High precision semiconductor component alignment systems
    1.
    发明授权
    High precision semiconductor component alignment systems 失效
    高精度半导体元器件对准系统

    公开(公告)号:US5897611A

    公开(公告)日:1999-04-27

    申请号:US711380

    申请日:1996-09-06

    IPC分类号: G01B11/00 G01B11/27 H05K13/04

    CPC分类号: G01B11/00 G01B11/272

    摘要: High speed high precision alignment sensor systems for use on surface mount component placement machines. Light systems are used to correctly align and position component parts. The sensor system consists of a light source and an optical lens system causing more of the light from a light source to pass the component in order to obtain a sharper component image on a sensor array. Due to the optical lens systems disclosed, either low powered lasers, light emitting diodes, or other suitable light sources can be used in the system since optical efficiency is substantially increased over prior systems since more of the radiated light is collected from the light source for measurement at the detector. The sensor system is mounted directly on the carrying mechanism for the surface mount component placement machine. During transit of the component between the bin of components and the circuit board upon which the component is to be placed, the component is rotated and the sharp shadow which falls on the detector array is monitored. Several processing algorithms are disclosed for determining correct component angular orientation and coordinate (X,Y) location of the component on the quill. Thereafter, the sensor sends correcting signals to the component placement machine.

    摘要翻译: 用于表面贴装元件贴装机的高速高精度对位传感器系统。 光系统用于正确对准和定位组件。 传感器系统由光源和光学透镜系统组成,其中更多的来自光源的光通过部件以便在传感器阵列上获得更清晰的分量图像。 由于所公开的光学透镜系统,可以在系统中使用低功率激光器,发光二极管或其他合适的光源,因为与现有系统相比,光学效率显着增加,因为从光源收集更多的辐射光, 检测器测量。 传感器系统直接安装在表面安装元件贴装机的搬运机构上。 在组件箱和要放置组件的电路板之间的部件运输期间,部件被旋转并且监测落在检测器阵列上的尖锐阴影。 公开了几种用于确定组件在套筒上的正确的组件角取向和坐标(X,Y)位置的处理算法。 此后,传感器向组件贴装机发送校正信号。

    Method and apparatus for electronic component lead measurement using
light based sensors on a component placement machine
    2.
    发明授权
    Method and apparatus for electronic component lead measurement using light based sensors on a component placement machine 失效
    使用元件贴装机上的基于光的传感器进行电子元件引线测量的方法和装置

    公开(公告)号:US6118538A

    公开(公告)日:2000-09-12

    申请号:US938244

    申请日:1997-09-26

    IPC分类号: H05K13/04 G01B11/24

    CPC分类号: H05K13/0413

    摘要: The present invention is a light based detection system for providing a low cost, very fast and very accurate measurements of lead positions and heights for integrated circuit board components. The alignment detections systems of the present invention are preferably located on a component placement head. The detector is a linear or rectangular array of pixels. The light path between the light source and the detector array is directed by the optical components across one or more leads in a plane that is neither parallel to nor perpendicular to the seating plane of the component. The light path is directed across the relevant leads without substantial interference from the body of the component or the other leads not being measured. A digital processor analyzes the measurements of the light sensitive detector to determine positions and/or coplanarity of the leads.

    摘要翻译: 本发明是一种基于光的检测系统,用于为集成电路板部件提供低成本,非常快速且非常精确的引线位置和高度的测量。 本发明的对准检测系统优选地位于组件放置头上。 检测器是像素的线性或矩形阵列。 光源和检测器阵列之间的光路由光学部件穿过一个或多个引线,平面不与零件的座面平行或垂直。 光路被引导穿过相关引线,而没有来自元件的主体或未被测量的其它引线的实质干扰。 数字处理器分析光敏检测器的测量以确定引线的位置和/或共面性。

    HIGH SPEED DISTRIBUTED OPTICAL SENSOR INSPECTION SYSTEM
    3.
    发明申请
    HIGH SPEED DISTRIBUTED OPTICAL SENSOR INSPECTION SYSTEM 有权
    高速分布式光传感器检测系统

    公开(公告)号:US20110102575A1

    公开(公告)日:2011-05-05

    申请号:US12940214

    申请日:2010-11-05

    IPC分类号: H04N7/18

    摘要: An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion. A computer is operably coupled to the first and second optical inspection sensors and is configured to provide an inspection result based upon at least one of the first and second inspection image data.

    摘要翻译: 电子装配线包括第一电子组装机和第二电子组装机。 第一个电子组装机器具有第一电子组装机出口。 第二电子组装机具有第二电子组装机入口和出口。 第二电子组装机的入口通过输送机联接到第一电子组装机的出口。 在第二电子组件的入口之前,第一光学检测传感器设置在输送机之上,并且被配置为相对于以第一光学检测传感器以不间断方式通过的基板提供第一传感器检查图像数据。 在第二电子组装机器的出口之后,第二光学检测传感器设置在传送器上方并且被配置为相对于在第二光学检测传感器下方以不间断的方式通过的基板提供第二传感器检查图像数据。 计算机可操作地耦合到第一和第二光学检测传感器,并且被配置为基于第一和第二检查图像数据中的至少一个提供检查结果。

    HIGH SPEED OPTICAL INSPECTION SYSTEM WITH ADAPTIVE FOCUSING
    4.
    发明申请
    HIGH SPEED OPTICAL INSPECTION SYSTEM WITH ADAPTIVE FOCUSING 有权
    具有自适应聚焦的高速光学检测系统

    公开(公告)号:US20110090333A1

    公开(公告)日:2011-04-21

    申请号:US12939267

    申请日:2010-11-04

    IPC分类号: H04N7/18

    摘要: An optical inspection system for inspecting a substrate is provided. The system includes an array of cameras configured to acquire a plurality of sets of images as the substrate and the array undergo relative motion with respect to each other. At least one focus actuator is operably coupled to each camera of the array of cameras to cause displacement of at least a portion of each camera that affects focus. A substrate range calculator is configured to receive at least portions of images from the array and to calculate range between the array of cameras and the substrate. A controller is coupled to the array of cameras and to the range calculator. The controller is configured to provide a control signal to each of the at least one focus actuator to adaptively focus each camera of the array during the relative motion.

    摘要翻译: 提供了一种用于检查基板的光学检查系统。 该系统包括被配置为获取多组图像作为基板并且阵列相对于彼此经历相对运动的相机阵列。 至少一个聚焦致动器可操作地耦合到相机阵列的每个相机,以引起影响焦点的每个相机的至少一部分的位移。 衬底范围计算器被配置为从阵列接收至少部分图像并计算相机阵列和衬底之间的范围。 控制器耦合到相机阵列和距离计算器。 控制器被配置为向至少一个聚焦致动器中的每一个提供控制信号,以在相对运动期间自适应地对准阵列的每个相机。

    Dark field illuminator with large working area
    5.
    发明授权
    Dark field illuminator with large working area 有权
    暗场照明器,工作面积大

    公开(公告)号:US08894259B2

    公开(公告)日:2014-11-25

    申请号:US12564131

    申请日:2009-09-22

    IPC分类号: F21V8/00

    CPC分类号: G02B6/0096

    摘要: An illuminator is described which may be used with large inspection areas and which provides a dark field illumination pattern that is spatially uniform, illuminates from consistent angles, has high efficiency, and is smaller than existing solutions. A light pipe has a first end proximate an object to be illuminated and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end of the light pipe includes an exit aperture and the second end has at least one opening to allow at least one image acquisition device to view the surface therethrough. At least one light source is configured to provide illumination in the light pipe. The object is illuminated by the first end of the light pipe by illumination at a selected elevation angle and substantially all azimuth angles.

    摘要翻译: 描述了可以与大检查区域一起使用并且提供空间均匀的暗场照明图案的照明器,从一致的角度照射,具有高效率并且小于现有解决方案。 光管具有靠近被照射物体的第一端和与第一端相对并与第一端间隔开的第二端。 光管还具有至少一个反射侧壁。 光管的第一端包括出口孔,并且第二端具有至少一个开口,以允许至少一个图像采集装置通过其观察表面。 至少一个光源被配置为在光管中提供照明。 物体由光管的第一端通过以选定的仰角和基本上所有方位角的照明照亮。

    DARK FIELD ILLUMINATOR WITH LARGE WORKING AREA
    7.
    发明申请
    DARK FIELD ILLUMINATOR WITH LARGE WORKING AREA 有权
    具有大型工作区域的暗场照明器

    公开(公告)号:US20110069507A1

    公开(公告)日:2011-03-24

    申请号:US12564131

    申请日:2009-09-22

    IPC分类号: G02B6/00

    CPC分类号: G02B6/0096

    摘要: An illuminator is described which may be used with large inspection areas and which provides a dark field illumination pattern that is spatially uniform, illuminates from consistent angles, has high efficiency, and is smaller than existing solutions. A light pipe has a first end proximate an object to be illuminated and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end of the light pipe includes an exit aperture and the second end has at least one opening to allow at least one image acquisition device to view the surface therethrough. At least one light source is configured to provide illumination in the light pipe. The object is illuminated by the first end of the light pipe by illumination at a selected elevation angle and substantially all azimuth angles.

    摘要翻译: 描述了可以与大检查区域一起使用并且提供空间均匀的暗场照明图案的照明器,从一致的角度照射,具有高效率并且小于现有解决方案。 光管具有靠近被照射物体的第一端和与第一端相对并与第一端间隔开的第二端。 光管还具有至少一个反射侧壁。 光管的第一端包括出口孔,并且第二端具有至少一个开口,以允许至少一个图像采集装置通过其观察表面。 至少一个光源被配置为在光管中提供照明。 物体由光管的第一端通过以选定的仰角和基本上所有方位角的照明照亮。

    HIGH SPEED, HIGH RESOLUTION, THREE DIMENSIONAL SOLAR CELL INSPECTION SYSTEM
    8.
    发明申请
    HIGH SPEED, HIGH RESOLUTION, THREE DIMENSIONAL SOLAR CELL INSPECTION SYSTEM 有权
    高速,高分辨率,三维太阳能电池检测系统

    公开(公告)号:US20110069154A1

    公开(公告)日:2011-03-24

    申请号:US12886784

    申请日:2010-09-21

    IPC分类号: H04N7/18 H04N13/02

    摘要: An optical inspection system and method are provided. A workpiece transport moves a workpiece in a nonstop manner. An illuminator includes a light pipe and is configured to provide a first and second strobed illumination field types. First and second arrays of cameras are arranged to provide stereoscopic imaging of the workpiece. The first array of cameras is configured to generate a first plurality of images of the workpiece with the first illumination field and a second plurality of images of the feature with the second illumination field. The second array of cameras is configured to generate a third plurality of images of the workpiece with the first illumination field and a fourth plurality of images of the feature with the second illumination field. A processing device stores at least some of the first, second, third, and fourth pluralities of images and provides the images to an other device.

    摘要翻译: 提供光学检查系统和方法。 工件传送以不间断的方式移动工件。 照明器包括光管并且被配置为提供第一和第二选通照明场类型。 照相机的第一和第二阵列被布置成提供工件的立体成像。 第一阵列相机被配置为利用第一照明场和具有第二照明场的特征的第二多个图像来生成工件的第一多个图像。 第二阵列相机被配置为利用第一照明场和具有第二照明场的特征的第四多个图像来生成工件的第三多个图像。 处理装置存储第一,第二,第三和第四多个图像中的至少一些,并将图像提供给另一个装置。

    HIGH SPEED, HIGH RESOLUTION, THREE DIMENSIONAL PRINTED CIRCUIT BOARD INSPECTION SYSTEM
    9.
    发明申请
    HIGH SPEED, HIGH RESOLUTION, THREE DIMENSIONAL PRINTED CIRCUIT BOARD INSPECTION SYSTEM 审中-公开
    高速,高分辨率,三维印刷电路板检测系统

    公开(公告)号:US20120133920A1

    公开(公告)日:2012-05-31

    申请号:US13309211

    申请日:2011-12-01

    IPC分类号: G01P3/40

    摘要: An optical inspection system includes a printed circuit board (PCB) transport and an illuminator that provides at least a first strobed illumination field. The illuminator includes a light pipe having a first end proximate the PCB, and a second end opposite the first end and spaced from the first end. An array of cameras is configured to digitally image the PCB and to generate a plurality of images of the PCB with the at least first strobed illumination field type. At least one structured light projector is disposed to project structured illumination on the PCB. The at least one array of cameras is configured to digitally image the PCB while the PCB is illuminated with structured light, to provide a plurality of structured light images. A processing device is configured to generate an inspection result as a function of the plurality of images and the plurality of structured light images.

    摘要翻译: 光学检查系统包括印刷电路板(PCB)传输和提供至少第一选通照明场的照明器。 照明器包括具有靠近PCB的第一端的光管和与第一端相对并与第一端间隔开的第二端。 摄像机阵列被配置为对PCB进行数字成像并利用至少第一选通的照明场类型生成PCB的多个图像。 设置至少一个结构化的投光器以将结构化照明投影到PCB上。 所述至少一个相机阵列被配置为在PCB被结构化光照射的同时对PCB进行数字成像,以提供多个结构化的光图像。 处理装置被配置为产生作为多个图像和多个结构光图像的函数的检查结果。

    HIGH SPEED OPTICAL INSPECTION SYSTEM WITH CAMERA ARRAY AND COMPACT, INTEGRATED ILLUMINATOR
    10.
    发明申请
    HIGH SPEED OPTICAL INSPECTION SYSTEM WITH CAMERA ARRAY AND COMPACT, INTEGRATED ILLUMINATOR 有权
    具有相机阵列和紧凑型集成照明器的高速光学检测系统

    公开(公告)号:US20110069878A1

    公开(公告)日:2011-03-24

    申请号:US12886803

    申请日:2010-09-21

    IPC分类号: G06K9/00

    摘要: An optical inspection system is provided for inspecting a workpiece including a feature to be inspected. The system includes a workpiece transport configured to transport the workpiece in a nonstop manner. An illuminator is configured to provide a first strobed illumination field type and a second strobed illumination field type. The illuminator includes a light pipe having a first end proximate the feature, and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end has an exit aperture and the second end has at least one second end aperture to provide a view of the feature therethrough. An array of cameras is configured to digitally image the feature. The array of cameras is configured to generate a first plurality of images of the feature with the first illumination field and a second plurality of images of the feature with the second illumination field. A processing device is operably coupled to the illuminator and the array of cameras, the processing device is configured to store at least some of the first and second plurality of images and provide the first and second pluralities to an other device.

    摘要翻译: 提供了一种用于检查包括待检查特征的工件的光学检查系统。 该系统包括被配置为以不间断方式输送工件的工件传送。 照明器被配置为提供第一选通照明场类型和第二选通照明场类型。 照明器包括具有靠近特征的第一端的光管和与第一端相对并与第一端间隔开的第二端。 光管还具有至少一个反射侧壁。 第一端具有出口孔,并且第二端具有至少一个第二端孔,以提供穿过其中的特征的视图。 摄像机阵列被配置为对特征进行数字成像。 相机阵列被配置为利用第一照明场和具有第二照明场的特征的第二多个图像来生成特征的第一多个图像。 处理装置可操作地耦合到照明器和相机阵列,处理装置被配置为存储第一和第二多个图像中的至少一些,并且将第一和第二多个部件提供给另一个装置。