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    Electronic device with compact camera module
    3.
    发明授权
    Electronic device with compact camera module 有权
    具有紧凑型相机模块的电子设备

    公开(公告)号：US09060111B2

    公开(公告)日：2015-06-16

    申请号：US13605000

    申请日：2012-09-06

    Applicant: Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

    Inventor： Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

    IPC: H04N5/335 ,  H01L31/0232 ,  H01R13/648 ,  H04N5/225

    CPC classification number: H04N5/2254 ,  H04N5/2257

    Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

    Abstract translation: 小型电子设备可以包括具有图像传感器的相机模块。 图像传感器可以由存储和处理电路控制以从接收的光捕获图像数据。 相机模块可以包括具有前表面和后表面的基底。 图像传感器可以安装到基板的后表面。 衬底可以包括在衬底的前表面上的光聚焦结构，其将光通过衬底中的开口聚焦到图像传感器。 柔性电路可以用于在相机模块和其它电子设备部件之间传送信号。 柔性电路可以安装到相机模块基板的前表面，以帮助降低相机模块的总高度。 柔性电路可以安装到基板的延伸部分，或者可以安装成围绕图像传感器的周边。

    Electronic Device with Compact Camera Module
    4.
    发明申请
    Electronic Device with Compact Camera Module 有权
    具有紧凑型相机模块的电子设备

    公开(公告)号：US20140063302A1

    公开(公告)日：2014-03-06

    申请号：US13605000

    申请日：2012-09-06

    Applicant: Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

    Inventor： Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

    IPC: H04N5/225 ,  H04N5/232 ,  H04N5/335

    CPC classification number: H04N5/2254 ,  H04N5/2257

    Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

    Abstract translation: 小型电子设备可以包括具有图像传感器的相机模块。 图像传感器可以由存储和处理电路控制以从接收的光捕获图像数据。 相机模块可以包括具有前表面和后表面的基底。 图像传感器可以安装到基板的后表面。 衬底可以包括在衬底的前表面上的光聚焦结构，其将光通过衬底中的开口聚焦到图像传感器。 柔性电路可用于在相机模块和其它电子设备部件之间传送信号。 柔性电路可以安装到相机模块基板的前表面，以帮助降低相机模块的总高度。 柔性电路可以安装到基板的延伸部分，或者可以安装成围绕图像传感器的周边。

    LOW RISE CAMERA MODULE
    5.
    发明申请
    LOW RISE CAMERA MODULE 有权
    低照度摄像机模块

    公开(公告)号：US20120276951A1

    公开(公告)日：2012-11-01

    申请号：US13096659

    申请日：2011-04-28

    Applicant: Steven Webster ,  Thomas B. Templeton

    Inventor： Steven Webster ,  Thomas B. Templeton

    IPC: H04N5/225 ,  H05K3/30 ,  H04M1/00

    CPC classification number: H05K1/021 ,  H01L2224/48091 ,  H04M1/0264 ,  H04N5/2257 ,  H05K2201/10121 ,  Y10T29/4913 ,  H01L2924/00014

    Abstract: A printed circuit carrier has an opening therein against which a back plate is attached to thereby form a cavity. An image sensor device is attached to the back plate inside the cavity. The height of the image sensor device is about equal to or less than the height of the cavity. Electrical signal connections are formed between the image sensor device and the printed circuit carrier. A cap is attached directly to the carrier by a flowable adhesive layer, to seal off the cavity. Other embodiments are also described and claimed.

    Abstract translation: 印刷电路载体具有开口，背板附接到开口，从而形成空腔。 图像传感器装置安装在腔内的背板上。 图像传感器装置的高度大约等于或小于空腔的高度。 在图像传感器装置和印刷电路载体之间形成电信号连接。 帽通过可流动的粘合剂层直接附接到载体上，以密封空腔。 还描述和要求保护其他实施例。

    Image sensor chip package
    7.
    发明授权
    Image sensor chip package 失效
    图像传感器芯片封装

    公开(公告)号：US07554184B2

    公开(公告)日：2009-06-30

    申请号：US11448570

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L23/02 ,  H01L23/48

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有源区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Digital camera module with improved image quality
    8.
    发明授权
    Digital camera module with improved image quality 有权
    具有改善图像质量的数码相机模块

    公开(公告)号：US07460317B2

    公开(公告)日：2008-12-02

    申请号：US11450649

    申请日：2006-06-09

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    IPC: G02B7/02

    CPC classification number: G02B7/02

    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

    Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

    Image sensor chip packaging method
    9.
    发明申请
    Image sensor chip packaging method 有权
    图像传感器芯片封装方法

    公开(公告)号：US20070126916A1

    公开(公告)日：2007-06-07

    申请号：US11595331

    申请日：2006-11-10

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2254 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2924/01079 ,  H01L2924/16195 ,  H04N5/2253 ,  H01L2924/00014

    Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

    Abstract translation: 图像传感器芯片封装方法包括：首先提供载体（20）。 载体包括基座（21）和引线框架（23）。 底座具有限定在其中的腔室（214）。 引线框架具有多个导电件（233）。 引线框架的导电片嵌入基座并彼此间隔开。 然后将图像传感器芯片（30）安装在腔室中。 图像传感器具有感光区域（301）和多个芯片焊盘（302）。 然后提供多个接合线（40）。 每根线将图像传感器芯片的相应的芯片焊盘和载体的相应导电片的暴露端之一电连接。 然后提供具有保持腔（54）的保持器（50）。 最后，将载体安装在支架的保持腔中。

    Digital camera module with improved image quality
    10.
    发明申请
    Digital camera module with improved image quality 有权
    具有改善图像质量的数码相机模块

    公开(公告)号：US20070008631A1

    公开(公告)日：2007-01-11

    申请号：US11450649

    申请日：2006-06-09

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    IPC: G02B7/02

    CPC classification number: G02B7/02

    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

    Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

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