LoBianco , Lori Ann DeOrio , Hoang Mong Nguyen , Ki Wook Lee , Hardik Bhupendra Modi , Foad Arfaei Malekzadeh , Stephen Joseph Kovacic , René Rodriguez
摘要： A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.
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公开(公告)号：US20180294558A1
公开(公告)日：2018-10-11
申请号：US15942941
申请日：2018-04-02
发明人： Dinhphuoc Vu Hoang , Robert Francis Darveaux , Anthony James LoBianco , Lori Ann DeOrio , Hoang Mong Nguyen , Ki Wook Lee , Hardik Bhupendra Modi , Foad Arfaei Malekzadeh , Stephen Joseph Kovacic , René Rodriguez
摘要： An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.
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公开(公告)号：US20210399423A1
公开(公告)日：2021-12-23
申请号：US17305647
申请日：2021-07-12
发明人： Dinhphuoc Vu Hoang , Robert Francis Darveaux , Anthony James LoBianco , Lori Ann DeOrio , Hoang Mong Nguyen , Ki Wook Lee , Hardik Bhupendra Modi , Foad Arfaei Malekzadeh , Stephen Joseph Kovacic , René Rodriguez
摘要： An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.
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公开(公告)号：US20170301986A1
公开(公告)日：2017-10-19
申请号：US15490436
申请日：2017-04-18
发明人： Hoang Mong Nguyen , Anthony James LoBianco , Gregory Edward Babcock , Darren Roger Frenette , George Khoury , René Rodriguez
CPC分类号： H01Q1/526 , H01L21/027 , H01L21/268 , H01L21/2855 , H01L21/28568 , H01L21/32051 , H01L21/78 , H01L23/498 , H01L23/552 , H01L23/66 , H01L24/48 , H01L2223/6611 , H01L2223/6644 , H01L2223/6677 , H01L2224/48091 , H01L2924/01022 , H01L2924/01029 , H01L2924/1421 , H01Q1/2283 , H01Q1/2291 , H01Q1/38 , H01Q9/42
摘要： Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.
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