公开(公告)号：US08915419B2

公开(公告)日：2014-12-23

申请号：US13524701

申请日：2012-06-15

申请人： Su Jin Lee ,  Hye In Kim ,  Young Kwan Lee ,  Chang Kyung Woo ,  Je Kyoung Kim

发明人： Su Jin Lee ,  Hye In Kim ,  Young Kwan Lee ,  Chang Kyung Woo ,  Je Kyoung Kim

IPC分类号： B23K31/02 ,  B23K1/20 ,  H05K3/28 ,  H05K3/34 ,  H05K3/26

CPC分类号： H05K3/282 ,  H05K3/26 ,  H05K3/3484 ,  H05K2203/095

摘要： Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate.According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

摘要翻译： 这里公开了一种表面处理印刷电路板和包括表面处理层的印刷电路板的方法。 该方法包括：等离子体处理印刷电路板的表面; 用有机可焊性保存处理等离子体处理的基板; 对用有机可焊性保持剂处理的基材进行热处理; 在经过热处理的基板上印刷焊膏; 回流焊膏印刷基板以固定焊膏; 并且对所得到的底物进行去焊洗涤。 根据本发明，由于铜的氧化引起的变色问题可以通过在有机可焊性保存处理后在预定条件下进行热处理来解决。 因此，与现有技术的产品相比，本发明可以满足各种多回流工艺。

公开(公告)号：US11513662B2

公开(公告)日：2022-11-29

申请号：US17602978

申请日：2020-03-20

申请人： Hyo June Kim ,  Ji Hye Seo ,  Hye In Kim ,  Ye In Kim

发明人： Hyo June Kim ,  Ji Hye Seo ,  Hye In Kim ,  Ye In Kim

IPC分类号： G06F3/0482 ,  G06V40/12 ,  G06F3/04845 ,  G06F3/04883 ,  G06F21/32

摘要： Disclosed is an invention relating to a processor-executed method for outputting a hierarchical command menu on a display depending on user inputs.