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公开(公告)号：US20090023431A1
公开(公告)日：2009-01-22
申请号：US11779919
申请日：2007-07-19
申请人： Soon Peng Jason Sim , Chee Yung Tan , Kum Cheong Adam Chan , Koon Gee Ho , Chi Hock Goh , Chen Chin Jimmy Wong , Wee Yi Lee , Koh Yew Thoon , Lay Wei Ang
发明人： Soon Peng Jason Sim , Chee Yung Tan , Kum Cheong Adam Chan , Koon Gee Ho , Chi Hock Goh , Chen Chin Jimmy Wong , Wee Yi Lee , Koh Yew Thoon , Lay Wei Ang
IPC分类号： H04M3/00
摘要： Systems and methods for communicating with a network device are provided. In this regard, a representative system, among others, includes a network switch associated with a telecommunications device; and a wireless interface device that wirelessly communicates with the network switch, the wireless interface device being configured to obtain information associated with the network switch and display at least a portion of the information obtained on a display device. A representative method, among others, for communicating with a network switch includes establishing a wireless link between the network switch and a wireless interface device; obtaining information associated with the network switch by the wireless interface device via the wireless link; and displaying at least a portion of the information obtained on a display device of the wireless interface device.
摘要翻译： 提供了与网络设备通信的系统和方法。 在这方面，代表性系统包括与电信设备相关联的网络交换机; 以及无线接口设备，其与所述网络交换机无线通信，所述无线接口设备被配置为获得与所述网络交换机相关联的信息并且显示在显示设备上获得的信息的至少一部分。 用于与网络交换机通信的代表性方法包括在网络交换机和无线接口设备之间建立无线链路; 通过所述无线接口装置获取与所述网络交换机相关联的信息; 以及显示在无线接口装置的显示装置上获得的信息的至少一部分。
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公开(公告)号：US20130277818A1
公开(公告)日：2013-10-24
申请号：US13977911
申请日：2011-01-20
申请人： Chi Hock Goh , Soon Peng Jason Sim , Poh Boon Teo
发明人： Chi Hock Goh , Soon Peng Jason Sim , Poh Boon Teo
IPC分类号： H01L23/00
CPC分类号： H01L23/562 , H01L21/67333 , H01L24/83 , H01L2224/83 , H01L2924/14 , H05K1/0271 , H05K3/3436 , H05K2201/1031 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： In one embodiment, a chip carrier support system includes a chip carrier support structure and a chip carrier. The chip carder forms a complementary fit with the chip carder support structure and includes an integrated circuit and a plurality of leads in communication with the integrated circuit.
摘要翻译： 在一个实施例中，芯片载体支撑系统包括芯片载体支撑结构和芯片载体。 芯片卡片器与芯片卡片支持结构形成互补配合，并且包括集成电路和与集成电路通信的多个引线。
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公开(公告)号：US20090229810A1
公开(公告)日：2009-09-17
申请号：US12195425
申请日：2008-08-21
IPC分类号： F24F11/053 , H05K7/20
CPC分类号： H05K7/20745
摘要： Embodiments of remote exhaust for dissipating heat in computers or other electronic devices are disclosed. An exemplary method may include coupling branch lines to each of a plurality of fan-less chassis in the rack system. The method may also include coupling the branch lines to at least one main line. The method may also include connecting the main line to at least one exhaust pump to remove heat generated in each of the plurality of fan-less chassis to a physically remote environment.
摘要翻译： 公开了用于在计算机或其他电子设备中散热的远程排气的实施例。 示例性方法可以包括将分支线耦合到机架系统中的多个无风扇框架中的每一个。 该方法还可以包括将分支线耦合到至少一条主线。 该方法还可以包括将主线路连接到至少一个排气泵以将多个无风扇机架中的每一个中产生的热量移除到物理上远离的环境。
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公开(公告)号：US08355251B2
公开(公告)日：2013-01-15
申请号：US12195425
申请日：2008-08-21
CPC分类号： H05K7/20745
摘要： Embodiments of remote exhaust for dissipating heat in computers or other electronic devices are disclosed. An exemplary method may include coupling branch lines to each of a plurality of fan-less chassis in the rack system. The method may also include coupling the branch lines to at least one main line. The method may also include connecting the main line to at least one exhaust pump to remove heat generated in each of the plurality of fan-less chassis to a physically remote environment.
摘要翻译： 公开了用于在计算机或其他电子设备中散热的远程排气的实施例。 示例性方法可以包括将分支线耦合到机架系统中的多个无风扇框架中的每一个。 该方法还可以包括将分支线耦合到至少一条主线。 该方法还可以包括将主线路连接到至少一个排气泵以将多个无风扇机架中的每一个中产生的热量移动到物理上远离的环境。
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5.发明授权公开(公告)号：US08157593B1
公开(公告)日：2012-04-17
申请号：US12969611
申请日：2010-12-16
申请人： Soon Peng Jason Sim , Cheng Nam Lee
发明人： Soon Peng Jason Sim , Cheng Nam Lee
IPC分类号： H01R13/68
CPC分类号： H01R13/6582 , H01R13/74 , Y10S439/927 , Y10S439/939
摘要： An electronic communications equipment chassis has a panel with an aperture for receiving a connector module having at least one female jack. A plurality of elongate members of conductive material are attached to the panel, project into the aperture and form an EMI shield around the connector module.
摘要翻译： 电子通信设备底盘具有带孔的面板，用于接收具有至少一个母插孔的连接器模块。 导电材料的多个细长构件附接到面板，突出到孔中并在连接器模块周围形成EMI屏蔽。
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