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11 条记录 (耗时 0.017 秒)

    Thermally stable diamond polycrystalline diamond constructions
    1.
    发明授权
    Thermally stable diamond polycrystalline diamond constructions 有权

    公开(公告)号：US10350731B2

    公开(公告)日：2019-07-16

    申请号：US14062533

    申请日：2013-10-24

    申请人： Smith International, Inc.

    发明人： Ronald K. Eyre ,  Anthony Griffo ,  Thomas W. Oldham

    IPC分类号： B24D3/10 ,  C22C26/00 ,  E21B10/567 ,  B22F3/24 ,  B22F5/00

    摘要： Thermally stable diamond constructions comprise a diamond body having a plurality of bonded diamond crystals, a plurality of interstitial regions disposed among the crystals, and a substrate attached to the body. The body includes a working surface and a side surface extending away from the working surface to the substrate. The body comprises a first region adjacent the side surface that is substantially free of a catalyst material and that extends a partial depth into the diamond body. The first region can further extend to at least a portion of the working surface and a partial depth therefrom into the diamond body. The diamond body can be formed from natural diamond grains and/or a mixture of natural and synthetic diamond grains. A surface of the diamond body is treated to provide the first region, and before treatment is finished to an approximate final dimension.

    SOLID PCD CUTTER
    2.
    发明申请
    SOLID PCD CUTTER 有权
    固体PCD切割机

    公开(公告)号：US20130168159A1

    公开(公告)日：2013-07-04

    申请号：US13719326

    申请日：2012-12-19

    申请人： Smith International, Inc.

    发明人： Ronald K. Eyre ,  Daniel J. Belnap ,  Youhe Zhang ,  Yuelin Shen ,  Jibin Shi ,  Yuri Burhan

    IPC分类号： E21B10/46

    CPC分类号： B24D18/0009 ,  B22F3/14 ,  B22F5/00 ,  B22F7/008 ,  B22F2005/001 ,  C04B35/52 ,  C22C26/00 ,  E21B10/46 ,  E21B10/54 ,  E21B10/567

    摘要： A method of forming a cutting element may include placing a plurality of diamond particles adjacent to a substrate in a reaction cell; and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body; wherein the polycrystalline diamond body comprises a cutting face area to thickness ratio ranging from 60:16 to 500:5; and wherein the polycrystalline diamond body has at least one dimension greater than 8 mm

    摘要翻译： 形成切割元件的方法可以包括将多个与基底相邻的金刚石颗粒放置在反应池中; 并使所述多个金刚石颗粒经受高压高温条件以形成多晶金刚石体; 其中所述多晶金刚石主体包括60:16至500:5的切割面积与厚度之比; 并且其中所述多晶金刚石主体具有大于8mm的至少一个尺寸

    PCD wafer without substrate for high pressure / high temperature sintering
    4.
    发明授权
    PCD wafer without substrate for high pressure / high temperature sintering 有权

    公开(公告)号：US10046441B2

    公开(公告)日：2018-08-14

    申请号：US14566195

    申请日：2014-12-10

    申请人： SMITH INTERNATIONAL, INC.

    发明人： Yahua Bao ,  Ronald K. Eyre

    IPC分类号： B24D18/00 ,  B24D99/00 ,  E21B10/56 ,  E21B10/55 ,  E21B10/567

    摘要： A method of forming a cutting element may include subjecting a first press containing at least a diamond powder-containing container and a volume of a high melting temperature non-reactive material to a first high pressure high temperature sintering condition to form a sintered polycrystalline diamond wafer including a diamond matrix of diamond grains bonded together and a plurality of interstitial spaces between the bonded together diamond grains; and subjecting a second press containing the sintered polycrystalline diamond wafer and a substrate to a second high temperature high pressure condition, thereby attaching the wafer to the substrate to form a cutting element having a polycrystalline diamond layer on the substrate.

    Polycrystalline diamond sintered/rebonded on carbide substrate containing low tungsten
    7.
    发明授权
    Polycrystalline diamond sintered/rebonded on carbide substrate containing low tungsten 有权

    公开(公告)号：US10358705B2

    公开(公告)日：2019-07-23

    申请号：US15536826

    申请日：2015-11-20

    申请人： Smith International, Inc.

    发明人： Yahua Bao ,  Fulong Wang ,  J. Daniel Belnap ,  Ronald K. Eyre ,  Yi Fang

    IPC分类号： B22F3/14 ,  C22C1/10 ,  C22C26/00 ,  E21B10/573 ,  B22F5/00

    摘要： A method of forming a polycrystalline diamond cutting element includes assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly. The substrate includes an attachment material including a refractory metal. The assembly is subjected to a first high-pressure/high temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material and subjected to a second high-pressure/high temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to bond the infiltrated diamond material to the substrate.

    PCD WAFER WITHOUT SUBSTRATE FOR HIGH PRESSURE / HIGH TEMPERATURE SINTERING
    9.
    发明申请
    PCD WAFER WITHOUT SUBSTRATE FOR HIGH PRESSURE / HIGH TEMPERATURE SINTERING 审中-公开
    无高压/高温烧结基板的PCD波形

    公开(公告)号：US20150183092A1

    公开(公告)日：2015-07-02

    申请号：US14566195

    申请日：2014-12-10

    申请人： SMITH INTERNATIONAL, INC.

    发明人： Yahua Bao ,  Ronald K. Eyre

    IPC分类号： B24D18/00 ,  E21B10/56 ,  B24D99/00

    CPC分类号： B24D18/0009 ,  B24D99/005 ,  E21B10/55 ,  E21B10/56 ,  E21B10/567

    摘要： A method of forming a cutting element may include subjecting a first press containing at least a diamond powder-containing container and a volume of a high melting temperature non-reactive material to a first high pressure high temperature sintering condition to form a sintered polycrystalline diamond wafer including a diamond matrix of diamond grains bonded together and a plurality of interstitial spaces between the bonded together diamond grains; and subjecting a second press containing the sintered polycrystalline diamond wafer and a substrate to a second high temperature high pressure condition, thereby attaching the wafer to the substrate to form a cutting element having a polycrystalline diamond layer on the substrate.

    摘要翻译： 形成切割元件的方法可以包括将含有至少含金刚石粉末的容器和一定体积的高熔点非反应性材料的第一压榨机经受第一高压高温烧结条件以形成烧结多晶金刚石晶片 包括结合在一起的金刚石晶粒的金刚石矩阵和在结合的金刚石晶粒之间的多个间隙空间; 以及使包含所述烧结的多晶金刚石晶片和衬底的第二压机经受第二高温高压条件，从而将所述晶片附着到所述衬底上，以在所述衬底上形成具有多晶金刚石层的切割元件。

    METHOD OF FORMING A THERMALLY STABLE DIAMOND CUTTING ELEMENT
    10.
    发明申请
    METHOD OF FORMING A THERMALLY STABLE DIAMOND CUTTING ELEMENT 审中-公开
    形成耐热金刚石切割元件的方法

    公开(公告)号：US20140283457A1

    公开(公告)日：2014-09-25

    申请号：US14297320

    申请日：2014-06-05

    申请人： Smith International, Inc.

    发明人： Peter T. Cariveau ,  Ronald K. Eyre ,  Yi Fang

    IPC分类号： B24D18/00 ,  B24D3/10

    CPC分类号： B24D18/0009 ,  B01J3/062 ,  B01J2203/062 ,  B01J2203/0655 ,  B01J2203/0685 ,  B22F7/062 ,  B22F2998/10 ,  B24D3/10 ,  C01B32/25 ,  C22C26/00 ,  C22C2204/00 ,  B22F2003/244 ,  B22F3/1208 ,  B22F3/15

    摘要： A method for forming a diamond body includes placing a thermally stable polycrystalline diamond body and a first substrate into an enclosure, the thermally stable polycrystalline diamond body comprising a plurality of bonded diamond crystals and a plurality of interstitial regions between the bonded diamond crystals, the interstitial regions being substantially free of a catalyst material, heating the thermally stable polycrystalline diamond body and the first substrate to remove residual materials from the thermally stable polycrystalline diamond body, subjecting the thermally stable polycrystalline diamond body and the first substrate to a vacuum for evacuating such residual material, and pressing under high temperature the enclosure, the thermally stable polycrystalline diamond body and the first substrate while maintaining a vacuum in the enclosure to bond the thermally stable polycrystalline diamond body to the substrate.

    摘要翻译： 用于形成金刚石体的方法包括将热稳定的多晶金刚石体和第一基底放置在外壳中，所述热稳定的多晶金刚石体包括多个结合的金刚石晶体和在结合的金刚石晶体之间的多个间隙区域，间隙 基本上不含催化剂材料的区域，加热热稳定的多晶金刚石体和第一基底以从热稳定的多晶金刚石体去除残留的材料，使热稳定的多晶金刚石体和第一基底经受真空以排出这种残余物 材料，并且在高温下压制外壳，热稳定的多晶金刚石体和第一基底，同时在外壳中保持真空以将热稳定的多晶金刚石体粘合到基底上。