利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

39 条记录 (耗时 0.02 秒)

    Torque Arm Assembly and Method
    1.
    发明申请
    Torque Arm Assembly and Method 有权
    扭矩臂装配和方法

    公开(公告)号：US20110155120A1

    公开(公告)日：2011-06-30

    申请号：US13044047

    申请日：2011-03-09

    申请人： Stephan K. Barsun ,  Brian Wares ,  Charles Almy ,  Reuben Sandler ,  Nathaniel Schiesher ,  Jason Maxey

    发明人： Stephan K. Barsun ,  Brian Wares ,  Charles Almy ,  Reuben Sandler ,  Nathaniel Schiesher ,  Jason Maxey

    IPC分类号： F24J2/54

    CPC分类号： H02S20/10 ,  F24S30/425 ,  F24S2030/136 ,  H02S20/30 ,  Y02E10/47 ,  Y10T29/49968

    摘要： A torque arm assembly, used with a solar collector mounted to a drive shaft, comprises a torque arm with first and second ends and a torque arm coupling assembly including a drive shaft enclosure defining an open-ended channel sized to house the drive shaft. The channel has a circumferentially extending substantially continuous drive surface between the ends that lies adjacent to the drive shaft so the drive shaft and the drive shaft enclosure rotate together. In some examples, contiguous abutment structure, such as weld lines, shims and/or adhesive, connects each side of the drive shaft to the drive shaft enclosure. The invention may also be carried out as a connection improvement method.

    摘要翻译： 与安装到驱动轴上的太阳能集热器一起使用的扭矩臂组件包括具有第一和第二端的扭矩臂和扭矩臂联接组件，该扭矩臂联接组件包括限定为容纳驱动轴的敞开通道的驱动轴外壳。 通道在位于驱动轴附近的端部之间具有周向延伸的基本连续的驱动表面，因此驱动轴和驱动轴外壳一起旋转。 在一些示例中，连续的邻接结构（例如焊接线，垫片和/或粘合剂）将驱动轴的每一侧连接到驱动轴外壳。 本发明也可以作为连接改进方法进行。

    Vertical counterflow evaporative cooler
    2.
    发明申请
    Vertical counterflow evaporative cooler 审中-公开
    垂直逆流蒸发冷却器

    公开(公告)号：US20090126913A1

    公开(公告)日：2009-05-21

    申请号：US11984386

    申请日：2007-11-16

    申请人： Brian E. Lee ,  Richard C. Bourne ,  Stephan K. Barsun

    发明人： Brian E. Lee ,  Richard C. Bourne ,  Stephan K. Barsun

    IPC分类号： F28B1/02 ,  B21D53/02 ,  F28B1/06

    CPC分类号： F28D5/02 ,  F28D9/0025 ,  F28D9/0031 ,  F28F21/065 ,  F28F2230/00 ,  Y10T29/4935

    摘要： An evaporative plate-type heat exchanger is provided having a plurality of alternating first plates and second plates positioned in side-by side relationship to form a top surface, a bottom surface, a front surface and a rear surface. The first and second plates form a plurality of dry air flow passages, between first faces of the first plates and first faces of adjacent second plates, that are in communication with dry air flow inlet openings and dry air flow outlet openings formed in the front surface. The first and second plates form a plurality of dry air flow passages, between second faces of the first plates and second faces of adjacent second plates, that are in communication with wet air flow inlet openings formed in the bottom surface and with wet air flow outlet openings formed in the rear surface. A method of forming the plate-type heat exchanger includes forming alternating first plates and second plates in a continuous sheet, and folding the continuous sheet in a fan fold arrangement.

    摘要翻译： 提供了一种蒸发板式热交换器，其具有并排关系定位的多个交替的第一板和第二板，以形成顶表面，底表面，前表面和后表面。 第一和第二板形成多个干空气流动通道，在第一板的第一面和相邻的第二板的第一面之间，与干燥空气流入口和干燥空气流出口相连通， 。 第一和第二板在第一板的第二面和相邻的第二板的第二面之间形成多个干燥空气流动通道，其与形成在底部表面中的湿气流入口和湿气流出口 开口形成在后表面。 形成板式热交换器的方法包括在连续片材中形成交替的第一板和第二板，并以扇形折叠方式折叠连续片材。

    Computer system
    5.
    发明授权
    Computer system 有权
    电脑系统

    公开(公告)号：US07236358B2

    公开(公告)日：2007-06-26

    申请号：US10459075

    申请日：2003-06-11

    申请人： Robert W. Dobbs ,  Stephan K. Barsun ,  Kevin M. Somervill

    发明人： Robert W. Dobbs ,  Stephan K. Barsun ,  Kevin M. Somervill

    IPC分类号： G06F1/16

    CPC分类号： G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  G06F1/20 ,  H05K7/1425 ,  H05K7/20736

    摘要： A computer system includes a chassis, a backplane coupled to the chassis and a card including a printed circuit board and an external connection bulkhead. The backplane extends in a vertical plane. The card has a major length and a minor width. The card is releasably connected to the backplane along the major length.

    摘要翻译： 计算机系统包括底盘，耦合到底盘的背板和包括印刷电路板和外部连接隔板的卡。 背板在垂直平面上延伸。 该卡具有主要长度和较小的宽度。 该卡沿主要长度可释放地连接到背板。

    Method and apparatus for regulating the operating temperature of electronic devices
    6.
    发明授权
    Method and apparatus for regulating the operating temperature of electronic devices 失效
    用于调节电子设备工作温度的方法和装置

    公开(公告)号：US06957544B2

    公开(公告)日：2005-10-25

    申请号：US10622917

    申请日：2003-07-18

    申请人： Robert W. Dobbs ,  Stephan K. Barsun ,  Andrew H. Barr

    发明人： Robert W. Dobbs ,  Stephan K. Barsun ,  Andrew H. Barr

    IPC分类号： F24F11/76 ,  H05K7/20 ,  F25D17/00

    CPC分类号： H05K7/20836 ,  F24F11/30 ,  F24F11/56 ,  F24F11/76 ,  F24F2110/10 ,  F24F2221/40 ,  H05K7/20745

    摘要： In one embodiment, the present invention recites a temperature control subsystem for use with an air conditioning system. The temperature control subsystem comprises a temperature sensor located in proximity to a heat-generating device disposed within a housing, where the temperature sensor generates data corresponding to the temperature of the heat-generating device. The temperature control subsystem further comprises an air-flow control feature coupled to the housing, whereby the air-flow control feature is configured to regulate the delivery of cooling air to the housing. Cooling air is provided by the air conditioning system. A local control subsystem is coupled to the air-flow control feature to control the air flow of cooling air to the housing so that the air flow is adjustable to correspond to the temperature data received from the temperature sensor.

    摘要翻译： 在一个实施例中，本发明背诵用于空调系统的温度控制子系统。 温度控制子系统包括温度传感器，位于设置在壳体内的发热装置附近，其中温度传感器产生对应于发热装置的温度的数据。 温度控制子系统还包括耦合到壳体的气流控制特征，由此气流控制特征被配置成调节冷却空气向外壳的输送。 冷气由空调系统提供。 本地控制子系统耦合到气流控制特征以控制到壳体的冷却空气的空气流，使得气流可调节以对应于从温度传感器接收的温度数据。

    Electronic system with a movable printed circuit assembly
    7.
    发明授权
    Electronic system with a movable printed circuit assembly 失效
    具有可移动印刷电路组件的电子系统

    公开(公告)号：US06956746B2

    公开(公告)日：2005-10-18

    申请号：US10600973

    申请日：2003-06-20

    申请人： Stephan K. Barsun ,  Robert W. Dobbs

    发明人： Stephan K. Barsun ,  Robert W. Dobbs

    IPC分类号： H01R12/16 ,  H01R12/22 ,  H01R13/629 ,  H05K5/00 ,  H05K5/04 ,  H05K5/06 ,  H05K7/14

    CPC分类号： H05K7/1415 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/629

    摘要： An electronic system includes a chassis, a first system component coupled to the chassis and having a first connector, a pivot member pivotally coupled to the chassis, a second system component having a second connector configured to mate with the first connector, and a link coupled to the second system component and slidably coupled to the pivoting member. Pivotal movement of the pivoting member moves the first connector and the second connector between a connected state and a disconnected state.

    摘要翻译： 一种电子系统，包括一个底盘，一个连接到该底盘的第一系统组件，并具有一个第一连接器，一个可枢转地连接到底架上的枢转构件，一个第二系统组件，具有一个配置成与第一个连接器配合的第二个连接器， 到第二系统部件并且可滑动地联接到枢转构件。 枢转构件的枢转运动使第一连接器和第二连接器在连接状态和断开状态之间移动。

    Circuit board support assembly
    8.
    发明授权
    Circuit board support assembly 失效
    电路板支撑组件

    公开(公告)号：US06757179B2

    公开(公告)日：2004-06-29

    申请号：US10230807

    申请日：2002-08-29

    申请人： Stephan K. Barsun ,  Steven R. Hahn ,  Thomas J. Augustin

    发明人： Stephan K. Barsun ,  Steven R. Hahn ,  Thomas J. Augustin

    IPC分类号： G06F116

    CPC分类号： G06F1/184 ,  H05K7/142 ,  H05K7/1421

    摘要： A circuit board support assembly includes a frame, a circuit board, an electronic component and at least one attachment structure. The at least one attachment structure is non-rotatably attached to the frame. The at least one attachment structure supports the electronic component relative to the circuit board.

    摘要翻译： 电路板支撑组件包括框架，电路板，电子部件和至少一个附接结构。 所述至少一个附接结构不可旋转地附接到所述框架。 所述至少一个附接结构相对于所述电路板支撑所述电子部件。