摘要:
A portion of a container includes a plurality of first resilient support members having a first height. The first resilient support members are configured to contact an edge of a component placed in the container. A plurality of second support members each have a second, smaller height. The second support members are arranged relative to the first resilient support members such that the second support members contact the edge of the component if corresponding ones of the first resilient support members deflect a sufficient amount.
摘要:
A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.
摘要:
A container for packaging items such as semiconductor wafers has a restraining portion with a changeable dimension at an open end that facilitates using conventional loading techniques while also more securely containing the items to avoid undesirable movement of the items in the container. In one example embodiment, the restraining portion includes a sidewall portion that has a first, nominal inside dimension at one end. A second end of the sidewall portion has a second, greater inside dimension at an open end. Another member of the container cooperates with the sidewall portion to change the inside dimension at the open end from the second, greater dimension to the first, nominal dimension. The nominal dimension is selected to correspond to an exterior dimension of the items to be contained within the package so that the container maintains the items in a secure alignment that eliminates lateral movement of the items once the container is secured.
摘要:
A plastic cushion pad (40) includes at least one plastic spring portion (46) between oppositely facing contact surfaces (42, 44). In one example, the pad (40) is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion (46) is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.
摘要:
A carrier for handling integrated circuit components during storage and shipping includes a plurality of pocket portions each for supporting an individual component. The pocket portions include a base surface and a plurality of sidewalls defining the pocket generally. The sidewalls include support surfaces arranged at a first, oblique angle relative to the base surface. A plurality of retainer surfaces are associated with at least some of the support surfaces. The retainer surfaces extend at a second angle relative to the base surface. The retainer surfaces cooperate with the support surfaces to maintain the integrated circuit components within the pockets in a desired alignment throughout handling. One example includes guide surfaces that facilitate inserting the components into the pockets.
摘要:
A portion of a container includes a plurality of first resilient support members having a first height. The first resilient support members are configured to contact an edge of a component placed in the container. A plurality of second support members each have a second, smaller height. The second support members are arranged relative to the first resilient support members such that the second support members contact the edge of the component if corresponding ones of the first resilient support members deflect a sufficient amount.
摘要:
A component carrier, for holding for purposes of automated visual inspection an electrical component having a lead with a free end, includes a carrier substrate and a pocket recessed in the substrate for holding the component in the interior of the pocket. The pocket includes a wall, depending from the carrier substrate and defining a lateral boundary of the pocket, and a bottom. There is a lead-tip horizontal plane and a lead-tip vertical plane when a correctly constructed component of the type the carrier is intended to hold is properly oriented in the pocket. The lead-tip vertical plane is perpendicular to a longitudinal axis of the pocket. The wall slopes down and inwardly at a first angle relative to the substrate through the lead-tip horizontal plane and at a second angle relative to the substrate through the lead-tip vertical plane. The first angle is greater than or equal to approximately 75.degree. and less than or equal to 90.degree., and the second angle is less than 90.degree. and not greater than the first angle.