公开(公告)号：US20220359455A1

公开(公告)日：2022-11-10

申请号：US17577406

申请日：2022-01-18

申请人： Stroke Precision Advanced Engineering Co., Ltd.

发明人： Yu-Min Huang ,  Sheng Che Huang ,  Chingju Lin ,  Wei-Hao Wang

IPC分类号： H01L23/00 ,  B23K1/005

摘要： A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

公开(公告)号：US20240213209A1

公开(公告)日：2024-06-27

申请号：US18595443

申请日：2024-03-05

申请人： Stroke Precision Advanced Engineering Co., Ltd.

发明人： Yu-Min Huang ,  Sheng Che Huang ,  Chingju Lin ,  Wei-Hao Wang

IPC分类号： H01L23/00 ,  B23K1/005 ,  B23K101/40

CPC分类号： H01L24/75 ,  B23K1/0053 ,  B23K1/0056 ,  H01L24/80 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/75263 ,  H01L2224/75283 ,  H01L2224/75705 ,  H01L2224/7598 ,  H01L2224/80224 ,  H01L2224/8023 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81815

摘要： A method for transferring an electronic device includes steps as follows. A flexible carrier having a first surface on which the electronic device to be transferred is disposed and a second surface, a target substrate, a target substrate, and a light-transmissible pin having a pressing end are provided. The flexible carrier is spaced from the target substrate with the first surface thereof facing the target substrate. The flexible carrier is deformed by exerting the pin to press the second surface with the pressing end thereof at a position corresponding to the electronic device until the electronic device is in contact with the target substrate. An energy beam emitted from a light source standing outside the pin and then traveling through the pin and going out from the pressing end to bond the electronic device onto the target substrate is applied. The pin is released from pressing the flexible carrier.

公开(公告)号：US11973054B2

公开(公告)日：2024-04-30

申请号：US17577406

申请日：2022-01-18

申请人： Stroke Precision Advanced Engineering Co., Ltd.

发明人： Yu-Min Huang ,  Sheng Che Huang ,  Chingju Lin ,  Wei-Hao Wang

IPC分类号： B23K1/00 ,  B23K1/005 ,  H01L23/00 ,  B23K101/40

CPC分类号： H01L24/75 ,  B23K1/0053 ,  B23K1/0056 ,  H01L24/80 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/75263 ,  H01L2224/75283 ,  H01L2224/75705 ,  H01L2224/7598 ,  H01L2224/80224 ,  H01L2224/8023 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81815

摘要： A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.