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1.发明授权公开(公告)号：US08915419B2
公开(公告)日：2014-12-23
申请号：US13524701
申请日：2012-06-15
Applicant: Su Jin Lee , Hye In Kim , Young Kwan Lee , Chang Kyung Woo , Je Kyoung Kim
Inventor： Su Jin Lee , Hye In Kim , Young Kwan Lee , Chang Kyung Woo , Je Kyoung Kim
CPC classification number: H05K3/282 , H05K3/26 , H05K3/3484 , H05K2203/095
Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate.According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.
Abstract translation: 这里公开了一种表面处理印刷电路板和包括表面处理层的印刷电路板的方法。 该方法包括：等离子体处理印刷电路板的表面; 用有机可焊性保存处理等离子体处理的基板; 对用有机可焊性保持剂处理的基材进行热处理; 在经过热处理的基板上印刷焊膏; 回流焊膏印刷基板以固定焊膏; 并且对所得到的底物进行去焊洗涤。 根据本发明，由于铜的氧化引起的变色问题可以通过在有机可焊性保存处理后在预定条件下进行热处理来解决。 因此，与现有技术的产品相比，本发明可以满足各种多回流工艺。
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2.发明申请公开(公告)号：US20130025913A1
公开(公告)日：2013-01-31
申请号：US13524701
申请日：2012-06-15
Applicant: Su Jin LEE , Hye In KIM , Young Kwan LEE , Chang Kyung WOO , Je Kyoung KIM
Inventor： Su Jin LEE , Hye In KIM , Young Kwan LEE , Chang Kyung WOO , Je Kyoung KIM
CPC classification number: H05K3/282 , H05K3/26 , H05K3/3484 , H05K2203/095
Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate.According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.
Abstract translation: 这里公开了一种表面处理印刷电路板和包括表面处理层的印刷电路板的方法。 该方法包括：等离子体处理印刷电路板的表面; 用有机可焊性保存处理等离子体处理的基板; 对用有机可焊性保持剂处理的基材进行热处理; 在经过热处理的基板上印刷焊膏; 回流焊膏印刷基板以固定焊膏; 并且对所得到的底物进行去焊洗涤。 根据本发明，由于铜的氧化引起的变色问题可以通过在有机可焊性保存处理后在预定条件下进行热处理来解决。 因此，与现有技术的产品相比，本发明可以满足各种多回流工艺。
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公开(公告)号：US20130008938A1
公开(公告)日：2013-01-10
申请号：US13234935
申请日：2011-09-16
Applicant: Je Kyoung KIM , Seong Hoon BAE , Young Kwan LEE , Su Jin LEE
Inventor： Je Kyoung KIM , Seong Hoon BAE , Young Kwan LEE , Su Jin LEE
CPC classification number: B23K1/20 , B23K1/0016 , B23K2101/42
Abstract: Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate.
Abstract translation: 本发明公开了印刷电路板的制造方法，该方法包括：准备具有连接垫的基底基板; 在连接垫上形成表面处理层; 对具有形成表面处理层的连接焊盘的基底基板进行制冷处理; 以及在所述冷冻处理过的基底基板的连接垫上印刷焊膏。
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