LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20210151955A1

    公开(公告)日:2021-05-20

    申请号:US16627174

    申请日:2018-04-27

    申请人: Sony Corporation

    IPC分类号: H01S5/183 H01S5/343 H01S5/02

    摘要: A method of manufacturing a light emitting element includes, at least: (A) forming a stacked structure 20 which includes a GaN-based compound semiconductor and in which a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22 are stacked, and forming a concave mirror section 43 on a first surface side of the first compound semiconductor layer 21; then (B) forming a photosensitive material layer 35 over the second compound semiconductor layer 22; and thereafter (C) exposing the photosensitive material layer 35 to light from the concave mirror section side through the stacked structure 20, to obtain a treatment mask layer including the photosensitive material layer 35, and then processing the second compound semiconductor layer 22 by use of the treatment mask layer.

    LIGHT EMITTING ELEMENT
    2.
    发明申请

    公开(公告)号:US20210135428A1

    公开(公告)日:2021-05-06

    申请号:US16471428

    申请日:2017-10-13

    申请人: Sony Corporation

    IPC分类号: H01S5/183 H01S5/343 H01S5/02

    摘要: A light emitting element according to the present disclosure includes a first light reflecting layer 41, a laminated structure 20, and a second light reflecting layer 42 laminated to each other. The laminated structure 20 includes a first compound semiconductor layer 21, a light emitting layer 23, and a second compound semiconductor layer 22 laminated to each other from a side of the first light reflecting layer. Light from the laminated structure 20 is emitted to an outside via the first light reflecting layer 41 or the second light reflecting layer 42. The first light reflecting layer 41 has a structure in which at least two types of thin films 41A and 41B are alternately laminated to each other in plural numbers. A film thickness modulating layer 80 is provided between the laminated structure 20 and the first light reflecting layer 41.

    LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230055932A1

    公开(公告)日:2023-02-23

    申请号:US17975219

    申请日:2022-10-27

    申请人: Sony Corporation

    IPC分类号: H01S5/183 H01S5/343

    摘要: A light-emitting element includes: a laminated structure body 20 which is formed from a GaN-based compound semiconductor and in which a first compound semiconductor layer 21 including a first surface 21a and a second surface 21b that is opposed to the first surface 21a, an active layer 23 that faces the second surface 21b of the first compound semiconductor layer 21, and a second compound semiconductor layer 22 including a first surface 22a that faces the active layer 23 and a second surface 22b that is opposed to the first surface 22a are laminated; a first light reflection layer 41 that is provided on the first surface 21a side of the first compound semiconductor layer 21; and a second light reflection layer 42 that is provided on the second surface 22b side of the second compound semiconductor layer 22. The first light reflection layer 41 includes a concave mirror portion 43, and the second light reflection layer 42 has a flat shape.

    LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20210104870A1

    公开(公告)日:2021-04-08

    申请号:US17127383

    申请日:2020-12-18

    申请人: Sony Corporation

    IPC分类号: H01S5/183 H01S5/343

    摘要: A light-emitting element includes: a laminated structure body 20 which is formed from a GaN-based compound semiconductor and in which a first compound semiconductor layer 21 including a first surface 21a and a second surface 21b that is opposed to the first surface 21a, an active layer 23 that faces the second surface 21b of the first compound semiconductor layer 21, and a second compound semiconductor layer 22 including a first surface 22a that faces the active layer 23 and a second surface 22b that is opposed to the first surface 22a are laminated; a first light reflection layer 41 that is provided on the first surface 21a side of the first compound semiconductor layer 21; and a second light reflection layer 42 that is provided on the second surface 22b side of the second compound semiconductor layer 22. The first light reflection layer 41 includes a concave mirror portion 43, and the second light reflection layer 42 has a flat shape.

    LIGHT EMITTING ELEMENT AND LIGHT EMITTING ELEMENT ARRAY

    公开(公告)号:US20200169061A1

    公开(公告)日:2020-05-28

    申请号:US16631709

    申请日:2018-05-09

    申请人: Sony Corporation

    IPC分类号: H01S5/183 H01S5/30

    摘要: A light emitting element includes: a laminated structure 20 obtained by laminating a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22; a first light reflecting layer 41 disposed on a first surface side of the first compound semiconductor layer 21; a second light reflecting layer 42 disposed on a second surface side of the second compound semiconductor layer 22; and light convergence/divergence changing means 50. The first light reflecting layer 41 is formed on a concave mirror portion 43. The second light reflecting layer 42 has a flat shape. When light generated in the active layer 23 is emitted to the outside, a light convergence/divergence state before the light is incident on the light convergence/divergence changing means 50 is different from a light convergence/divergence state after the light passes through the light convergence/divergence changing means 50.

    SURFACE-EMITTING LASER AND ELECTRONIC APPARATUS

    公开(公告)号:US20190334318A1

    公开(公告)日:2019-10-31

    申请号:US16463309

    申请日:2017-10-19

    申请人: Sony Corporation

    IPC分类号: H01S5/187 H01S5/125

    摘要: A surface-emitting laser according to an embodiment of the present disclosure includes a current constriction region having an opening and formed by impurities injected into a laminate from side of a second semiconductor layer; and a first DBR layer on side of a first semiconductor layer and a second DBR layer on the side of the second semiconductor layer having the laminate interposed therebetween at a position facing the opening. At the opening, an opening diameter close to the first DBR layer is larger than an opening diameter close to the second DBR layer.

    LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20190267774A1

    公开(公告)日:2019-08-29

    申请号:US16345803

    申请日:2017-09-01

    申请人: Sony Corporation

    IPC分类号: H01S5/183 H01S5/343

    摘要: A light-emitting element includes: a laminated structure body 20 which is formed from a GaN-based compound semiconductor and in which a first compound semiconductor layer 21 including a first surface 21a and a second surface 21b that is opposed to the first surface 21a, an active layer 23 that faces the second surface 21b of the first compound semiconductor layer 21, and a second compound semiconductor layer 22 including a first surface 22a that faces the active layer 23 and a second surface 22b that is opposed to the first surface 22a are laminated; a first light reflection layer 41 that is provided on the first surface 21a side of the first compound semiconductor layer 21; and a second light reflection layer 42 that is provided on the second surface 22b side of the second compound semiconductor layer 22. The first light reflection layer 41 includes a concave mirror portion 43, and the second light reflection layer 42 has a flat shape.

    LIGHT EMITTING ELEMENT
    9.
    发明公开

    公开(公告)号:US20230208106A1

    公开(公告)日:2023-06-29

    申请号:US18111686

    申请日:2023-02-20

    申请人: Sony Corporation

    IPC分类号: H01S5/183 H01S5/02 H01S5/343

    摘要: A light emitting element according to the present disclosure includes a first light reflecting layer 41, a laminated structure 20, and a second light reflecting layer 42 laminated to each other. The laminated structure 20 includes a first compound semiconductor layer 21, a light emitting layer 23, and a second compound semiconductor layer 22 laminated to each other from a side of the first light reflecting layer. Light from the laminated structure 20 is emitted to an outside via the first light reflecting layer 41 or the second light reflecting layer 42. The first light reflecting layer 41 has a structure in which at least two types of thin films 41A and 41B are alternately laminated to each other in plural numbers. A film thickness modulating layer 80 is provided between the laminated structure 20 and the first light reflecting layer 41.