公开(公告)号：US20090112453A1

公开(公告)日：2009-04-30

申请号：US12343315

申请日：2008-12-23

申请人： Sung-Wook Mo ,  Young-Gon Seo ,  Myoung-Jin Shin ,  Byung-Ik Ahn ,  Won-Tae Kim

发明人： Sung-Wook Mo ,  Young-Gon Seo ,  Myoung-Jin Shin ,  Byung-Ik Ahn ,  Won-Tae Kim

IPC分类号： G08G1/00 ,  G01C21/00

CPC分类号： G08G1/096811 ,  G08G1/096816 ,  G08G1/096844 ,  G08G1/096861 ,  G08G1/096883

摘要： A method, device and recorded medium having recorded the method, for providing directions information applied with real-time traffic condition reports are disclosed. An aspect of the present invention features a method and device that can receive traffic condition reports in real-time and provide directions information applied with the pertinent traffic condition reports. Accordingly, with the present invention, the directions information can be generated by using first real-time traffic condition reports. Then, the path directions applied with the change of traffic condition reports according to the time flow can be acquired and provided to a user.

摘要翻译： 公开了一种记录方法的方法，装置和记录介质，用于提供应用实时交通状况报告的方向信息。 本发明的一个方面的特征在于可以实时接收交通状况报告并提供应用有关交通状况报告的方向信息的方法和装置。 因此，利用本发明，可以通过使用第一实时交通状况报告来生成方向信息。 然后，可以获取并根据时间流程提供应用于交通状况变化报告的路径方向并提供给用户。

公开(公告)号：US20090222587A1

公开(公告)日：2009-09-03

申请号：US12156566

申请日：2008-06-03

申请人： Byung-Ik Ahn ,  Won-Tae Kim ,  Myoung-Jin Shin

发明人： Byung-Ik Ahn ,  Won-Tae Kim ,  Myoung-Jin Shin

IPC分类号： G06F15/16

CPC分类号： H04L67/22 ,  H04L67/18 ,  H04W4/024

摘要： The server for providing location path, comprising: a server communication unit for interlocking with a mobile communication terminal and an E-mail reception server; a server control unit for receiving location path data and E-mail account information from the mobile communication terminal by controlling the server communication unit, creating location tracking data converted to a data format, which is supported by at least one or more predetermined navigation program, from the location path data, and transmitting the location tracking data to the E-mail reception server corresponding to the E-mail account information by controlling the server communication unit; and a server storage unit for storing at least one of the location path data, the E-mail account information, and the location tracking data.

摘要翻译： 用于提供位置路径的服务器，包括：用于与移动通信终端和电子邮件接收服务器互锁的服务器通信单元; 服务器控制单元，用于通过控制服务器通信单元从移动通信终端接收位置路径数据和电子邮件帐户信息，创建由至少一个或多个预定导航程序支持的转换为数据格式的位置跟踪数据， 并且通过控制服务器通信单元将位置跟踪数据发送到对应于电子邮件帐户信息的电子邮件接收服务器; 以及用于存储位置路径数据，电子邮件帐户信息和位置跟踪数据中的至少一个的服务器存储单元。

公开(公告)号：US06339255B1

公开(公告)日：2002-01-15

申请号：US09422799

申请日：1999-10-22

申请人： Myoung-Jin Shin

发明人： Myoung-Jin Shin

IPC分类号： H01L2302

CPC分类号： H01L24/49 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A stacked semiconductor chip package includes: a substrate including a plurality of conductive pads; a first semiconductor chip mounted on the substrate; and electrically connected to the conductive pads; a plurality of electrical leads provided about the substrate; a first molding part for sealing the substrate and the first semiconductor chip; a second semiconductor chip mounted on an upper surface of the first molding part and electrically connected to the electrical leads; and a second molding part for sealing the second semiconductor chip, the second conductive wires and a portion of the leads.

摘要翻译： 叠层半导体芯片封装包括：包括多个导电焊盘的衬底; 安装在所述基板上的第一半导体芯片; 并电连接到导电焊盘; 设置在所述基板周围的多个电引线; 用于密封所述基板和所述第一半导体芯片的第一模制部件; 第二半导体芯片，安装在第一成型部件的上表面上并电连接到电引线; 以及用于密封第二半导体芯片，第二导电线和引线的一部分的第二模制部件。

公开(公告)号：US06500698B2

公开(公告)日：2002-12-31

申请号：US09977313

申请日：2001-10-16

申请人： Myoung-Jin Shin

发明人： Myoung-Jin Shin

IPC分类号： H01L2148

CPC分类号： H01L24/49 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A stacked semiconductor chip package includes: a substrate including a plurality of conductive pads; a first semiconductor chip mounted on the substrate; and electrically connected to the conductive pads; a plurality of electrical leads provided about the substrate; a first molding part for sealing the substrate and the first semiconductor chip; a second semiconductor chip mounted on an upper surface of the first molding part and electrically connected to the electrical leads; and a second molding part for sealing the second semiconductor chip, the second conductive wires and a portion of the leads.

摘要翻译： 叠层半导体芯片封装包括：包括多个导电焊盘的衬底; 安装在所述基板上的第一半导体芯片; 并电连接到导电焊盘; 设置在所述基板周围的多个电引线; 用于密封所述基板和所述第一半导体芯片的第一模制部件; 第二半导体芯片，安装在第一成型部件的上表面上并电连接到电引线; 以及用于密封第二半导体芯片，第二导电线和引线的一部分的第二模制部件。