MULTILAYER CERAMIC ELECTRONIC PART
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART 审中-公开
    多层陶瓷电子部件

    公开(公告)号:US20130141837A1

    公开(公告)日:2013-06-06

    申请号:US13403464

    申请日:2012-02-23

    IPC分类号: H01G4/12 H01C7/10 H01L41/083

    摘要: There is provided a 1005-sized or smaller multilayer ceramic electronic part, including: a ceramic body having internal electrodes having a directivity perpendicular to a printed circuit board; and external electrodes formed on both end portions of the ceramic body and electrically connected to the internal electrodes each including an active area part and a lead part, the active area parts facing each other to contribute to forming capacitance, and the lead part having a width smaller than that of the active area part, and wherein when a width of the active area part is defined as WLa, a width of the lead part on one end portion of the ceramic body connected to the external electrodes is defined as WL1, and a bottleneck rate α of the lead part is defined as 1−WL1/WLa, the bottleneck rate α of the lead part satisfies a range of 0

    摘要翻译: 提供了一种1005尺寸或更小的多层陶瓷电子部件,其包括:具有垂直于印刷电路板的方向性的内部电极的陶瓷体; 以及外部电极,其形成在所述陶瓷体的两端部并与内部电极电连接,所述内部电极各自包括有源区域部分和引线部分,所述有源区域部分相互面对以有助于形成电容,并且所述引线部分具有宽度 小于活性区域部分的宽度,并且其中当有源区域部分的宽度被定义为WLa时,连接到外部电极的陶瓷体的一个端部上的引线部分的宽度被定义为WL1,并且 引导部分的瓶颈率α定义为1-WL1 / WLa,引导部分的瓶颈速率α满足0 <0.12的范围。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20120320493A1

    公开(公告)日:2012-12-20

    申请号:US13491254

    申请日:2012-06-07

    IPC分类号: H01G4/30 B05D5/00

    CPC分类号: H01G4/30 H01G4/005 H01G4/12

    摘要: There are provided a multilayer ceramic electronic component and a manufacturing method thereof. The multilayer ceramic electronic component includes: a body part including internal electrodes and dielectric layers and having at least one connection surface to which a portion of the internal electrodes are exposed; external electrodes coupled to the connection surface to thereby be electrically connected to the internal electrodes; and protective layers provided on the connection surface so as to shield at least portions of the internal electrodes exposed at the connection surface, wherein a width of an exposed part of the internal electrode shielded by the protective layer has 0.8 to 0.9 of that of an overall width of the internal electrode.

    摘要翻译: 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括:主体部,包括内部电极和电介质层,并具有至少一个内部电极的一部分露出的连接面; 外部电极,其耦合到所述连接表面,从而电连接到所述内部电极; 以及设置在所述连接表面上以便屏蔽在所述连接表面处暴露的所述内部电极的至少一部分的保护层,其中由所述保护层屏蔽的所述内部电极的暴露部分的宽度为整体的0.8至0.9的宽度 内部电极的宽度。

    MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20130107417A1

    公开(公告)日:2013-05-02

    申请号:US13618638

    申请日:2012-09-14

    IPC分类号: H01G4/30

    摘要: There is provided a multi-layered ceramic electronic component. The multi-layered ceramic electronic component according to embodiments of the present invention includes: a ceramic element in which a plurality of dielectric layers are stacked; and a plurality of first and second internal electrodes formed on at least one surface of the dielectric layer and alternately disposed in a width direction, wherein, when a distance from one side of the ceramic element to a leading edge of the first internal electrode in a width direction is set to be B, and a distance from one side of the ceramic element to a leading edge in a width direction of the second internal electrode thereof is set to be A, a difference between A and B is 10 to 14% of a width of the first internal electrode or the second internal electrode.

    摘要翻译: 提供了多层陶瓷电子元件。 根据本发明实施例的多层陶瓷电子部件包括:多个电介质层堆叠的陶瓷元件; 以及形成在所述电介质层的至少一个表面上并且沿宽度方向交替布置的多个第一和第二内部电极,其中当从所述陶瓷元件的一侧到所述第一内部电极的前端的距离为 宽度方向设定为B,将从陶瓷元件一侧到其第二内部电极的宽度方向前缘的距离设定为A,A与B之间的差为10〜14% 第一内部电极或第二内部电极的宽度。

    MULTILAYER CERAMIC CAPACITOR
    7.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 审中-公开
    多层陶瓷电容器

    公开(公告)号:US20120224298A1

    公开(公告)日:2012-09-06

    申请号:US13166304

    申请日:2011-06-22

    IPC分类号: H01G4/12 H01G4/06

    摘要: There is provided a multilayer ceramic capacitor including: a ceramic main body having first and second side faces opposed to each other and third and fourth side faces connecting the first and second side faces; a plurality of inner electrodes formed within the ceramic main body and having respective one ends thereof exposed to the third and fourth side faces; external electrodes formed on the third and fourth side faces and electrically connected to the inner electrodes; and dielectric layers alternately stacked with the inner electrodes and made of ceramic powder, wherein a grain size of the ceramic powder is 130 μm or smaller. Acoustic noise generated from the multilayer ceramic capacitor can be reduced by adjusting the grain size of the ceramic powder, a chip permittivity, and the thickness of the dielectric layer, and thus, noise of an electronic product employing the multilayer ceramic capacitor can be reduced.

    摘要翻译: 提供一种多层陶瓷电容器,其包括:具有彼此相对的第一和第二侧面的陶瓷主体和连接第一和第二侧面的第三和第四侧面; 多个内部电极,形成在所述陶瓷主体内,并且其各自的一端暴露于所述第三和第四侧面; 形成在第三和第四侧面上并与内部电极电连接的外部电极; 和与内部电极交替堆叠并由陶瓷粉末制成的电介质层,其中陶瓷粉末的晶粒尺寸为130μm或更小。 可以通过调节陶瓷粉末的晶粒尺寸,芯片介电常数和介电层的厚度来减少由多层陶瓷电容器产生的声音噪声,从而可以降低采用该多层陶瓷电容器的电子产品的噪声。