摘要:
A circuit board module for a supercomputer includes quick connections for power, ground, coolant quick connects, and circuit quick connects. The quick connections provide for insertion of modules with substantial savings in time and effort. The electrical power and ground connections and the liquid coolant connections engage and disengage automatically upon insertion and removal of the modules. The circuit quick connects require only insertion of a camming tool for connection and disconnection. The modules require no bolting or unbolting of clamps or hoses for the various connections.
摘要:
An electrical end connector (10) of the zero insertion force type includes a pair of opposing blocks (21, 40), one of which blocks is slideably mounted in a housing (22). Opposite corresponding pairs of female receptacles (34) and male pins (31) are cooperatively mounted on the opposing blocks (21, 40). The housig (22) has two sets of oppositely disposed windows formed through the longitudinal ends. One block (40) has a channel formed therethrough, such that the block (40) is urged transversely upon insertion of a cam-like slider device (70), thereby selectively engaging or disengaging the male pins (31) and female receptacles (43).
摘要:
An improved multiple circuit module for use in an electronic device includes a number of cold plates sandwiched between pairs of circuit boards for taking away excess heat from the circuit boards. Each plate is provided with open spaces which permit communication between the circuit boards, and with circuit boards on other cold plates. Electrical communication between the circuit boards is effected by an array of metallic pins. The pins are received in a perforate pin header which extends along the depth of the cold plate, and pins communicating with other circuit boards extend into a connector block which is placed between a pair of pin headers. Shielding is provided in both the connector blocks and pin headers to prevent electronic cross-talk between pins disposed therein. In one embodiment, a novel type of pin which reduces installation and disconnection friction is utilized.
摘要:
A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.
摘要:
A cooling plate for heat dissipation is particularly adapted for use within printed circuit board stacks. The cooling plate includes a fluid inlet manifold, fluid pass containing a plurality of heat dissipation fins, and a fluid outlet manifold. Externally, the cooling plate has a pattern of heat conductive pads that is substantially identical to the pattern of devices on a printed circuit board attached to the cooling plate. The cooling plate includes apertures and mounting elements for z-axis connector assemblies so that printed circuit boards attached to either side of the cooling plate may electrically interconnect.
摘要:
An electrical edge connector (14) of the zero insertion force type includes a pair of opposing blocks (30, 32) defining a longitudinal guideway (34) therebetween. Opposite corresonding pairs of female contacts (52, 54) are disposed in transverse holes in the blocks (30, 32), and male contacts (60) are slidably supported in the female contacts in one block for selective actuation into or out of sliding engagement with the female contacts in the other block responsive to insertion of a slider (36).
摘要:
A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.