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公开(公告)号：USD337572S
公开(公告)日：1993-07-20
申请号：US908029
申请日：1992-07-02
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公开(公告)号：USD336285S
公开(公告)日：1993-06-08
申请号：US631379
申请日：1990-12-20
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公开(公告)号：USD315147S
公开(公告)日：1991-03-05
申请号：US307581
申请日：1989-02-06
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公开(公告)号：US5131859A
公开(公告)日：1992-07-21
申请号：US666356
申请日：1991-03-08
申请人： Stephen A. Bowen , Melvin C. August , Stephen Cermak, III , David R. Collins , Steven J. Dean , Perry D. Franz , Max C. Logan
发明人： Stephen A. Bowen , Melvin C. August , Stephen Cermak, III , David R. Collins , Steven J. Dean , Perry D. Franz , Max C. Logan
CPC分类号： H01R12/82 , H01R13/005
摘要： A circuit board module for a supercomputer includes quick connections for power, ground, coolant quick connects, and circuit quick connects. The quick connections provide for insertion of modules with substantial savings in time and effort. The electrical power and ground connections and the liquid coolant connections engage and disengage automatically upon insertion and removal of the modules. The circuit quick connects require only insertion of a camming tool for connection and disconnection. The modules require no bolting or unbolting of clamps or hoses for the various connections.
摘要翻译： 用于超级计算机的电路板模块包括电源，接地，冷却剂快速连接和电路快速连接的快速连接。 快速连接可以大大节省时间和精力来插入模块。 在插入和拆卸模块时，电源和接地连接以及液体冷却液连接自动接合和脱离。 电路快速连接仅需要插入凸轮工具进行连接和断开连接。 模块不需要用于各种连接的夹具或软管的螺栓连接或拆卸。
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公开(公告)号：USD314949S
公开(公告)日：1991-02-26
申请号：US427328
申请日：1989-10-25
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公开(公告)号：US06487082B1
公开(公告)日：2002-11-26
申请号：US09620059
申请日：2000-07-20
申请人： Thomas Alex Crapisi , Jeffrey S. Conger , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
发明人： Thomas Alex Crapisi , Jeffrey S. Conger , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
IPC分类号： H05K710
CPC分类号： H05K1/181 , H05K1/023 , H05K1/18 , H05K2201/09418 , H05K2201/10022 , H05K2201/10545 , H05K2201/10689 , H05K2201/10734 , Y02P70/611
摘要： A printed circuit board apparatus, configurations and methods are presented which provide for close spacing between the HUB and multiple processors as well as a common configuration for two or four processor boards. A printed circuit board is provided with conductive apertures and portions corresponding to an efficient Packaging allowing for the attachment of the processor-chip on one side of the printed circuit board, and the HUB and other supporting electronic components on the other side of the printed circuit board. This configuration allows for the close spacing of the electrical conductors of the HUB and the processors without the limitations imposed by the physical dimensions of the respective hardware. Additionally, a symmetric packaging of the conductive apertures and portions about a centerline of the printed circuit board allows for a simple design modification to allow for a two two-processor board to be manufactured from a similarly configured four-processor board.
摘要翻译： 提出了一种印刷电路板装置，配置和方法，其提供了HUB和多个处理器之间的紧密间隔以及用于两个或四个处理器板的通用配置。 印刷电路板设置有导电孔和对应于有效包装的部分，其允许在印刷电路板的一侧上附接处理器芯片，并且在印刷电路的另一侧上的HUB和其他支撑电子部件 板。 该配置允许HUB和处理器的电导体的紧密间隔，而不受相应硬件的物理尺寸施加的限制。 此外，导电孔和印刷电路板的中心线周围的部分的对称封装允许简单的设计修改，以允许由类似配置的四处理器板制造两个两处理器板。
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公开(公告)号：US06771517B2
公开(公告)日：2004-08-03
申请号：US10202377
申请日：2002-07-26
申请人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
发明人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
IPC分类号： H02B101
CPC分类号： H05K7/1461 , H05K1/0271
摘要： Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure. The stiffener supports the printed circuit board to resist bending and flexing stresses. In yet another embodiment, a combination of one or more stiffeners and one or more frames are provided such that the printed circuit board resists bending and flexing stresses.
摘要翻译： 提出了减少电路板弯曲的装置和方法。 该装置被固定到印刷电路板上以提供用于减少弯曲和弯曲的刚性支撑。 在一个实施例中，提供了刚性框架，其适于紧固到一个或多个部件并且被紧固到印刷电路板。 该框架适于从PCB表面升高附接的部件，从而允许组件与PCB一起安装在PCB上。 该框架适于占据印刷电路板表面积的最小值，以便不会使电子部件移位。 在另一个实施例中，提供了一种细长的桁架状加强件，其适于紧固在印刷电路板的一侧并适于跨越印刷电路板。 细长的加强件适于具有开放结构，以使冷却流动扰动和重量最小化。 细长加强件包括形成桁架状结构的多个支脚。 加强件支撑印刷电路板以抵抗弯曲和弯曲应力。 在另一个实施例中，提供一个或多个加强件和一个或多个框架的组合，使得印刷电路板抵抗弯曲和弯曲应力。
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公开(公告)号：US06512676B1
公开(公告)日：2003-01-28
申请号：US09619725
申请日：2000-07-20
申请人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
发明人： Thomas Alex Crapisi , Jeffrey Scott Cogner , Stephen Cermak, III , Stephen A. Bowen , Rodney Ruesch , David Paul Gruber , Bonnie Kay Dobbs
IPC分类号： H05K500
CPC分类号： H05K7/1461 , H05K1/0271
摘要： Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure. The stiffener supports the printed circuit board to resist bending and flexing stresses. In yet another embodiment, a combination of one or more stiffeners and one or more frames are provided such that the printed circuit board resists bending and flexing stresses.
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公开(公告)号：US06726505B2
公开(公告)日：2004-04-27
申请号：US10231511
申请日：2002-08-29
申请人： Stephen Cermak, III , Jeffrey S. Conger , David Paul Gruber , Thomas Alex Crapisi , Stephen A. Bowen , Steven Shafer , Mark Ronald Sikkink
发明人： Stephen Cermak, III , Jeffrey S. Conger , David Paul Gruber , Thomas Alex Crapisi , Stephen A. Bowen , Steven Shafer , Mark Ronald Sikkink
IPC分类号： H01R1360
CPC分类号： G06F1/184
摘要： New methods and configurations are provided that allow for a large memory capacity, as well as minimized interconnect distances between the memory chips and one or more processors, and the HUB chip-set. The apparatus, configurations and methods include providing a printed circuit board having one or more processor conductive portions and one or more z-axis connector conductive portions in close proximity with each other, and connecting the one or more processors on one side of a printed circuit board, and connecting the one or more z-axis connectors for the memory daughter cards on the opposite side of the processor board. Standoffs are used to support and secure the horizontally disposed z-axis memory daughter cards and to ensure proper spacing between the z-axis daughter cards and the processor board Standoffs include an alignment pin portion and a spacer portion. The alignment pin portion includes an alignment portion, foot, and urging portion. The spacer portion includes pin coupler, relief portion, and aperture. The standoff is inserted into an aperture of a first printed circuit board and turned 90 degrees to secure the spacer portion and the foot to the first printed circuit board. An aperture in a second printed circuit board is slid over the alignment pin portion, wherein the second printed circuit board rests on the spacer portion. The fastening means is used through an aperture in the second printed circuit board communicating with the spacer portion.
摘要翻译： 提供了新的方法和配置，其允许大的存储器容量以及存储器芯片与一个或多个处理器之间的最小化互连距离以及HUB芯片组。 该装置，结构和方法包括提供具有一个或多个处理器导电部分和一个或多个彼此紧密接近的z轴连接器导电部分的印刷电路板，以及连接印刷电路一侧上的一个或多个处理器 并将处理器板相对侧的存储器子卡的一个或多个z轴连接器连接起来。 支座用于支撑和固定水平放置的z轴存储器子卡，并确保z轴子卡与处理器板之间的适当间隔。支座包括对准销部分和间隔部分。 对准销部分包括对准部分，脚部和推动部分。 间隔部分包括销联接器，浮雕部分和孔。 将间隔插入第一印刷电路板的孔中并转动90度以将间隔件部分和脚固定到第一印刷电路板。 第二印刷电路板中的孔径在对准销部分上滑动，其中第二印刷电路板搁置在间隔部分上。 紧固装置通过与间隔件部分连通的第二印刷电路板中的孔而使用。
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公开(公告)号：US5963428A
公开(公告)日：1999-10-05
申请号：US136908
申请日：1998-08-20
CPC分类号： H01L23/4006 , H01L23/04 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002
摘要： The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap. Risers, which may be either integral to the cooling cap or separate elements, are used to lift the cooling cap above the surface of the circuit board so as to provide space for the component.
摘要翻译： 本发明公开了一种用于桥接安装在电路板上的集成电路封装或部件与散热器之间的间隙的方法和装置，使得部件上施加的应力很小，但是部件和 散热用于散热。 本发明为精密部件包装提供机械完整性，并且在这样做时允许使用各种散热器来提供冷却。 印刷电路板具有安装到电路板的集成电路封装或其它部件。 由导热材料构成的冷却盖安装在电路板上，使得部件被电路板和冷却盖包围。 可以在部件和冷却帽之间沉积导热材料层，以提供从部件到冷却帽的导热路径。 可以将冷却帽或分离元件整体的升降器用于将冷却帽提升到电路板的表面之上，以便为部件提供空间。
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