Illuminating device
    1.
    发明申请
    Illuminating device 审中-公开
    照明装置

    公开(公告)号:US20070152554A1

    公开(公告)日:2007-07-05

    申请号:US11580062

    申请日:2006-10-13

    IPC分类号: H01J19/02 H01J1/62

    摘要: An illuminating device includes: an upper substrate and a lower substrate facing each other and spaced apart from each other; an anode electrode arranged on a lower surface of the upper substrate; a phosphor layer arranged on a lower surface of the anode electrode; a cathode electrode arranged on an upper surface of the lower substrate; an electron emission source arranged on the cathode electrode; and a reflection film arranged between the electron emission source and the phosphor layer and respectively separated therefrom, the reflection film being patterned on a surface facing the phosphor layer to diffuse light emitted from the phosphor layer. The illuminating device provides improved brightness uniformity by forming a pattern on the reflection film so that light can be uniformly diffused or dispersed.

    摘要翻译: 照明装置包括:上基板和下基板,彼此面对并且彼此间隔开; 阳极,布置在上基板的下表面上; 布置在所述阳极电极的下表面上的荧光体层; 阴极电极,设置在下基板的上表面上; 设置在阴极上的电子发射源; 以及反射膜,其布置在电子发射源和荧光体层之间并分别与其分离,反射膜在面向荧光体层的表面上被图案化以扩散从荧光体层发射的光。 照明装置通过在反射膜上形成图案使得可以均匀地扩散或分散光而提供改善的亮度均匀性。

    Method of manufacturing field emission device
    3.
    发明申请
    Method of manufacturing field emission device 有权
    场致发射装置的制造方法

    公开(公告)号:US20080108271A1

    公开(公告)日:2008-05-08

    申请号:US11790657

    申请日:2007-04-26

    IPC分类号: H01J9/02

    摘要: A method of manufacturing a field emission display includes: sequentially forming a cathode electrode, an insulating layer, and a gate material layer on a substrate; forming a metal sacrificial layer on an upper surface of the gate material layer; forming a through hole to expose the insulating layer in the metal sacrificial layer and the gate material layer; forming an emitter hole to expose the cathode electrode in the insulating layer exposed through the through hole; forming a gate electrode by etching the gate material layer constituting an upper wall of the emitter hole; and forming an emitter of Carbon NanoTubes (CNTs) on an upper surface of the cathode electrode located below the through hole.

    摘要翻译: 场发射显示器的制造方法包括:在基板上依次形成阴极电极,绝缘层和栅极材料层; 在栅极材料层的上表面上形成金属牺牲层; 形成通孔以暴露金属牺牲层和栅极材料层中的绝缘层; 形成发射极孔,露出通过该通孔的绝缘层中的阴极电极; 通过蚀刻构成发射极孔的上壁的栅极材料层来形成栅电极; 以及在位于通孔下方的阴极电极的上表面上形成碳纳米管(CNT)的发射极。

    Method of manufacturing field emission device
    4.
    发明授权
    Method of manufacturing field emission device 有权
    场致发射装置的制造方法

    公开(公告)号:US07942714B2

    公开(公告)日:2011-05-17

    申请号:US11790657

    申请日:2007-04-26

    IPC分类号: H01J9/02 H01J1/304

    摘要: A method of manufacturing a field emission display includes: sequentially forming a cathode electrode, an insulating layer, and a gate material layer on a substrate; forming a metal sacrificial layer on an upper surface of the gate material layer; forming a through hole to expose the insulating layer in the metal sacrificial layer and the gate material layer; forming an emitter hole to expose the cathode electrode in the insulating layer exposed through the through hole; forming a gate electrode by etching the gate material layer constituting an upper wall of the emitter hole; and forming an emitter of Carbon NanoTubes (CNTs) on an upper surface of the cathode electrode located below the through hole.

    摘要翻译: 场发射显示器的制造方法包括:在基板上依次形成阴极电极,绝缘层和栅极材料层; 在栅极材料层的上表面上形成金属牺牲层; 形成通孔以暴露金属牺牲层和栅极材料层中的绝缘层; 形成发射极孔,露出通过该通孔的绝缘层中的阴极电极; 通过蚀刻构成发射极孔的上壁的栅极材料层来形成栅电极; 以及在位于通孔下方的阴极电极的上表面上形成碳纳米管(CNT)的发射极。

    Field emission type backlight unit and method of manufacturing upper panel thereof
    5.
    发明申请
    Field emission type backlight unit and method of manufacturing upper panel thereof 审中-公开
    场发射型背光单元及其制造方法

    公开(公告)号:US20070164653A1

    公开(公告)日:2007-07-19

    申请号:US11509622

    申请日:2006-08-25

    IPC分类号: H01J63/04 H01J1/62 B05D5/12

    摘要: A method of manufacturing an upper panel of a field emission type backlight unit. The method includes: sequentially forming an anode electrode and a phosphor layer on a substrate; forming a metal reflection film on the phosphor layer; and annealing a surface of the metal reflection film. The method can increase brightness of an image, can prevent occurrence of an electric arc when a high driving voltage is applied to the backlight unit, and allows removal of residues produced when manufacturing the backlight unit.

    摘要翻译: 一种制造场致发射型背光单元的上面板的方法。 该方法包括:在基板上依次形成阳极电极和荧光体层; 在荧光体层上形成金属反射膜; 并退火金属反射膜的表面。 该方法可以增加图像的亮度,当向背光单元施加高驱动电压时可以防止发生电弧,并且允许去除制造背光单元时产生的残留物。

    Thin-film transistor substrate and method of manufacturing the same
    6.
    发明授权
    Thin-film transistor substrate and method of manufacturing the same 有权
    薄膜晶体管基板及其制造方法

    公开(公告)号:US08183097B2

    公开(公告)日:2012-05-22

    申请号:US12186659

    申请日:2008-08-06

    IPC分类号: H01L27/88

    摘要: A thin-film transistor (TFT) substrate includes a semiconductor pattern, a conductive pattern, a first wiring pattern, an insulation pattern and a second wiring pattern. The semiconductor pattern is formed on a substrate. The conductive pattern is formed as a layer identical to the semiconductor pattern on the substrate. The first wiring pattern is formed on the semiconductor pattern. The first wiring pattern includes a source electrode and a drain electrode spaced apart from the source electrode. The insulation pattern is formed on the substrate having the first wiring pattern to cover the first wiring pattern. The second wiring pattern is formed on the insulation pattern. The second wiring pattern includes a gate electrode formed on the source and drain electrodes. Therefore, a TFT substrate is manufactured using two or three masks, so that manufacturing costs may be decreased.

    摘要翻译: 薄膜晶体管(TFT)衬底包括半导体图案,导电图案,第一布线图案,绝缘图案和第二布线图案。 半导体图案形成在基板上。 导电图案形成为与衬底上的半导体图案相同的层。 第一布线图案形成在半导体图案上。 第一布线图案包括与源电极间隔开的源电极和漏电极。 在具有第一布线图案的基板上形成绝缘图案以覆盖第一布线图案。 第二布线图案形成在绝缘图案上。 第二布线图案包括形成在源极和漏极上的栅电极。 因此,使用两个或三个掩模制造TFT基板,从而可以降低制造成本。

    Inverted nonvolatile memory device, stack module, and method of fabricating the same
    7.
    发明申请
    Inverted nonvolatile memory device, stack module, and method of fabricating the same 失效
    反相非易失性存储器件,堆叠模块及其制造方法

    公开(公告)号:US20090057745A1

    公开(公告)日:2009-03-05

    申请号:US12073398

    申请日:2008-03-05

    摘要: Example embodiments provide a nonvolatile memory device that may be integrated through stacking, a stack module, and a method of fabricating the nonvolatile memory device. In the nonvolatile memory device according to example embodiments, at least one bottom gate electrode may be formed on a substrate. At least one charge storage layer may be formed on the at least one bottom gate electrode, and at least one semiconductor channel layer may be formed on the at least one charge storage layer.

    摘要翻译: 示例性实施例提供了可以通过堆叠集成的非易失性存储器件,堆叠模块和制造非易失性存储器件的方法。 在根据示例性实施例的非易失性存储器件中,可以在衬底上形成至少一个底栅电极。 至少一个电荷存储层可以形成在至少一个底栅电极上,并且至少一个半导体沟道层可以形成在至少一个电荷存储层上。

    Method for fabricating epitaxial cobalt-disilicide layers using cobalt-nitride thin film
    9.
    发明授权
    Method for fabricating epitaxial cobalt-disilicide layers using cobalt-nitride thin film 失效
    使用氮化钴薄膜制造外延二硫化钴层的方法

    公开(公告)号:US07105443B2

    公开(公告)日:2006-09-12

    申请号:US11008671

    申请日:2004-12-10

    IPC分类号: H01L21/44

    CPC分类号: H01L29/665 H01L21/28518

    摘要: A method for fabricating epitaxial cobalt disilicide layers uses a cobalt-nitride thin film. Epitaxial cobalt disilicide (CoSi2) layers are fabricated using a cobalt-nitride thin film in a salicide process, wherein a silicide is formed on source/drain regions and a polysilicon gate electrode of a nanoscale MOS transistor. Epitaxial CoSi2 layers can be fabricated on source/drain regions and a gate electrode of a silicon substrate using a cobalt-nitride thin film, without the formation of an interlayer between a cobalt layer and the silicon substrate.

    摘要翻译: 用于制造外延二硫化钴层的方法使用氮化钴薄膜。 在硅化物工艺中使用氮化钴薄膜制造外延二硅化钴(CoSi 2 N)层,其中硅化物形成在纳米级MOS晶体管的源极/漏极区域和多晶硅栅极电极上。 可以在源极/漏极区域和使用氮化钴薄膜的硅衬底的栅电极上制造外延CoSi 2层,而不在钴层和硅衬底之间形成中间层。

    Method for fabricating epitaxial cobalt-disilicide layers using cobalt-nitride thin film
    10.
    发明申请
    Method for fabricating epitaxial cobalt-disilicide layers using cobalt-nitride thin film 失效
    使用氮化钴薄膜制造外延二硫化钴层的方法

    公开(公告)号:US20050130417A1

    公开(公告)日:2005-06-16

    申请号:US11008671

    申请日:2004-12-10

    CPC分类号: H01L29/665 H01L21/28518

    摘要: A method for fabricating epitaxial cobalt disilicide layers uses a cobalt-nitride thin film. Epitaxial cobalt disilicide (CoSi2) layers are fabricated using a cobalt-nitride thin film in a salicide process, wherein a silicide is formed on source/drain regions and a polysilicon gate electrode of a nanoscale MOS transistor. Epitaxial CoSi2 layers can be fabricated on source/drain regions and a gate electrode of a silicon substrate using a cobalt-nitride thin film, without the formation of an interlayer between a cobalt layer and the silicon substrate.

    摘要翻译: 用于制造外延二硫化钴层的方法使用氮化钴薄膜。 在硅化物工艺中使用氮化钴薄膜制造外延二硅化钴(CoSi 2 N)层,其中硅化物形成在纳米级MOS晶体管的源极/漏极区域和多晶硅栅极电极上。 可以在源极/漏极区域和使用氮化钴薄膜的硅衬底的栅电极上制造外延CoSi 2层,而不在钴层和硅衬底之间形成中间层。