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    Electric double layer capacitor and method of manufacturing the same
    1.
    发明申请
    Electric double layer capacitor and method of manufacturing the same 审中-公开
    双电层电容器及其制造方法

    公开(公告)号：US20110188171A1

    公开(公告)日：2011-08-04

    申请号：US12926529

    申请日：2010-11-23

    申请人： Sung Ho Lee ,  Hong Seok Min ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Dong Sup Park

    发明人： Sung Ho Lee ,  Hong Seok Min ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Dong Sup Park

    IPC分类号： H01G9/058 ,  H01G7/00

    CPC分类号： H01G7/00 ,  H01G9/058 ,  H01G11/26 ,  H01G11/28 ,  H01G11/38 ,  H01G11/70 ,  Y02E60/13 ,  Y02T10/7022 ,  Y10T29/43

    摘要： There is provided an electric double layer capacitor and a method of manufacturing the same. The electric double layer capacitor includes first and second electrodes facing each other; and an ion-permeable separator interleaved between the first and second electrodes, wherein at least one of the first and second electrodes includes a metallic fiber being compressed to have pores therein and an electrode material filling the pores. The electric double layer capacitor has low equivalent series resistance (ESR) and high output density. Also, since the electrodes are formed to be thin, the electric double layer capacitor can be miniaturized.

    摘要翻译： 提供双电层电容器及其制造方法。 双电层电容器包括彼此面对的第一和第二电极; 以及在第一和第二电极之间交错的离子可渗透分离器，其中第一和第二电极中的至少一个包括被压缩以在其中具有孔的金属纤维和填充孔的电极材料。 双电层电容器具有低等效串联电阻（ESR）和高输出密度。 此外，由于电极形成得较薄，所以双电层电容器可以小型化。

    Chip-type electric double layer capacitor cell and method of manufacturing the same
    2.
    发明申请
    Chip-type electric double layer capacitor cell and method of manufacturing the same 审中-公开
    片式双电层电容器及其制造方法

    公开(公告)号：US20110102972A1

    公开(公告)日：2011-05-05

    申请号：US12923950

    申请日：2010-10-15

    申请人： Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Hyun Chul Jung ,  Yeong Su Cho ,  Sang Kyun Lee

    发明人： Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Hyun Chul Jung ,  Yeong Su Cho ,  Sang Kyun Lee

    IPC分类号： H01G9/08 ,  H01G13/00 ,  B23K11/00 ,  B23K20/10

    CPC分类号： H01G11/80 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/74 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022

    摘要： There is provided a chip-type electric double layer capacitor comprising: a resin case having a housing space provided therein and formed of insulating resin and first and second external terminals inserted into the resin case by insert injection molding. Each of the external terminals has a first portion exposed to an outer surface of the resin case for external contact and a second portion exposed to an inner surface of the housing space for internal contact. a sealing portion includes a groove portion provided in the resin case along a circumference of at least one of the first and second external terminals and a resin filling the groove portion. An electric double layer capacitor cell is mounted in the housing space and electrically connected to the second portion of the first and second external terminals.

    摘要翻译： 提供了一种芯片式双电层电容器，包括：具有设置在其中的由绝缘树脂形成的容纳空间的树脂壳体和通过插入注射成型插入到树脂壳体中的第一和第二外部端子。 每个外部端子具有暴露于用于外部接触的树脂壳体的外表面的第一部分和暴露于壳体空间的内表面以用于内部接触的第二部分。 密封部分包括沿着第一和第二外部端子中的至少一个的圆周设置在树脂壳体中的凹槽部分和填充凹槽部分的树脂。 电双层电容器电池安装在容纳空间中并电连接到第一和第二外部端子的第二部分。

    METHOD OF MANUFACTURING CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR
    3.
    发明申请
    METHOD OF MANUFACTURING CHIP-TYPE ELECTRIC DOUBLE LAYER CAPACITOR 审中-公开
    芯片型双电层电容器的制造方法

    公开(公告)号：US20120297594A1

    公开(公告)日：2012-11-29

    申请号：US13568483

    申请日：2012-08-07

    申请人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    发明人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    IPC分类号： H01G9/155

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022 ,  Y10T29/417

    摘要： A method of manufacturing a chip-type electric double layer capacitor, including: forming a lower case having an opened housing space and first and second external terminals buried therein, the first and second external terminals having first surfaces exposed to the housing space, respectively, and second surfaces exposed to an outer region of the lower case, respectively; mounting an electric double layer capacitor cell in the housing space such that the electric double layer capacitor cell is electrically connected to the first surfaces of the first and second external terminals exposed to the housing space; and mounting an upper cap on the lower case so as to cover the housing space.

    摘要翻译： 一种制造芯片式双电层电容器的方法，包括：形成具有开放的容纳空间的下壳体和埋入其中的第一和第二外部端子，第一和第二外部端子分别具有暴露于容纳空间的第一表面， 以及分别暴露于所述下壳体的外部区域的第二表面; 将双电层电容器单元安装在容纳空间中，使得双电层电容器单元电连接到暴露于容纳空间的第一和第二外部端子的第一表面; 并将上盖安装在下壳体上以覆盖住容纳空间。

    Chip-type electric double layer capacitor and method for manufacturing the same
    4.
    发明申请
    Chip-type electric double layer capacitor and method for manufacturing the same 审中-公开
    片式双电层电容器及其制造方法

    公开(公告)号：US20110058307A1

    公开(公告)日：2011-03-10

    申请号：US12591410

    申请日：2009-11-18

    申请人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

    发明人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

    IPC分类号： H01G9/155

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/52 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13

    摘要： The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively.

    摘要翻译： 芯片型双电层电容器及其制造方法技术领域本发明涉及芯片式双电层电容器及其制造方法。 芯片式双电层电容器包括双电层元件，其包括两个电极，其包括两个不同的极性，并且在彼此相反的一侧突出的电极端子，防止两个电极短路的第一隔板，以及第二隔离件 分离器，其基于两个电极的一个电极设置在与第一分离器相对的位置处; 以及包括安装在两个电极的突出电极端子上的封装端子的封装，它们形成在其底部并容纳双电层元件，其中基于与第二电极相对的突出电极端子缠绕双电层元件 作为参考轴的两个电极和电极端子分别附接到封装端子。

    Chip-type electric double layer capacitor and method of manufacturing the same
    7.
    发明申请
    Chip-type electric double layer capacitor and method of manufacturing the same 审中-公开
    片式双电层电容器及其制造方法

    公开(公告)号：US20110002084A1

    公开(公告)日：2011-01-06

    申请号：US12654751

    申请日：2009-12-30

    申请人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    发明人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

    IPC分类号： H01G9/08

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022

    摘要： A chip-type electric double layer capacitor includes: an exterior case including a housing space formed therein and formed of insulation resin; a first external terminal buried in the exterior case and including a first surface exposed to the housing space and a second surface exposed to the outside of the exterior case; a second external terminal buried in the exterior case and including a first surface exposed to the housing space and a second surface exposed to the outside of the exterior case; and an electric double layer cell disposed in the housing space so as to be electrically connected to the first surfaces of the first and second external terminals.

    摘要翻译： 芯片型双电层电容器包括：外壳，包括形成在其中并由绝缘树脂形成的容纳空间; 第一外部端子，其被埋在所述外部壳体中并且包括暴露于所述壳体空间的第一表面和暴露于所述外部壳体的外部的第二表面; 第二外部端子，其被埋在所述外部壳体中，并且包括暴露于所述容纳空间的第一表面和暴露于所述外部壳体的外部的第二表面; 以及设置在所述容纳空间中以与所述第一和第二外部端子的第一表面电连接的双电层单元。

    Electrolyte for lithium ion capacitor and lithium ion capacitor including the same
    8.
    发明授权
    Electrolyte for lithium ion capacitor and lithium ion capacitor including the same 失效
    用于锂离子电容器和锂离子电容器的电解液包括相同

    公开(公告)号：US08331080B2

    公开(公告)日：2012-12-11

    申请号：US12926315

    申请日：2010-11-09

    申请人： Sang Kyun Lee ,  Dong Hyeok Choi ,  Hyun Chul Jung ,  Bae Kyun Kim

    发明人： Sang Kyun Lee ,  Dong Hyeok Choi ,  Hyun Chul Jung ,  Bae Kyun Kim

    IPC分类号： H01G9/035

    CPC分类号： H01G11/60 ,  H01G11/58 ,  Y02E60/13

    摘要： There are provided an electrolyte for a lithium ion capacitor and a lithium ion capacitor including the same. The electrolyte for a lithium ion capacitor according to the present invention includes: a lithium salt; and a mixing solvent including i) two or more compounds selected from a group consisting of cyclic carbonate compounds, ii) one or more compounds selected from a group consisting of linear carbonate compounds represented by a specified Formula, and iii) one or more compound selected from a group consisting of propionate compound represented by a specified Formula.

    摘要翻译： 提供了用于锂离子电容器的电解质和包括其的锂离子电容器。 根据本发明的用于锂离子电容器的电解质包括：锂盐; 和混合溶剂，其包括i）两种或更多种选自环状碳酸酯化合物的化合物，ii）一种或多种选自由指定式表示的直链碳酸酯化合物的化合物，和iii）一种或多种选择的化合物 来自由指定式表示的丙酸酯化合物组成的组。

    METAL AIR BATTERY AND METHOD FOR PREPARING THE SAME
    9.
    发明申请
    METAL AIR BATTERY AND METHOD FOR PREPARING THE SAME 审中-公开
    金属空气电池及其制备方法

    公开(公告)号：US20120270116A1

    公开(公告)日：2012-10-25

    申请号：US13357353

    申请日：2012-01-24

    申请人： Ji Sung CHO ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Bae Kyun Kim ,  Chang Ryul Jung

    发明人： Ji Sung CHO ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Bae Kyun Kim ,  Chang Ryul Jung

    IPC分类号： H01M12/06 ,  H01M8/00

    CPC分类号： H01M12/06 ,  H01M2220/20

    摘要： Disclosed is a metal air battery a metal anode and an air cathode, wherein the metal anode includes an organic electrolyte and the air cathode includes an aqueous electrolyte, and a method for preparing the same.The metal air battery having a structure according to the exemplary embodiment of the present invention may prevent the electrolytes of the cathode and the anode from being mixed and activate battery reaction, thereby preparing a high-capacity battery.

    摘要翻译： 公开了一种金属空气电池，金属阳极和空气阴极，其中金属阳极包括有机电解质，空气阴极包括水性电解质及其制备方法。 具有根据本发明的示例性实施例的结构的金属空气电池可以防止阴极和阳极的电解质混合并且启动电池反应，从而制备高容量电池。

    Electric double layer capacitor package
    10.
    发明申请
    Electric double layer capacitor package 审中-公开
    电双层电容器封装

    公开(公告)号：US20100214721A1

    公开(公告)日：2010-08-26

    申请号：US12585154

    申请日：2009-09-04

    申请人： Sang Kyun Lee ,  Gi Rak Lee ,  Ho Joo Lee ,  Hyun Chul Jung

    发明人： Sang Kyun Lee ,  Gi Rak Lee ,  Ho Joo Lee ,  Hyun Chul Jung

    IPC分类号： H01G9/08 ,  H01G9/155

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/12 ,  H01G11/82 ,  Y02E60/13 ,  Y02T10/7022

    摘要： An electric double layer capacitor package includes a package body including a groove region formed by removing a portion from a surface thereof, an electric double layer capacitor disposed in the groove region of the package body, and including first and second electrodes and an ion permeable separator disposed between the first and second electrodes, and first and second conductive vias each disposed in an inner portion of the package body and each having one end connected to one of the first and second electrodes, respectively and the other end extending from the one end toward a bottom surface of the package body in the case that the surface is defined as an upper region of the package body. The electric double layer capacitor package can be surface-mounted without using an additional structure. The use of the electric double layer capacitor package achieves a reduction in thickness and mounting area, thereby contributing to the production of lighter and smaller products.

    摘要翻译： 一种双电层电容器封装，包括：封装体，包括通过从其表面除去一部分而形成的沟槽区;布置在封装体的沟槽区域中的双电层电容器，并且包括第一和第二电极和离子可渗透分离器 设置在第一和第二电极之间，以及第一和第二导电通孔，每个导电通孔分别设置在封装体的内部部分中，并且每个具有一端分别连接到第一和第二电极中的一个，另一端从一端朝向 在表面被限定为包装体的上部区域的情况下，包装体的底面。 电双层电容器封装可以在不使用附加结构的情况下进行表面安装。 使用双电层电容器封装实现了厚度和安装面积的减小，从而有助于生产更轻和更小的产品。