公开(公告)号：US20090189271A1

公开(公告)日：2009-07-30

申请号：US12352056

申请日：2009-01-12

申请人： Soon-yong HUR ,  Mo-rae Kim ,  Hyeong-seob Kim

发明人： Soon-yong HUR ,  Mo-rae Kim ,  Hyeong-seob Kim

IPC分类号： H01L23/498

CPC分类号： H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package. The semiconductor package includes a substrate having a first surface and a second surface, a semiconductor chip mounted on the first surface of the substrate, at least one land disposed on the second surface of the substrate, and whose circumference includes a plurality of first group arcs, a mask layer covering the second surface of the substrate and including at least one opening that exposes the at least one land, and at least one external terminal disposed on the at least one land, wherein a portion of the at least one land is covered by the mask layer, and a sidewall of another portion of the at least one land is exposed by the at least one opening, and the circumference of the at least one opening includes a plurality of second group arcs, and a radius of the outermost arc from among the plurality of first group arcs is equal to a radius of the outermost arc from among the plurality of second group arcs.

摘要翻译： 一种印刷电路板，其使用大容量半导体芯片，半导体封装和卡的封装以及使用半导体封装的系统提供高可靠性。 半导体封装包括具有第一表面和第二表面的衬底，安装在衬底的第一表面上的半导体芯片，设置在衬底的第二表面上的至少一个焊盘，并且其周边包括多个第一组弧 覆盖基板的第二表面并包括暴露至少一个焊盘的至少一个开口的掩模层和设置在至少一个焊盘上的至少一个外部端子，其中所述至少一个焊盘的一部分被覆盖 并且所述至少一个平台的另一部分的侧壁被所述至少一个开口暴露，并且所述至少一个开口的圆周包括多个第二组弧，并且所述最外弧的半径 多个第一组弧之间的距离等于多个第二组弧之中的最外弧的半径。

公开(公告)号：US08026616B2

公开(公告)日：2011-09-27

申请号：US12352056

申请日：2009-01-12

申请人： Soon-yong Hur ,  Mo-rae Kim ,  Hyeong-seob Kim

发明人： Soon-yong Hur ,  Mo-rae Kim ,  Hyeong-seob Kim

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package. The semiconductor package includes a substrate having a first surface and a second surface, a semiconductor chip mounted on the first surface of the substrate, at least one land disposed on the second surface of the substrate, and whose circumference includes a plurality of first group arcs, a mask layer covering the second surface of the substrate and including at least one opening that exposes the at least one land, and at least one external terminal disposed on the at least one land, wherein a portion of the at least one land is covered by the mask layer, and a sidewall of another portion of the at least one land is exposed by the at least one opening, and the circumference of the at least one opening includes a plurality of second group arcs, and a radius of the outermost arc from among the plurality of first group arcs is equal to a radius of the outermost arc from among the plurality of second group arcs.

摘要翻译： 一种印刷电路板，其使用大容量半导体芯片，半导体封装和卡的封装以及使用半导体封装的系统提供高可靠性。 半导体封装包括具有第一表面和第二表面的衬底，安装在衬底的第一表面上的半导体芯片，设置在衬底的第二表面上的至少一个焊盘，并且其周边包括多个第一组弧 覆盖基板的第二表面并包括暴露至少一个焊盘的至少一个开口的掩模层和设置在至少一个焊盘上的至少一个外部端子，其中所述至少一个焊盘的一部分被覆盖 并且所述至少一个平台的另一部分的侧壁被所述至少一个开口暴露，并且所述至少一个开口的圆周包括多个第二组弧，并且所述最外弧的半径 多个第一组弧之间的距离等于多个第二组弧之中的最外弧的半径。

公开(公告)号：US20110193228A1

公开(公告)日：2011-08-11

申请号：US12916677

申请日：2010-11-01

申请人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

发明人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

IPC分类号： H01L23/50

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/1225 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316

摘要： A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

摘要翻译： 模制底部填充倒装芯片封装可以包括印刷电路板，安装在印刷电路板上的半导体芯片和密封剂。 印刷电路板具有穿过印刷电路板的至少一个树脂通孔和印刷电路板的底表面上的至少一个树脂通道，所述至少一个树脂通道从至少一个树脂通道孔延伸通过 印刷电路板。 密封剂密封印刷电路板，半导体芯片，至少一个树脂通孔和至少一个树脂通道的顶表面。

公开(公告)号：US08592997B2

公开(公告)日：2013-11-26

申请号：US12916677

申请日：2010-11-01

申请人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

发明人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

IPC分类号： H01L23/28

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/1225 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316

摘要： A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

摘要翻译： 模制底部填充倒装芯片封装可以包括印刷电路板，安装在印刷电路板上的半导体芯片和密封剂。 印刷电路板具有穿过印刷电路板的至少一个树脂通孔和印刷电路板的底表面上的至少一个树脂通道，所述至少一个树脂通道从至少一个树脂通道孔延伸通过 印刷电路板。 密封剂密封印刷电路板，半导体芯片，至少一个树脂通孔和至少一个树脂通道的顶表面。