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    Medical device having bonding regions and method of making the same
    2.
    发明授权
    Medical device having bonding regions and method of making the same 有权
    具有接合区域的医疗器械及其制造方法

    公开(公告)号：US08133346B2

    公开(公告)日：2012-03-13

    申请号：US12242088

    申请日：2008-09-30

    申请人： I Mark Huang ,  Michael V. Williamson

    发明人： I Mark Huang ,  Michael V. Williamson

    IPC分类号： C04B37/00

    CPC分类号： B32B9/04 ,  C04B37/00 ,  C09J5/02 ,  C09J5/06 ,  C09J2400/166 ,  Y10T156/10 ,  Y10T428/12979 ,  Y10T428/31504 ,  Y10T428/31544 ,  Y10T428/31678

    摘要： Medical devices comprised of bonded joints are disclosed. The bonded joints comprise two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces are comprised of materials that are suitable for medical devices. Most preferably, Nitinol comprises at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device comprised of a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin is further comprised of a radiopaque additive, a lubricious additive, or both radiopaque and lubricious additives. Also disclosed is an intraluminal device comprised of contiguous heterogeneous structural elements comprised of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

    摘要翻译： 公开了由接合接头构成的医疗器械。 接合接头包括两层表面，它们之间由一层苯氧树脂结合。 在优选实施例中，接合表面由适合于医疗装置的材料构成。 最优选地，镍钛诺包含至少一个键合表面，然而，其它优选的材料可以包括但不限于钴铬，不锈钢，钛，钽和塑料。 还公开了由具有苯氧基树脂层的多个位置组成的管腔内装置，其中苯氧基树脂还包含不透射线添加剂，润滑添加剂或不透射线和光滑添加剂两者。 还公开了一种管腔内装置，其包括由金属构件和非金属部分组成的邻接异质结构元件，所述非金属部分通过其间的一层苯氧基树脂结合在一起。

    MEDICAL DEVICE HAVING BONDING REGIONS AND METHOD OF MAKING THE SAME
    3.
    发明申请
    MEDICAL DEVICE HAVING BONDING REGIONS AND METHOD OF MAKING THE SAME 有权
    具有粘结区域的医疗装置及其制造方法

    公开(公告)号：US20100078123A1

    公开(公告)日：2010-04-01

    申请号：US12242088

    申请日：2008-09-30

    申请人： I Mark Huang ,  Michael V. Williamson

    发明人： I Mark Huang ,  Michael V. Williamson

    IPC分类号： B32B9/04 ,  B32B37/00

    CPC分类号： B32B9/04 ,  C04B37/00 ,  C09J5/02 ,  C09J5/06 ,  C09J2400/166 ,  Y10T156/10 ,  Y10T428/12979 ,  Y10T428/31504 ,  Y10T428/31544 ,  Y10T428/31678

    摘要： Medical devices comprised of bonded joints are disclosed. The bonded joints comprise two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces are comprised of materials that are suitable for medical devices. Most preferably, Nitinol comprises at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device comprised of a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin is further comprised of a radioopaque additive, a lubricious additive, or both radioopaque and lubricious additives. Also disclosed is an intraluminal device comprised of contiguous heterogeneous structural elements comprised of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

    摘要翻译： 公开了由接合接头构成的医疗器械。 接合接头包括两层表面，它们之间由一层苯氧树脂结合。 在优选实施例中，接合表面由适合于医疗装置的材料构成。 最优选地，镍钛诺包含至少一个键合表面，然而，其它优选的材料可以包括但不限于钴铬，不锈钢，钛，钽和塑料。 还公开了由具有苯氧基树脂层的多个位置组成的管腔内装置，其中所述苯氧基树脂还包含不透射线添加剂，润滑添加剂或放射性不透明和润滑添加剂两者。 还公开了一种管腔内装置，其包括由金属构件和非金属部分组成的邻接异质结构元件，所述非金属部分通过其间的一层苯氧基树脂结合在一起。

    Medical device having bonding regions and method of making the same
    4.
    发明授权
    Medical device having bonding regions and method of making the same 有权
    具有接合区域的医疗器械及其制造方法

    公开(公告)号：US08535806B2

    公开(公告)日：2013-09-17

    申请号：US12888091

    申请日：2010-09-22

    申请人： I Mark Huang ,  Michael V. Williamson

    发明人： I Mark Huang ,  Michael V. Williamson

    IPC分类号： B32B9/04 ,  B32B27/00 ,  B32B15/04 ,  B32B15/00 ,  B32B9/00

    CPC分类号： B32B9/04 ,  C04B37/00 ,  C09J5/02 ,  C09J5/06 ,  C09J2400/166 ,  Y10T156/10 ,  Y10T428/12979 ,  Y10T428/31504 ,  Y10T428/31544 ,  Y10T428/31678

    摘要： Medical devices having bonded joints are disclosed. The bonded joints include two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces include materials that are suitable for medical devices. Most preferably, Nitinol includes at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device including a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin further includes a radioopaque additive, a lubricious additive, or both radioopaque and lubricious additives. Also disclosed is an intraluminal device having contiguous heterogeneous structural elements of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

    摘要翻译： 公开了具有接合接头的医疗器械。 接合接头包括两层，它们之间通过一层苯氧树脂结合。 在优选实施例中，接合表面包括适合于医疗装置的材料。 最优选地，镍钛诺包括至少一个键合表面，然而，其它优选的材料可以包括但不限于钴铬，不锈钢，钛，钽和塑料。 还公开了一种包括具有苯氧基树脂层的多个位置的管腔内装置，其中所述苯氧基树脂还包括不透射线添加剂，润滑添加剂或放射性不透明和润滑添加剂两者。 还公开了一种具有金属构件和非金属部分的连续异质结构元件的管腔内装置，其通过其间的一层苯氧基树脂结合在一起。

    MEDICAL DEVICE HAVING BONDING REGIONS AND METHOD OF MAKING THE SAME
    5.
    发明申请
    MEDICAL DEVICE HAVING BONDING REGIONS AND METHOD OF MAKING THE SAME 有权
    具有粘结区域的医疗装置及其制造方法

    公开(公告)号：US20110008626A1

    公开(公告)日：2011-01-13

    申请号：US12888091

    申请日：2010-09-22

    申请人： I Mark Huang ,  Michael V. Williamson

    发明人： I Mark Huang ,  Michael V. Williamson

    IPC分类号： B32B33/00 ,  B32B9/04 ,  B32B15/04 ,  B32B27/00

    CPC分类号： B32B9/04 ,  C04B37/00 ,  C09J5/02 ,  C09J5/06 ,  C09J2400/166 ,  Y10T156/10 ,  Y10T428/12979 ,  Y10T428/31504 ,  Y10T428/31544 ,  Y10T428/31678

    摘要： Medical devices having bonded joints are disclosed. The bonded joints include two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces include materials that are suitable for medical devices. Most preferably, Nitinol includes at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device including a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin further includes a radioopaque additive, a lubricious additive, or both radioopaque and lubricious additives. Also disclosed is an intraluminal device having contiguous heterogeneous structural elements of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.

    摘要翻译： 公开了具有接合接头的医疗器械。 接合接头包括两层，它们之间通过一层苯氧树脂结合。 在优选实施例中，接合表面包括适合于医疗装置的材料。 最优选地，镍钛诺包括至少一个键合表面，然而，其它优选的材料可以包括但不限于钴铬，不锈钢，钛，钽和塑料。 还公开了一种包括具有苯氧基树脂层的多个位置的管腔内装置，其中所述苯氧基树脂还包括不透射线添加剂，润滑添加剂或放射性不透明和润滑添加剂两者。 还公开了一种具有金属构件和非金属部分的连续异质结构元件的管腔内装置，其通过其间的一层苯氧基树脂结合在一起。

    Identifying yield-relevant process parameters in integrated circuit device fabrication processes
    6.
    发明授权
    Identifying yield-relevant process parameters in integrated circuit device fabrication processes 失效
    识别集成电路器件制造工艺中的屈服相关工艺参数

    公开(公告)号：US07494893B1

    公开(公告)日：2009-02-24

    申请号：US11654391

    申请日：2007-01-17

    申请人： Anand Inani ,  Brian E. Stine ,  Marci Yi-Ting Liao ,  Senthil Arthanari ,  Michael V. Williamson ,  Spencer B. Graves ,  Guanyuan M. Yu

    发明人： Anand Inani ,  Brian E. Stine ,  Marci Yi-Ting Liao ,  Senthil Arthanari ,  Michael V. Williamson ,  Spencer B. Graves ,  Guanyuan M. Yu

    IPC分类号： H01L21/76

    CPC分类号： G05B19/41875 ,  G05B2219/32177 ,  G05B2219/45031 ,  Y02P90/22 ,  Y02P90/86

    摘要： In one embodiment, wafers are processed to build test structures in the wafers. The wafers may be processed in tools of process steps belonging to a process module. The test structures may be tested to obtain defectivity data. Tool process parameters may be monitored and collected as process tool data. Other information about the wafers, such as metrology data and product layout attribute, may also be collected. A model describing the relationship between the defectivity data and process tool data may be created and thereafter used to relate the process tool data to a yield of the process module. The model may initially be an initial model using process tool data from a limited number of test wafers that contain test structures. The model may also be an expanded model using process tool data from product wafers containing embedded test structures in areas with no product devices.

    摘要翻译： 在一个实施例中，处理晶片以在晶片中构建测试结构。 可以在属于处理模块的工艺步骤的工具中处理晶片。 可以测试测试结构以获得缺陷数据。 工具过程参数可以作为过程工具数据进行监控和收集。 还可以收集关于晶片的其它信息，例如测量数据和产品布局属性。 可以创建描述缺陷率数据和处理工具数据之间的关系的模型，然后用于将过程工具数据与处理模块的收益相关联。 该模型可以初始化为使用来自有限数量的包含测试结构的测试晶片的工艺工具数据的初始模型。 该模型还可以是使用具有无产品设备的区域中包含嵌入式测试结构的产品晶圆的工艺工具数据的扩展模型。

    INTRALUMINAL DEVICE WITH IMPROVED FLEXIBILITY AND DURABILITY
    7.
    发明申请
    INTRALUMINAL DEVICE WITH IMPROVED FLEXIBILITY AND DURABILITY 审中-公开
    具有改进的灵活性和耐久性的内窥镜装置

    公开(公告)号：US20110106238A1

    公开(公告)日：2011-05-05

    申请号：US12913896

    申请日：2010-10-28

    申请人： Michael V. Williamson

    发明人： Michael V. Williamson

    IPC分类号： A61F2/82

    CPC分类号： A61F2/966 ,  A61F2/915 ,  A61F2002/91558 ,  A61F2210/0076 ,  A61F2230/005 ,  A61F2230/0054 ,  A61F2250/0036

    摘要： In accordance with the present invention, there is provided a stent for insertion into a vessel of a patient. The stent is a tubular member having front and back open ends and a longitudinal axis extending there between. The tubular member has a first smaller diameter for insertion into a patient and navigation through the vessels, and a second larger diameter for deployment into the target area of a vessel. The tubular member is made from a plurality of adjacent hoops extending between the front and back ends. The hoops include a plurality of longitudinal struts and a plurality of loops connecting adjacent struts. The stent further includes a plurality of bridges having loop to bridge connections which connect adjacent hoops to one another. The bridge to loop connection points are separated angularly with respect to the longitudinal axis. The bridges have one end attached to a loop, another end attached to a loop on an adjacent hoop. The connection point between the bridge and the hoops will have a repeating pattern over a plurality of strut apices such that the benefits of a decreased number of bridges is realized while simultaneously avoiding the creation of overly unconstrained hoops. It is preferred that the ratio of total number of circumferentially aligned loops to the number of loops spanned by a particular bridge be a whole number.

    摘要翻译： 根据本发明，提供一种用于插入患者血管的支架。 支架是具有前后开口端和在其之间延伸的纵向轴线的管状构件。 管状构件具有用于插入患者并穿过血管的第一较小直径，以及用于展开到血管的目标区域中的第二较大直径。 管状构件由在前端和后端之间延伸的多个相邻箍制成。 箍包括多个纵向支柱和连接相邻支柱的多个环。 支架还包括多个桥，其具有将相邻箍相互连接的环形桥接连接。 连接到环路的连接点相对于纵向轴线成角度地分离。 桥梁的一端连接到环路，另一端连接在相邻环箍上的环路上。 桥和环之间的连接点将在多个支柱顶点上具有重复图案，从而实现减少数量的桥的好处，同时避免产生过度无约束的箍。 优选地，周向对准的环路的总数与由特定桥跨越的环路的数量的比率是整数。

    Monitoring and control of integrated circuit device fabrication processes
    8.
    发明申请
    Monitoring and control of integrated circuit device fabrication processes 审中-公开
    集成电路器件制造工艺的监控

    公开(公告)号：US20080312875A1

    公开(公告)日：2008-12-18

    申请号：US11811802

    申请日：2007-06-12

    申请人： Guanyuan M. Yu ,  Michael V. Williamson ,  Spencer B. Graves

    发明人： Guanyuan M. Yu ,  Michael V. Williamson ,  Spencer B. Graves

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41875 ,  G05B2219/32187 ,  G05B2219/32188 ,  G05B2219/32194 ,  Y02P90/22 ,  Y02P90/265 ,  Y02P90/86

    摘要： An integrated circuit (IC) device fabrication process may be monitored by processing product wafers to fabricate product IC devices, collecting process tool data from tools used to fabricate the product IC devices, and testing the product IC devices. To predict and monitor yield, the process tool data collected during processing and the defectivity data from testing the product IC devices may be input to a yield model that also takes into account design information particular to the product devices. The design information may comprise layout attributes of the product devices. The yield model may be generated from a defectivity model created by processing test wafers to fabricate test structures, collecting process tool data from tools used to fabricate the test structures, and testing the test structures. The test structures may have varying layout attributes to cover a design space allowed by design rules for particular product IC devices.

    摘要翻译： 集成电路（IC）器件制造过程可以通过处理产品晶片来制造产品IC器件，从用于制造产品IC器件的工具收集工艺工具数据以及测试产品IC器件来监控。 为了预测和监测产量，可以将处理期间收集的过程工具数据和来自测试产品IC器件的缺陷数据输入到也考虑产品设备特有的设计信息的产量模型。 设计信息可以包括产品设备的布局属性。 产量模型可以从通过处理测试晶片产生的缺陷模型产生，以制造测试结构，从用于制造测试结构的工具收集过程工具数据，以及测试测试结构。 测试结构可以具有不同的布局属性以覆盖特定产品IC设备的设计规则允许的设计空间。