Abstract:
An ultrasonic spray apparatus is configured to minimize contact between bubbles, which are generated due to ultrasonic excitation, and ionized water when the bubbles are discharged. The ultrasonic spray apparatus is configured so that a discharge pipe is installed to start from a bottom or a side surface of an accommodation space storing ionized water and protrude above the ionized water filled in the accommodation space. The bubbles are able to be discharged into the accommodation space through the discharge pipe. Changes in properties of the ionized water may be prevented. The properties of the ionized water may be utilized as they are. The discharge of the bubbles is possible even when anyone of the branched portions is blocked, and interference with a flow of the bubbles is prevented in advance even when water drops or the like generated inside the accommodation space block any one of the branched portions.
Abstract:
An aspheric plastic lens comprises a spherical surface portion having upper and lower portions at the center thereof, the upper and lower portions having curved surfaces with a different curvature, respectively; a rib formed in a circular plate shape so as to extend from the peripheral edge of the spherical surface portion to the outside, the rib having burrs formed to project on the edges of the upper and lower surfaces thereof; and a pair of two-stage step portions formed on the upper and lower surfaces of the rib, the two-stage step portions being formed symmetrically with each other.
Abstract:
A schottky diode, a resistive memory device including the schottky diode and a method of manufacturing the same. The resistive memory device includes a semiconductor substrate including a word line, a schottky diode formed on the word line, and a storage layer formed on the schottky diode. The schottky diode includes a first semiconductor layer, a conductive layer formed on the first semiconductor layer and having a lower work function than the first semiconductor layer, and a second semiconductor layer formed on the to conductive layer.
Abstract:
A method for manufacturing a fin transistor includes forming a trench by etching a semiconductor substrate. A flowable insulation layer is filled in the trench to form a field insulation layer defining an active region. The portion of the flowable insulation layer coming into contact with a gate forming region is etched so as to protrude the gate forming region in the active region. A protective layer over the semiconductor substrate is formed to fill the portion of the etched flowable insulation layer. The portion of the protective layer formed over the active region is removed to expose the active region of the semiconductor substrate. The exposed active region of the semiconductor substrate is cleaned. The protective layer remaining on the portion of the etched flowable insulation layer is removed. Gates are formed over the protruded gate forming regions in the active region.
Abstract:
A semiconductor device includes a semiconductor substrate having an active region including a channel portion. An isolation layer is formed in the semiconductor substrate to define the active region, and a gate is formed over the channel portion in the active region. The active region of the semiconductor substrate is etched to such that the entire active region is below an upper surface of the isolation layer. A U-shaped groove is formed in the channel portion of the active region, except the edges in a direction of the channel width thereof, in order to increase the channel width. In the semiconductor device, there is an increase in channel length and channel width leading to a reduction in leakage current and on increase in operation current.