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公开(公告)号：US20110102575A1
公开(公告)日：2011-05-05
申请号：US12940214
申请日：2010-11-05
申请人： Steven K. Case , Beverly Caruso , Todd D. Liberty , Timothy A. Skunes , Carl E. Haugan , Chuanqi Chen
发明人： Steven K. Case , Beverly Caruso , Todd D. Liberty , Timothy A. Skunes , Carl E. Haugan , Chuanqi Chen
IPC分类号： H04N7/18
CPC分类号： H05K13/08 , G01N21/8806 , G01N21/956 , G06K9/2036
摘要： An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion. A computer is operably coupled to the first and second optical inspection sensors and is configured to provide an inspection result based upon at least one of the first and second inspection image data.
摘要翻译： 电子装配线包括第一电子组装机和第二电子组装机。 第一个电子组装机器具有第一电子组装机出口。 第二电子组装机具有第二电子组装机入口和出口。 第二电子组装机的入口通过输送机联接到第一电子组装机的出口。 在第二电子组件的入口之前，第一光学检测传感器设置在输送机之上，并且被配置为相对于以第一光学检测传感器以不间断方式通过的基板提供第一传感器检查图像数据。 在第二电子组装机器的出口之后，第二光学检测传感器设置在传送器上方并且被配置为相对于在第二光学检测传感器下方以不间断的方式通过的基板提供第二传感器检查图像数据。 计算机可操作地耦合到第一和第二光学检测传感器，并且被配置为基于第一和第二检查图像数据中的至少一个提供检查结果。
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公开(公告)号：US20120327215A1
公开(公告)日：2012-12-27
申请号：US13480079
申请日：2012-05-24
申请人： Steven K. Case , Beverly Caruso , Todd D. Liberty , Timothy A. Skunes , Carl E. Haugan , Chuanqi Chen , Hiroshi Anzai
发明人： Steven K. Case , Beverly Caruso , Todd D. Liberty , Timothy A. Skunes , Carl E. Haugan , Chuanqi Chen , Hiroshi Anzai
CPC分类号： G06K9/2036 , G01N21/8806 , G01N21/8903 , G01N21/956 , G06K2009/2045 , H05K13/0815
摘要： An optical inspection sensor is provided. The sensor includes an array of cameras configured to acquire image data relative to a workpiece that moves relative to the array of cameras in a non-stop fashion. An illumination system is disposed to provide a pulse of illumination when the array of cameras acquires the image data. At least some image data includes data regarding a skip mark or barcode on the workpiece.
摘要翻译： 提供光学检测传感器。 该传感器包括相机相机相对于摄像机阵列以不间断的方式移动的图像数据的摄像机阵列。 照明系统设置成当相机阵列获取图像数据时提供照明脉冲。 至少一些图像数据包括关于工件上的跳过标记或条形码的数据。
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公开(公告)号：US08872912B2
公开(公告)日：2014-10-28
申请号：US12940214
申请日：2010-11-05
CPC分类号： H05K13/08 , G01N21/8806 , G01N21/956 , G06K9/2036
摘要： An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion. A computer is operably coupled to the first and second optical inspection sensors and is configured to provide an inspection result based upon at least one of the first and second inspection image data.
摘要翻译： 电子装配线包括第一电子组装机和第二电子组装机。 第一个电子组装机器具有第一电子组装机出口。 第二电子组装机具有第二电子组装机入口和出口。 第二电子组装机的入口通过输送机联接到第一电子组装机的出口。 在第二电子组件的入口之前，第一光学检测传感器设置在输送机之上，并且被配置为相对于在第一光学检测传感器下方以不间断的方式通过的基板提供第一传感器检查图像数据。 在第二电子组装机器的出口之后，第二光学检测传感器设置在传送器上方并且被配置为相对于在第二光学检测传感器下方以不间断的方式通过的基板提供第二传感器检查图像数据。 计算机可操作地耦合到第一和第二光学检测传感器，并且被配置为基于第一和第二检查图像数据中的至少一个提供检查结果。
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公开(公告)号：US06954681B2
公开(公告)日：2005-10-11
申请号：US10745860
申请日：2003-12-24
CPC分类号： H05K13/0812
摘要： An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface. The coupling facilitates advanced monitoring and control of the image acquisition system. Multiple image acquisition systems can be coupled to the controller over the same interface.
摘要翻译： 电子组装系统包括通过改进的接口耦合到控制器的图像采集系统。 耦合有助于图像采集系统的高级监控和控制。 多个图像采集系统可以通过相同的接口耦合到控制器。
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公开(公告)号：US07239399B2
公开(公告)日：2007-07-03
申请号：US10291074
申请日：2002-11-08
申请人： David W. Duquette , Paul R. Haugen , David Fishbaine , John D. Gaida , David D. Madsen , Theodore Paul Dale , Todd D. Liberty , Brant O. Buchika , Scott D. Roth , Thomas W. Bushman
发明人： David W. Duquette , Paul R. Haugen , David Fishbaine , John D. Gaida , David D. Madsen , Theodore Paul Dale , Todd D. Liberty , Brant O. Buchika , Scott D. Roth , Thomas W. Bushman
IPC分类号： G01B11/14
CPC分类号： H04N13/239 , H04N13/194 , H04N13/207 , H04N13/218 , H04N13/254 , H04N2013/0081 , H05K13/0812 , H05K13/0818 , Y10T29/49778 , Y10T29/53087 , Y10T29/53191
摘要： Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.
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