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42 条记录 (耗时 0.03 秒)

    Spring adapted to hold electronic device in a frame
    3.
    发明申请
    Spring adapted to hold electronic device in a frame 有权
    弹簧适用于将电子设备固定在一个框架中

    公开(公告)号：US20060139886A1

    公开(公告)日：2006-06-29

    申请号：US11027337

    申请日：2004-12-29

    申请人： Stephan Barsun

    发明人： Stephan Barsun

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.

    摘要翻译： 组件包括适于安装厚度在厚度范围内的电子设备的框架。 该框架适于在安装电子装置之后组装到散热器组件。 组件还包括适于将电子设备固定到框架的至少一个弹簧。

    Heatsink with multiple fin types
    5.
    发明授权
    Heatsink with multiple fin types 有权
    散热片有多种散热片类型

    公开(公告)号：US06659168B1

    公开(公告)日：2003-12-09

    申请号：US10192124

    申请日：2002-07-09

    申请人： Stephan Barsun

    发明人： Stephan Barsun

    IPC分类号： H05K720

    CPC分类号： H01L23/3672 ,  H01L23/3675 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of the base. The first and second regions of the base may be integral with or attached to one another. Such a heat sink can dissipate heat from multiple electronic components with the respective fin type that is most cost effective for each respective component. Using such a heat sink often reduces manufacturing time and costs as compared to using a separate heat sink for each component. In addition, such a heat sink can dissipate heat from multiple regions of a single electronic component with the respective fin type that is most cost effective for each region.

    摘要翻译： 散热器包括具有第一和第二区域的基座，设置在基座的第一区域上的第一类型的第一翅片和设置在基座的第二区域上的第二类型的第二翅片。 基座的第一和第二区域可以彼此成一体或彼此附接。 这样的散热器可以从具有对于每个相应部件最具成本效益的相应散热片类型的多个电子部件散热。 与每个部件使用单独的散热器相比，使用这种散热器通常减少制造时间和成本。 此外，这样的散热器可以从单个电子部件的多个区域散发具有对于每个区域最具成本效益的相应散热片类型的热量。

    Self-locking fastener adapted to secure a heat sink to a frame
    6.
    发明申请
    Self-locking fastener adapted to secure a heat sink to a frame 失效
    适于将散热器固定在框架上的自锁紧固件

    公开(公告)号：US20060139885A1

    公开(公告)日：2006-06-29

    申请号：US11026367

    申请日：2004-12-29

    申请人： Stephan Barsun

    发明人： Stephan Barsun

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/309 ,  Y10T24/42 ,  H01L2924/00

    摘要： An assembly comprises a frame configured to mount an electronic device and assemble to a heat sink. The assembly further comprises at least one self-locking fastener adapted to lock into place and secure the heat sink to the frame on aligned compression of the heat sink toward the framed.

    摘要翻译： 组件包括构造成安装电子设备并组装到散热器的框架。 该组件还包括至少一个自锁紧固件，其适于锁定到位，并且将散热器朝向框架的对准压缩固定到框架上。

    Securable electronic module
    7.
    发明申请
    Securable electronic module 失效
    安全电子模块

    公开(公告)号：US20060037776A1

    公开(公告)日：2006-02-23

    申请号：US10919998

    申请日：2004-08-17

    申请人： Brandon Rubenstein ,  Stephan Barsun

    发明人： Brandon Rubenstein ,  Stephan Barsun

    IPC分类号： H05K1/18

    CPC分类号： H05K7/1428 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10598

    摘要： Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, the opening can be configured to maintain a threaded device and to allow the threaded device to move within the opening. The threaded device can be configured to engage a securing device for adjustably securing the at least one extended portion to the circuit board

    摘要翻译： 描述了将电子模块定位和固定到电路板相关联的示例系统和方法。 在一个实施例中，电子模块包括被配置为连接到电路板的至少一个可连接部分和具有穿过其中的开口的至少一个延伸部分。 在一个示例中，开口可以被配置为维持螺纹装置并允许螺纹装置在开口内移动。 螺纹装置可以被配置成接合固定装置，用于将至少一个延伸部分可调节地固定到电路板

    Offset compensation system
    9.
    发明申请
    Offset compensation system 失效
    偏移补偿系统

    公开(公告)号：US20050186831A1

    公开(公告)日：2005-08-25

    申请号：US10782700

    申请日：2004-02-19

    申请人： Stephan Barsun ,  Bryan Bolich ,  Alisa Sandoval ,  Gregg Meyer ,  Richard Miner

    发明人： Stephan Barsun ,  Bryan Bolich ,  Alisa Sandoval ,  Gregg Meyer ,  Richard Miner

    IPC分类号： G06F1/18 ,  G06F1/20 ,  H01R12/00

    CPC分类号： G06F1/20 ,  G06F1/183

    摘要： A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector portion electrically coupled to the electronic device and connected to the first connector portion along an axis. The plurality of resilient support members are asymmetrically located about the axis and extend between the device and the circuit board.

    摘要翻译： 计算系统包括电路板，电连接到电路板的第一连接器部分，电子部件和多个弹性支撑部件。 电子部件包括第一电子设备，电连接到电子设备并沿轴线连接到第一连接器部分的第二连接器部分。 多个弹性支撑构件围绕轴线不对称地定位并且在装置和电路板之间延伸。